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AD5602YKSZ-2500RL7 |
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表面贴装 |
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- |
- |
- |
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SC-70 |
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6 |
2.2 x 1.35 x 1 mm |
2.2 mm |
1.35 mm |
1 mm |
|
8 位 |
1 |
串行 |
单 |
1.7Msps |
2.7 → 5.5 V |
|
电阻串 |
10µs |
双极 |
0.5mV |
±0.5LSB |
-40 °C |
125 °C |
- |
- |
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AD632AD |
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14-CDIP |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
模拟乘法器/除法器 |
四象限 |
- |
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14-CDIP（0.300"，7.62mm） |
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AD5601BKSZ-500RL7 |
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表面贴装 |
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- |
- |
- |
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SC-70 |
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6 |
2.2 x 1.35 x 1 mm |
2.2 mm |
1.35 mm |
1 mm |
|
8 位 |
1 |
串行 （SPI） |
单 |
|
2.7 → 5.5 V |
内部 |
电阻串 |
10µs |
双极 |
±0.5mV |
±0.5LSB |
-40 °C |
125 °C |
- |
- |
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AD7524JRZ |
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表面贴装 |
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- |
- |
- |
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SOIC |
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16 |
10 x 4 x 1.5 mm |
10 mm |
4 mm |
1.5 mm |
|
8 位 |
1 |
并行 |
单 |
4Msps |
9 V，12 V |
外部 |
R-2R，电阻串 |
0.5µs |
|
±3.5LSB |
±0.5LSB |
-40 °C |
85°C |
- |
- |
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AD537KD |
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通孔 |
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- |
- |
- |
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SBCDIP |
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14 |
19.94 x 7.87 x 3.56mm |
19.94mm |
7.87mm |
3.56mm |
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双，单 |
|
5 V，9 V，12 V，15 V，18 V，24 V，28 V |
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0 °C |
70 °C |
- |
- |
VFC |
非同步 |
150kHz |
±0.1%FSR |
±12 V, ±15 V, ±9 V |
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ROM，SRAM |
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ADSP-BF533SBBZ500 |
Blackfin |
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表面贴装 |
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- |
- |
- |
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BGA |
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169 |
19 x 19 x 1.73mm |
19mm |
16Bit |
1.73mm |
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-40 °C |
85 °C |
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500MHz |
500MIPS |
16Bit |
|
改进型哈佛 |
固定点 |
1.2 V, 1.8 V, 2.5 V, 3.3 V |
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ROMLess |
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ADSP-BF607KBCZ-5 |
Blackfin |
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表面贴装 |
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- |
- |
- |
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CSP BGA |
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349 |
19.1 x 19.1 x 1.11mm |
19.1mm |
32Bit |
1.11mm |
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0 °C |
70 °C |
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500MHz |
|
32Bit |
256 kB |
改进型哈佛 |
MAC |
3.3 V |
2 |
1 |
16Bit |
2 |
2 |
1 x OTG |
2 |
1 |
1 |
2 x 16 位 |
8 x 32位 |
32Bit |
8 |
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I²C |
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ADP5587ACPZ-R7 |
- |
|
开路漏极 |
|
|
键盘控制器，POR |
-40°C ~ 85°C |
24-WFQFN 裸露焊盘，CSP |
表面贴装型 |
24-LFCSP-WQ（4x4） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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是 |
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18 |
- |
400 kHz |
1.65V ~ 3.6V |
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SSM4321ACBZ-RL |
- |
D 类 |
1-通道（单声道） |
3.77W x 1 @ 3 欧姆 |
2.5 V ~ 5.5 V |
消除爆音，短路保护和热保护，关闭 |
-40°C ~ 85°C（TA） |
16-UFBGA，WLCSP |
表面贴装 |
16-WLCSP（1.74x1.74） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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HDTV |
ADV7630KSVZ |
- |
分线器 |
|
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|
128-TQFP 裸露焊盘 |
表面贴装 |
128-TQFP-EP（14x14） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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|
±4.75 V ~ 5.25 V |
2mV @ -5.2V，5V |
3µA @ -5.2V，5V |
30mA |
5mA，28mA，13mA |
80dB CMRR，85dB PSRR |
0.83ns |
|
ADCMP562BRQZ |
- |
带锁销 |
补充型，差分，开路发射极，PECL |
|
|
|
-40°C ~ 85°C |
20-SSOP（0.154"，3.90mm 宽） |
表面贴装 |
20-QSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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16 |
250k |
1 |
个伪差分 |
SPI，DSP |
S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.3 V ~ 5.5 V |
2.3 V ~ 5.5 V |
|
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|
AD7685BCPZRL7 |
PulSAR |
|
|
|
|
- |
-40°C ~ 85°C |
10-WFDFN 裸露焊盘，CSP |
|
10-LFCSP-WD（3x3） |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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1 |
256 |
SPI |
易失 |
±20% |
45 ppm/°C |
50 |
|
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|
电位计 |
|
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|
|
2.7 V ~ 5.5 V |
|
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|
|
AD5160BRJZ5-RL7 |
- |
|
|
|
|
- |
-40°C ~ 125°C |
SOT-23-8 |
|
SOT-23-8 |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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4 |
256 |
SPI |
易失 |
±33% |
700 ppm/°C |
200 |
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|
电位计 |
|
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|
|
2.7 V ~ 5.5 V |
|
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|
AD8403ARZ1 |
- |
|
|
|
|
级联销 |
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
|
24-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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|
HD 视频 |
AD8120ACPZ-R7 |
- |
视频延迟线 |
|
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|
|
|
32-VFQFN 裸露焊盘，CSP |
表面贴装 |
32-LFCSP-VQ（5x5） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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2 |
256 |
SPI |
非易失 |
-40%， 20% |
600 ppm/°C |
200 |
|
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|
|
电位计 |
|
|
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|
|
|
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
|
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|
|
AD5232BRU10-REEL7 |
- |
|
|
|
|
级联销 |
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
|
16-TSSOP |
标准卷带 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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|
ARM7® |
16/32-位 |
10MHz |
I²C，SPI，UART/USART |
POR，PWM，温度传感器，WDT |
32KB（16K x 16） |
闪存 |
- |
1K x 32 |
A/D 5x24b，8x24b，D/A 1x14b |
内部 |
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|
ADUC7061BCPZ32-RL |
|
|
|
|
2.375 V ~ 2.625 V |
|
-40°C ~ 125°C（TA） |
|
|
32-LFCSP-VQ（5x5） |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
|
|
MicroConverter |
|
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|
|
32-VFQFN 裸露焊盘，CSP |
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ADSP-21262SKSTZ200 |
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0°C ~ 70°C（TA） |
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表面贴装 |
144-LQFP（20x20） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
18 周 |
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SHARC® |
浮点 |
DAI，SPI |
200MHz |
ROM（512 kB） |
256kB |
1.20V |
144-LQFP |
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ADXL330KCPZ |
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表面贴装 |
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- |
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- |
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LFCSP |
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3 |
±3g |
330mV/g |
- |
280 (xy) 350 (z)µg/Hz rms |
16 |
4 x 4 x 1.43mm |
4mm |
4mm |
1.43mm |
- |
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ADAS1000-2BCPZ |
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56-LFCSP-VQ（9x9） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
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- |
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56-VFQFN 裸露焊盘，CSP |
5 |
- |
1.71 V ~ 1.89 V |
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