|
|
MCP2122-E/SN |
|
|
|
|
|
|
表面贴装 |
SOIC |
8 |
|
|
单 |
|
|
3.9mm |
4.9 x 3.9 x 1.25mm |
-40 °C |
125 °C |
4.9mm |
- |
- |
- |
|
|
MCP2122-E/SN |
|
|
|
|
|
|
表面贴装 |
SOIC |
8 |
|
|
单 |
|
|
3.9mm |
4.9 x 3.9 x 1.25mm |
-40 °C |
125 °C |
4.9mm |
- |
- |
- |
|
|
MCP2120-I/SL |
|
|
|
|
|
|
表面贴装 |
SOIC |
14 |
|
|
|
|
|
3.9mm |
8.65 x 3.9 x 1.25mm |
-40 °C |
85 °C |
8.65mm |
- |
- |
- |
|
|
TIR1000PS |
|
|
|
|
|
|
表面贴装 |
SOP |
8 |
|
|
|
|
|
5.3mm |
6.2 x 5.3 x 1.95mm |
0 °C |
70 °C |
6.2mm |
- |
- |
- |
|
|
MCP2140-I/P |
|
|
|
|
|
|
通孔 |
PDIP |
18 |
|
|
单 |
3 → 5.5 V |
|
6.6mm |
22.99 x 6.6 x 3.68mm |
-40 °C |
85 °C |
22.99mm |
- |
- |
- |
|
|
TIR1000PS |
|
|
|
|
|
|
表面贴装 |
SOP |
8 |
|
|
|
|
|
5.3mm |
6.2 x 5.3 x 1.95mm |
0 °C |
70 °C |
6.2mm |
- |
- |
- |
|
|
MCP2150-I/P |
|
|
|
|
|
|
通孔 |
PDIP |
18 |
|
|
单 |
3 → 5.5 V |
|
6.6mm |
22.99 x 6.6 x 3.68mm |
-40 °C |
85 °C |
22.99mm |
- |
- |
- |
|
|
AD5592RBRUZ |
1 |
8 |
400ksps |
12 位 |
81dB |
6µs |
表面贴装 |
TSSOP |
16 |
±1 (DAC) LSB, ±2 (ADC) LSB |
0.3%FSR |
单 |
2.7 → 5.5 V |
|
4.5mm |
5.1 x 4.5 x 1.05mm |
-40 °C |
105 °C |
5.1mm |
- |
- |
- |
|
|
AD5593RBRUZ |
1 |
8 |
10kHz |
12 位 |
81dB |
6µs |
表面贴装 |
TSSOP |
16 |
±1 (DAC) LSB, ±2 (ADC) LSB |
0.3%FSR |
单 |
2.7 → 5.5 V |
|
4.5mm |
5.1 x 4.5 x 1.05mm |
-40 °C |
105 °C |
5.1mm |
- |
- |
- |
|
|
LTC1392CS8#PBF |
1 |
|
|
10 位 |
|
|
表面贴装 |
SOIC |
8 |
|
±25LSB |
单 |
4.5 → 6 V |
|
3.98mm |
5 x 3.98 x 1.49mm |
0 °C |
70 °C |
5mm |
- |
- |
- |
|
|
AD5592RBRUZ |
1 |
8 |
400ksps |
12 位 |
81dB |
6µs |
表面贴装 |
TSSOP |
16 |
±1 (DAC) LSB, ±2 (ADC) LSB |
0.3%FSR |
单 |
2.7 → 5.5 V |
|
4.5mm |
5.1 x 4.5 x 1.05mm |
-40 °C |
105 °C |
5.1mm |
- |
- |
- |
|
|
AD5593RBRUZ |
1 |
8 |
10kHz |
12 位 |
81dB |
6µs |
表面贴装 |
TSSOP |
16 |
±1 (DAC) LSB, ±2 (ADC) LSB |
0.3%FSR |
单 |
2.7 → 5.5 V |
|
4.5mm |
5.1 x 4.5 x 1.05mm |
-40 °C |
105 °C |
5.1mm |
- |
- |
- |
|
|
LTC1392CS8#PBF |
1 |
|
|
10 位 |
|
|
表面贴装 |
SOIC |
8 |
|
±25LSB |
单 |
4.5 → 6 V |
|
3.98mm |
5 x 3.98 x 1.49mm |
0 °C |
70 °C |
5mm |
- |
- |
- |
|
|
LTC1091CN8#PBF |
1 |
|
|
10 位 |
|
|
通孔 |
PDIP |
8 |
|
±2LSB |
单 |
4.5 → 10 V |
|
6.47mm |
10.16 x 6.47 x 3.3mm |
-40 °C |
85 °C |
10.16mm |
- |
- |
- |
|
|
LTC1290DCSW#PBF |
1 |
1 |
|
12 位 |
74dB |
13µs |
表面贴装 |
SOIC |
20 |
±0.75LSB |
1LSB |
双，单 |
5 V |
±5V |
10.643mm |
13.005 x 10.643 x 2.337mm |
0 °C |
70 °C |
13.01mm |
- |
- |
- |
|
|
ADAQ7988BCCZ |
1 |
|
|
16 位 |
|
|
表面贴装 |
LGA |
24 |
±20ppm |
|
双，单 |
|
|
4.1mm |
5.1 x 4.1 x 2.08mm |
-55 °C |
125 °C |
5.1mm |
- |
- |
- |
|
|
LTC1091CN8#PBF |
1 |
|
|
10 位 |
|
|
通孔 |
PDIP |
8 |
|
±2LSB |
单 |
4.5 → 10 V |
|
6.47mm |
10.16 x 6.47 x 3.3mm |
-40 °C |
85 °C |
10.16mm |
- |
- |
- |
|
|
AD7606BSTZ-4 |
1 |
|
200ksps |
16 位 |
95.5dB |
80µs |
表面贴装 |
LQFP |
64 |
±2LSB |
±32LSB |
单 |
5 V |
|
10.2mm |
10.2 x 10.2 x 1.45mm |
-40 °C |
85 °C |
10.2mm |
- |
- |
- |
|
|
AD7605-4BSTZ |
1 |
|
300ksps |
16 位 |
90dB |
80µs |
表面贴装 |
LQFP |
64 |
±2LSB |
±32LSB |
单 |
2.5 → 5 V |
|
10.2mm |
10.2 x 10.2 x 1.45mm |
-40 °C |
85 °C |
10.2mm |
- |
- |
- |
|
|
ADAQ7988BCCZ |
1 |
|
|
16 位 |
|
|
表面贴装 |
LGA |
24 |
±20ppm |
|
双，单 |
|
|
4.1mm |
5.1 x 4.1 x 2.08mm |
-55 °C |
125 °C |
5.1mm |
- |
- |
- |
