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dsPIC33FJ64MC802-I/MM |
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- |
- |
- |
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表面贴装 |
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QFN-S |
28 |
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16Bit |
6 x 6 x 0.95mm |
-40 °C |
85 °C |
6mm |
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40MIPS |
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16Bit |
16 kB |
RISC |
64 kB |
闪存 |
|
3.3 V |
2 |
1 |
1 |
16Bit |
6 |
2, 6 |
2 |
6 x 10/12 位 |
10 bit, 12 bit |
1 |
6 |
2 x 16 位，4（16 位）6 x 16 位 |
5 x 16 位 |
16Bit |
5 |
0.95mm |
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AD7475ARMZ |
- |
12 |
1M |
1 |
单端 |
SPI，DSP |
S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.7 V ~ 5.25 V |
2.7 V ~ 5.25 V |
- |
-40°C ~ 85°C |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
8-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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2 |
256 |
I²C |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±30% |
650 ppm/°C |
200 |
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AD5252BRUZ1-RL7 |
- |
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电位计 |
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可选地址 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V |
±30% |
500 ppm/°C |
200 |
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AD8403ARZ50 |
- |
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电位计 |
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级联销 |
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
24-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
11 周 |
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1 |
128 |
上/下（U/D，CS） |
非易失 |
2.3 V ~ 5.5 V |
±8% |
35 ppm/°C |
70 |
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AD5111BCPZ10-500R7 |
- |
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电位计 |
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- |
-40°C ~ 125°C |
8-UFDFN 裸露焊盘，CSP |
8-LFCSP-UD（2x2） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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2.7 V ~ 5.5 V |
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WM8786GEDS/RV |
- |
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192k |
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-40°C ~ 85°C |
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ADC，音频 |
24 b |
模拟和数字 |
DSP，I²S |
表面贴装 |
20-SSOP（0.209"，5.30mm 宽） |
20-SSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
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I²C，串行 |
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1.7 V ~ 3.6 V |
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MAX11803ETC |
- |
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-40°C ~ 85°C |
12-WQFN 裸露焊盘 |
12-TQFN（4x4） |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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12 b |
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- |
- |
表面贴装 |
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DSPIC30F6012A-20E/PT |
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- |
- |
- |
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表面贴装 |
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TQFP |
64 |
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16Bit |
10 x 10 x 1.05mm |
-40 °C |
125 °C |
10mm |
|
20MHz |
|
16Bit |
8.192 kB |
RISC |
144 kB |
闪存 |
|
3 → 5.5 V |
2 |
2 |
1 |
16Bit |
8 |
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2 |
1（16 x 12 位） |
12Bit |
1 |
16 |
8 x 16 位 |
5 x 16 位 |
16Bit |
5 |
1.05mm |
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ADSP-21583BBCZ-4A |
SHARC |
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- |
- |
- |
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表面贴装 |
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BGA |
349 |
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32Bit |
19.1 x 19.1 x 1.11mm |
-40 °C |
110 °C |
19.1mm |
|
450MHz |
720MIPS |
32Bit |
384 kB |
RISC |
512 kB |
ROM |
固定点、浮点 |
1.1 V，3.3 V |
3 |
2 |
3 |
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1 |
3 |
3 |
1（8 x 12 位） |
12Bit |
1 |
8 |
1（3 通道） |
1（8 通道） |
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1 |
1.11mm |
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DSPIC33FJ256GP506-I/PT |
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- |
- |
- |
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表面贴装 |
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TQFP |
64 |
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16Bit |
10 x 10 x 1.05mm |
-40 °C |
85 °C |
10mm |
|
40MHz |
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16Bit |
16 kB |
改进型哈佛 |
256 kB |
闪存 |
|
3.3 V |
2 |
1 |
2 |
16Bit |
1 |
8 |
2 |
18 通道 x 10 位、18 通道 x 12 位 |
10 bit, 12 bit |
1 |
18 |
1（8 x 16 位） |
9 x 16 位 |
16Bit |
9 |
1.05mm |
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ADSP-BF537BBCZ-5B |
Blackfin |
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- |
- |
- |
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表面贴装 |
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CSP BGA |
208 |
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16Bit |
17 x 17 x 1.26mm |
-40 °C |
85 °C |
17mm |
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500MHz |
500MIPS |
16Bit |
32 kB |
改进型哈佛 |
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ROM，SRAM |
固定点 |
1.2 V，2.5 V，3.3 V |
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1.26mm |
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AD7911ARMZ-REEL7 |
- |
10 |
250k |
2 |
单端 |
SPI，DSP |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
电源 |
2.35 V ~ 5.25 V |
2.35 V ~ 5.25 V |
- |
-40°C ~ 85°C |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
8-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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1 |
120ns |
Current - Unbuffered |
是 |
±1（最大），-1/ 2（最大） |
AD5445YCPZ |
- |
12 |
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并联 |
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R-2R |
外部 |
2.5 V ~ 5.5 V |
2.5 V ~ 5.5 V |
|
-40°C ~ 125°C |
20-WFQFN 裸露焊盘，CSP |
20-LFCSP-WQ（4x4） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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1 |
1024 |
SPI |
非易失 |
2.7 V ~ 5.5 V，±2.5 V ~ 2.75 V |
±1% |
5 ppm/°C |
35 |
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AD5270BRMZ-50 |
- |
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变阻器 |
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级联销 |
-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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2 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V，±2.2 V ~ 2.7 V |
±30% |
500 ppm/°C |
50 |
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AD5207BRUZ10-RL7 |
- |
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电位计 |
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级联销 |
-40°C ~ 125°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
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4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V |
±33% |
700 ppm/°C |
200 |
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AD8403AR1 |
- |
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电位计 |
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级联销 |
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
24-SOIC |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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SPI |
|
2.2 V ~ 5.25 V |
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TSC2046EIPWG4 |
- |
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-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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12 b |
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内部 |
780µA |
表面贴装 |
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AD7569BNZ |
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- |
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- |
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8 位 |
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通孔 |
1 |
1 |
200kHz |
46dB |
4µs |
PDIP |
24 |
±2LSB |
双，单 |
±5.25V |
6.61mm |
31.9 x 6.61 x 3.3mm |
-40 °C |
85 °C |
31.9mm |
- |
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ADSP-BF512BBCZ-4F4 |
Blackfin |
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- |
- |
- |
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表面贴装 |
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BGA |
168 |
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16 bit, 32 bit |
12.1 x 12.1 x 1.12mm |
-40 °C |
85 °C |
12.1mm |
|
400MHz |
|
16 bit, 32 bit |
16（指令 SRAM 缓存）kB，32（指令 SRAM/数据 SRAM/数据 SRAM 缓存）kB |
RISC |
4M 位 |
闪存 |
MAC |
1.14 → 1.47 V |
2 |
|
2 |
16 bit, 32 bit |
2 |
8 |
2 |
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8 x 32 位 |
8 x 32位 |
32Bit |
8 |
1.12mm |
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TMS320VC5502PGF300 |
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- |
- |
- |
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表面贴装 |
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LQFP |
176 |
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32Bit |
24 x 24 x 1.4mm |
-40 °C |
85 °C |
24mm |
|
300MHz |
600MIPS |
32Bit |
64 kB |
|
32 kB |
DARAM，ROM |
固定点 |
1.26 V, 3.3 V |
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1.4mm |
