|
|
H3LIS331DLTR |
3 |
±400g |
195mg/digit |
数字 |
I2C, SPI |
15mg/√Hz |
表面贴装 |
TFLGA |
16 |
3 x 3 x 0.785mm |
3mm |
3mm |
0.785mm |
400kHz |
- |
|
|
MMA8653FCR1 |
3 |
±2 g, ±4 g, ±8 g |
64 LSB/g, 128 LSB/g, 256 LSB/g |
数字 |
串行 - I2C |
182µg/√Hz |
表面贴装 |
DFN |
10 |
2 x 2 x 0.95mm |
2mm |
2mm |
0.95mm |
400kHz |
- |
|
|
ADXL355BEZ |
3 |
2.048 g, 4.096 g, 8.192 g |
256000LSB/g |
数字 |
SPI |
25µg/√Hz |
表面贴装 |
LCC |
14 |
6.25 x 6.25 x 2.25 mm |
6.25mm |
6.25mm |
2.25mm |
1kHz |
- |
|
|
MMA8652FCR1 |
3 |
±2 g, ±4 g, ±8 g |
256 LSB/g, 512 LSB/g, 1024 LSB/g |
数字 |
串行 - I2C |
182µg/√Hz |
表面贴装 |
DFN |
10 |
2 x 2 x 0.95mm |
2mm |
2mm |
0.95mm |
400kHz |
- |
|
|
ADXL321JCP |
2 |
±18g |
63mV/g |
- |
- |
320µg/Hz rms |
表面贴装 |
LFCSP |
16 |
4 x 4 x 1.43mm |
4mm |
4mm |
1.43mm |
- |
- |
|
|
AD22284-A-R2 |
2 |
±35g |
28 35 (x) 57 75 (y)mV/g |
- |
- |
3.5 (x) 3 (y)µg/Hz rms |
表面贴装 |
CLCC |
8 |
5 x 5 x 1.98mm |
5mm |
5mm |
1.98mm |
- |
- |
|
|
SCA620-EF8H1A-004 |
1 |
±1.7g |
1.2V/g |
模拟 |
- |
5mV rms |
表面贴装 |
表面安装器件 |
8 |
10.48 x 8.36 x 5.08mm |
10.48mm |
8.36mm |
5.08mm |
80Hz |
- |
|
|
MMA3202KEG |
2 |
±100 g, ±50 g |
21 (x) mV/g, 42 (y) mV/g |
模拟 |
- |
110 (xy)µV/√Hz |
表面贴装 |
SOIC |
20 |
12.96 x 7.6 x 3.3mm |
12.96mm |
7.6mm |
3.3mm |
440Hz |
- |
|
|
LIS3DHTR |
3 |
±16 g, ±2 g, ±4 g, ±8 g |
12mg/digit |
模拟 |
I2C, SPI |
220µg/√Hz |
表面贴装 |
LGA |
16 |
3.15 x 3.15 x 1mm |
3.15 x 3.15 x 1mm |
4.15mm |
1mm |
- |
- |
|
|
2019 |
3 |
- |
4096Counts/g |
数字 |
I2C |
126µg/√Hz |
- |
模块 |
16 |
21 x 18 x 2mm |
21mm |
18mm |
2mm |
400kHz |
- |
|
|
SCA2110-D04-1 |
2 |
±2g |
- |
数字 |
SPI |
- |
表面贴装 |
表面安装器件 |
12 |
8.6 x 7 x 3.3mm |
8.6mm |
7mm |
3.3mm |
55Hz |
- |
|
|
LIS331HH |
3 |
±12 g, ±24 g, ±6 g |
12mg/LSB |
- |
- |
650µg/√Hz |
表面贴装 |
LGA |
16 |
3 x 3 x 1mm |
3mm |
3mm |
1mm |
- |
- |
|
|
ADXL354BEZ |
3 |
±2 g, ±4 g |
400mV/g |
模拟 |
模拟 |
20µg/√Hz |
表面贴装 |
LCC |
14 |
6.25 x 6.25 x 2.25 mm |
6.25mm |
6.25mm |
2.25mm |
1.5kHz |
- |
|
|
SCA3300-D01-1 |
3 |
±1.5 → ±6g |
1350 LSB/g, 2700 LSB/g, 5400 LSB/g |
- |
SPI |
- |
表面贴装 |
DFL/SMD |
12 |
8.6 x 7.6 x 3.3mm |
8.6mm |
7.6mm |
3.3mm |
88Hz |
- |
|
|
ADXRS642BBGZ |
3 |
±300°/s |
7mV/°/s |
模拟 |
- |
0.02°/s |
表面贴装 |
CBGA |
32 |
7.05 x 7.05 x 3.2mm |
7.05mm |
7.05mm |
3.2mm |
2000Hz |
- |
|
|
ADXL343BCCZ |
3 |
±16 g, ±2 g, ±4 g, ±8 g |
256LSB/g |
数字 |
串行-3 线、串行-4 线、串行-I2C、串行-SPI |
1.1LSB rms |
表面贴装 |
LGA |
14 |
3 x 5 x 1mm |
3mm |
5mm |
1mm |
200Hz |
- |
|
|
SCC2230-D08-05 |
3 |
±6g |
1962LSB/g |
数字 |
SPI |
- |
表面贴装 |
表面安装器件 |
24 |
15 x 8.5 x 4.15mm |
15mm |
8.5mm |
4.15mm |
60Hz |
- |
|
|
AD22301 |
1 |
±70g |
- |
模拟 |
- |
1800µg/√Hz |
表面贴装 |
LCC |
8 |
5 x 5 x 2.21mm |
5mm |
5mm |
2.21mm |
400Hz |
- |
|
|
SCA1000-N1000070-004 |
2 |
±4g |
0.55V/g |
模拟 |
SPI |
120µg/√Hz |
表面贴装 |
表面安装器件 |
12 |
15.59 x 8.39 x 5.2mm |
15.59mm |
8.39mm |
5.2mm |
170Hz |
- |
|
|
ADXL001-500BEZ |
1 |
±500g |
3.3mV/g |
模拟 |
- |
2.76mg/√Hz |
表面贴装 |
LCC |
8 |
5.28 x 5.28 x 2.08mm |
5.28mm |
5.28mm |
2.08mm |
32kHz |
- |
