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MX25L6445EMI-10G |
MX25xxx45 - MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
300µs,5ms |
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SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
16-SOIC(0.295",7.50mm 宽) |
16-SOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29LV640EBTI-70G |
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表面贴装 |
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64Mbit |
并行 |
TSOP |
48 |
4M x 16 位,8M x 8 位 |
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2.7 V |
3.6 V |
4M, 8M |
4 |
70ns |
8 bit, 16 bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
18.5mm |
1.05mm |
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MX25V4006EM1I-13G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
50µs,1ms |
- |
SPI |
2.35 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.154",3.90mm 宽) |
8-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L2006EM1I-12G |
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表面贴装 |
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- |
- |
- |
2Mbit |
串行 |
SOP |
8 |
1M x 2 位,2M x 1 位 |
NOR |
2.7 V |
3.6 V |
1M, 2M |
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1 bit, 2 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX25U4033EM2I-12G |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
30µs,3ms |
- |
SPI |
1.65 V ~ 2 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29F400CBMI-70G |
MX29F |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
70ns |
70ns |
并联 |
4.5 V ~ 5.5 V |
-40°C ~ 85°C(TA) |
表面贴装 |
44-SOIC(0.496",12.60mm 宽) |
44-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29LV800CBTI-70G |
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表面贴装 |
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- |
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8Mbit |
并行 |
TSOP |
48 |
1M x 8 位,512K x 16 位 |
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2.7 V |
3.6 V |
1M, 512K |
4 |
70ns |
8 bit, 16 bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
18.5mm |
1.05mm |
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MX29F040CQI-70G |
MX29F |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
70ns |
70ns |
并联 |
4.5 V ~ 5.5 V |
-40°C ~ 85°C(TA) |
表面贴装 |
32-LCC(J 形引线) |
32-PLCC(11.43x14.05) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L8006EZNI-12G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
8Mb (1M x 8) |
50µs,3ms |
- |
SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25V4006EM1I-13G |
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表面贴装 |
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- |
- |
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4Mbit |
串行 |
SOP |
8 |
2M x 2 位,4M x 1 位 |
NOR |
2.35 V |
3.6 V |
2M, 4M |
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1 bit, 2 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX29LV800CBTI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
8Mb (1M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25U8035EZUI-10G |
MX25xxx35/36 - MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
8Mb (1M x 8) |
30µs,3ms |
- |
SPI |
1.65 V ~ 2 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UDFN 裸露焊盘 |
8-USON(4x4) |
- |
符合限制有害物质指令(RoHS)规范要求 |
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MX25L512EMI-10G |
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表面贴装 |
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512Kbit |
串行 |
SOP |
8 |
256k x 2 位 |
NOR |
2.7 V |
3.6 V |
256K |
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1 bit, 2 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX29LV160DTTI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
16Mb (2M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L1006EZUI-10G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
1Mb (128K x 8) |
50µs,3ms |
- |
SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UFDFN 裸露焊盘 |
8-USON(2x3) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25R3235FM1IL0 |
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表面贴装 |
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32Mbit |
串行 |
SOP |
8 |
16M x 2 位,32M x 1 位,8M x 4 位 |
NOR |
1.65 V |
3.6 V |
8M, 16M, 32M |
8 |
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1 bit, 2 bit, 4 bit |
5.38 x 5.33 x 1.91mm |
5.33mm |
-40 °C |
85 °C |
5.38mm |
1.91mm |
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MX25R4035FZUIL0 |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
100µs,10ms |
- |
SPI |
1.65 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UFDFN 裸露焊盘 |
8-USON(2x3) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L8006EM1I-12G |
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表面贴装 |
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- |
- |
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8Mbit |
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SOP |
8 |
4M x 2 位,8M x 1 位 |
NOR |
1.65 V |
3.6 V |
4M, 8M |
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1 bit, 2 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX25L2006EZNI-12G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
2Mb (256K x 8) |
50µs,3ms |
- |
SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L12835FMI-10G |
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表面贴装 |
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128Mbit |
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SOP |
16 |
128M x 1 位,32M x 4 位,64M x 2 位 |
NOR |
2.7 V |
3.6 V |
32M, 64M, 128M |
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1 bit, 2 bit, 4 bit |
10.5 x 7.6 x 2.45mm |
7.6mm |
-40 °C |
85 °C |
10.5mm |
2.45mm |
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