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CA3140AMZ96 |
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表面贴装 |
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SOIC |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3140AMZ |
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表面贴装 |
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SOIC |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3130EZ |
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通孔 |
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PDIP |
双/单 |
1 |
8 |
6 → 15 V |
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±3 V, ±5 V |
30V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3140AMZ |
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表面贴装 |
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SOIC |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3140AMZ96 |
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表面贴装 |
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SOIC |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3140EZ |
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通孔 |
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PDIP |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3130EZ |
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通孔 |
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PDIP |
双/单 |
1 |
8 |
6 → 15 V |
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±3 V, ±5 V |
30V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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CA3140EZ |
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通孔 |
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PDIP |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
-55 °C |
125 °C |
100 dB |
无 |
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HA9P5002-5Z |
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表面贴装 |
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SOIC |
双 |
1 |
8 |
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±12 V, ±15 V, ±18 V, ±9 V |
1300V/µs |
0 °C |
75 °C |
0 dB |
无 |
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HA9P5002-5Z |
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表面贴装 |
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SOIC |
双 |
1 |
8 |
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±12 V, ±15 V, ±18 V, ±9 V |
1300V/µs |
0 °C |
75 °C |
0 dB |
无 |
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YRCNEZCUBE01 |
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- |
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编程器 |
- |
16 位，8 位 |
- |
- |
- |
- |
- |
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ICL7650SCPDZ |
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通孔 |
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斩波稳定 |
PDIP |
双/单 |
1 |
14 |
5 → 15 V |
2MHz |
±3 V, ±5 V |
2.5V/µs |
0 °C |
70 °C |
150 dB |
无 |
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DA14531-00FXDB-P |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14531 |
板 |
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DA14531MOD-00F1DB-P |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14531 |
板 |
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DA14531-00OGDB-P |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14531 |
板 |
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YRPBRL78L1A |
RL78 |
评估平台 |
MCU 16-位 |
RL78 |
- |
- |
RL78/L1A |
固定 |
板 |
- |
符合限制有害物质指令(RoHS)规范要求 |
4 周 |
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DA14586-00F02ATDB-P |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14586 |
板 |
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DA14531-00FXDEVKT-U |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14531 |
板 |
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DA14695-00HQDB-P |
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收发器; Bluetooth® 5 |
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- |
盒 |
2.4GHz |
DA14695 |
板 |
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DA14585-00ATDEVKT-B |
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收发器; Bluetooth® 5 |
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SmartBond™ |
盒 |
2.4GHz |
DA14585 |
板，电缆 |
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