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2.4 V ~ 3.7 V |
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ADE7566ASTZF8-RL |
- |
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-40°C ~ 85°C |
64-LQFP |
表面贴装 |
64-LQFP（10x10） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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4mA |
770 千欧 |
0.1% |
1.3V，2V，2.4V |
0.4V，0.8V |
单相 |
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ROMLess |
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ADSP-2191MBSTZ-140 |
ADSP-21xx |
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表面贴装 |
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- |
- |
- |
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LQFP |
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144 |
20 x 20 x 1.45mm |
20mm |
16Bit |
1.45mm |
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-40 °C |
85 °C |
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40MHz |
140MIPS |
16Bit |
160 kB |
DSP |
MAC |
2.37 → 2.63 V，2.97 → 3.6 V |
2 |
2 |
1 |
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ARM7® |
16/32-位 |
41.78MHz |
EBI/EMI，I²C，SPI，UART/USART |
POR，PWM，WDT |
126KB（63K x 16） |
闪存 |
- |
8K x 32 |
A/D 10x12b；D/A 2x12b |
内部 |
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ADUC7124BCPZ126 |
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2.7 V ~ 3.6 V |
|
-40°C ~ 125°C（TA） |
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64-LFCSP-VQ（9x9） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
MicroConverter |
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64-VFQFN 裸露焊盘，CSP |
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1 x 1:1 |
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ADG3243BRJZ-REEL7 |
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- |
- |
- |
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SOT-23 |
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8 |
2.9 x 1.6 x 1.3mm |
2.9mm |
2Bit |
1.3mm |
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-40 °C |
85 °C |
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CMOS |
2 |
1 |
1 |
28Ω |
1µA |
225 ps @ 50 pF |
50pF |
2Bit |
3.3 V |
2.5 V |
2 |
2 |
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ADIS16003CCCZ |
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表面贴装 |
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- |
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- |
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LGA |
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2 |
±1.7g |
885LSB/g |
- |
110mg/Hz rms |
12 |
7.33 x 7.33 x 3.6mm |
7.33mm |
7.33mm |
3.6mm |
- |
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ADN4655BRWZ |
iCoupler® |
LVDS |
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-40°C ~ 125°C |
20-SOIC（0.295\，7.50mm 宽） |
表面贴装型 |
20-SOIC |
管件 |
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磁耦合 |
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无 |
2 |
1/1 |
单向 |
5000Vrms |
25kV/µs |
1.25Gbps |
4.5ns，4.5ns |
- |
0.35ns，0.35ns（最大） |
2.375V ~ 2.625V |
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SSM3302ACPZ-RL |
- |
D 类 |
2 通道（立体声） |
36.6W x 1 @ 2 欧姆；24W x 2 @ 4 欧姆 |
7 V ~ 18 V |
消除爆音，差分输入，短路和热保护，关闭 |
-40°C ~ 85°C（TA） |
40-WFQFN 裸露焊盘，CSP |
表面贴装 |
40-LFCSP-WQ（6x6） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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录音机，机顶盒 |
ADV7523ABCBZ-P-1RL |
- |
HDMI，DVI 发射器 |
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49-WLCSP |
表面贴装 |
49-WLCSP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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2.5 V ~ 5.5 V |
5mV @ 2.5V |
5µA @ 2.5V |
50mA |
4mA |
50dB CMRR，50dB PSRR |
5ns |
|
ADCMP600BKSZ-R2 |
- |
通用 |
CMOS，TTL |
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|
-40°C ~ 125°C |
5-TSSOP，SC-70-5，SOT-353 |
表面贴装 |
SC-70-5 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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SPI |
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1.6 V ~ 3.6 V |
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AD7889ACBZ-RL |
- |
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-40°C ~ 85°C |
12-UFBGA，WLCSP |
表面贴装 |
12-WLCSP（1.51x2.01） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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12 b |
外部 |
10nA |
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AD5541ARZ |
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表面贴装 |
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- |
- |
- |
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SOIC |
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16 位 |
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8 |
5 x 4 x 1.5 mm |
5 mm |
4 mm |
1.5 mm |
|
1 |
串行 (SPI/QSPI/Microwire) |
单 |
1.5Msps |
5 V |
外部 |
R-2R，电阻串 |
1µs |
单极 |
±7LSB |
±4LSB |
-40 °C |
85 °C |
- |
- |
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电位计 |
2 |
256 |
I²C |
易失 |
-20%， 55% |
35 ppm/°C |
160 |
2.7 V ~ 5.5 V |
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AD5243BRMZ50-RL7 |
- |
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|
- |
-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
|
10-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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ADV7527BCBZ-P-RL |
* |
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- |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
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AD561KNZ |
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通孔 |
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- |
- |
- |
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PDIP |
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10 位 |
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16 |
22.1 x 6.35 x 4.57 mm |
22.1 mm |
6.35 mm |
4.57 mm |
|
1 |
并行 |
单 |
|
4.5 → 16.5 V |
外部 |
R-2R |
250ns |
双极，单极 |
±0.1%FSR |
|
0 °C |
70 °C |
- |
- |
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电位计 |
4 |
256 |
I²C |
非易失 |
±8% |
35 ppm/°C |
55 |
2.3 V ~ 5.5 V，±2.25 V ~ 2.75 V |
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|
AD5144ABRUZ10-RL7 |
- |
|
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|
|
可选地址 |
-40°C ~ 125°C |
20-TSSOP（0.173"，4.40mm 宽） |
|
20-TSSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
19 周 |
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ADBF518WBBCZ402 |
|
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|
-40°C ~ 85°C（TA） |
|
表面贴装 |
168-CSPBGA（12x12） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
Blackfin® |
定点 |
以太网，I²C，PPI，RSI，SPI，SPORT，UART/USART |
400MHz |
外部 |
116kB |
1.30V |
168-LFBGA，CSPBGA |
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ADN4651BRSZ-RL7 |
iCoupler® |
LVDS |
|
|
|
|
-40°C ~ 125°C |
20-SSOP（0.209\，5.30mm 宽） |
表面贴装型 |
20-SSOP |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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磁耦合 |
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无 |
2 |
1/1 |
单向 |
3750Vrms |
25kV/µs |
600Mbps |
4.5ns，4.5ns |
- |
0.35ns，0.35ns（最大） |
2.375V ~ 2.625V |
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AD7390ARZ |
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表面贴装 |
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SOIC |
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12 位 |
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8 |
5 x 4 x 1.5 mm |
5 mm |
4 mm |
1.5 mm |
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1 |
串行 (SPI/QSPI) |
单 |
17ksps |
3 V, 5 V |
外部 |
R-2R，电阻串 |
70µs |
单极 |
±20mV |
±2LSB |
-40 °C |
85 °C |
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- |
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AD6636CBCZ |
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AD6636CBCZ |
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256-CSPBGA（17x17） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
AD6636 |
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手机，CDMA2000，EDGE，GPRS，GSM |
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降频变频器 |
450mA |
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专业视频 |
MAX9406ETM T |
- |
表面贴装型 |
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48-WFQFN 裸露焊盘 |
表面贴装型 |
48-TQFN（7x7） |
卷带（TR） |
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3.0V ~ 3.6V |
转换器，电平位移器 |
- |
I²C |
