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表面贴装型 |
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VIPer™ plus |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
隔离 |
是 |
800V |
反激 |
14 V |
8.5V ~ 23.5V |
70% |
60kHz |
10 W |
限流，超温，过压 |
- |
-40°C ~ 150°C（TJ） |
16-SOIC（0.154\，3.90mm 宽） |
16-SO |
VIPER17LDTR |
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通孔 |
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VIPer™ plus |
管件 |
任意一种 |
是 |
800V |
降压，反激 |
13 V |
11.5V ~ 23.5V |
70% |
60kHz |
8 W |
限流，开环，超温 |
- |
-40°C ~ 150°C（TJ） |
8-DIP（0.300\，7.62mm），7 引线 |
7-DIP |
VIPER06LN |
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表面贴装型 |
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VIPER™ |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
非隔离 |
是 |
800V |
升压，降压，降压升压，反激 |
8 V |
4.5V ~ 30V |
- |
30kHz |
1 W |
过载，超温，过压，短路 |
软启动 |
-40°C ~ 150°C（TJ） |
16-SOIC（0.154\，3.90mm 宽） |
16-SO |
VIPER318XDTR |
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通孔 |
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VIPer™ plus |
管件 |
隔离 |
是 |
800V |
反激 |
14 V |
8.5V ~ 23.5V |
70% |
60kHz |
10 W |
限流，超温，过压 |
- |
-40°C ~ 150°C（TJ） |
8-DIP（0.300\，7.62mm），7 引线 |
8-DIP |
VIPER17LN |
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表面贴装型 |
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- |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
任意一种 |
是 |
730V |
降压，降压升压，反激 |
13 V |
11.5V ~ 23.5V |
80% |
60kHz |
11 W |
限流，短路 |
- |
-40°C ~ 150°C（TJ） |
10-SOP（0.154\，3.90mm 宽） |
10-SSOP |
VIPER122LSTR |
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表面贴装型 |
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- |
管件 |
隔离 |
是 |
800V |
反激 |
14 V |
8.5V ~ 23.5V |
- |
225kHz |
22 W |
限流，超温，过压，短路 |
- |
-40°C ~ 150°C（TJ） |
16-SOIC（0.154\，3.90mm 宽） |
16-SO |
VIPER35HD |
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-40 °C |
105 °C |
BLUENRG-132 |
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ARM Cortex |
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表面贴装 |
QFN |
32 |
5 x 5 x 0.95mm |
5mm |
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- |
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3.6 V |
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Bluetooth |
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1.7 V |
- |
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-40 °C |
105 °C |
BLUENRG-232 |
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蓝牙 |
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表面贴装 |
QFN32 |
32 |
5 x 5 x 0.95mm |
5mm |
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- |
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3.6 V |
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微控制器 |
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1.7 V |
- |
- |
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-40 °C |
105 °C |
BLUENRG-232 |
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蓝牙 |
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表面贴装 |
QFN32 |
32 |
5 x 5 x 0.95mm |
5mm |
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3.6 V |
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微控制器 |
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1.7 V |
- |
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-40 °C |
105 °C |
BLUENRG-132 |
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ARM Cortex |
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表面贴装 |
QFN |
32 |
5 x 5 x 0.95mm |
5mm |
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- |
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3.6 V |
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Bluetooth |
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1.7 V |
- |
- |
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-40 °C |
105 °C |
STLUX385ATR |
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SMED |
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表面贴装 |
TSSOP |
38 |
9.8 x 4.5 x 1.05mm |
9.8mm |
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5.5 V |
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微控制器 |
照明，功率测量 |
3 V |
- |
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85 °C |
STA8088EXG |
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TFBGA |
169 |
9.15 x 9.15 x 1.2mm |
9.15mm |
9.15mm |
1.2mm |
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3.6 V |
- |
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85 °C |
STA680Q |
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LQFP |
144 |
20.2 x 20.2 x 1.45mm |
20.2mm |
20.2mm |
1.45mm |
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FM |
- |
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1.26 V |
- |
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85 °C |
STA680 |
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LFBGA |
168 |
12.15 x 12.15 x 1.4mm |
12.15mm |
12.15mm |
1.4mm |
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FM |
- |
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1.26 V |
- |
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85 °C |
STA680 |
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LFBGA |
168 |
12.15 x 12.15 x 1.4mm |
12.15mm |
12.15mm |
1.4mm |
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FM |
- |
- |
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1.26 V |
- |
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85 °C |
STS1TXQTR |
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表面贴装 |
QFN |
20 |
4.15 x 4.15 x 0.95mm |
4.15mm |
4.15mm |
0.95mm |
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ASK, FSK, GFSK, GMSK, MSK, OOK |
348MHz |
470MHz |
956MHz |
3.6 V |
300MHz |
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13 dB, 19 dB |
0.2 dB, 0.5 dB |
5.85GHz |
2400MHz |
-30 °C |
85 °C |
DCPL-WB-02D3 |
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表面贴装 |
倒装焊芯片 |
8 |
1.67 x 1.44 x 0.43mm |
1.67mm |
1.44mm |
0.43mm |
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H3LIS331DLTR |
3 |
±400g |
195mg/digit |
数字 |
I2C, SPI |
15mg/√Hz |
表面贴装 |
TFLGA |
16 |
3 x 3 x 0.785mm |
3mm |
3mm |
0.785mm |
400kHz |
- |
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LIS3DHTR |
3 |
±16 g, ±2 g, ±4 g, ±8 g |
12mg/digit |
模拟 |
I2C, SPI |
220µg/√Hz |
表面贴装 |
LGA |
16 |
3.15 x 3.15 x 1mm |
3.15 x 3.15 x 1mm |
4.15mm |
1mm |
- |
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LIS331HH |
3 |
±12 g, ±24 g, ±6 g |
12mg/LSB |
- |
- |
650µg/√Hz |
表面贴装 |
LGA |
16 |
3 x 3 x 1mm |
3mm |
3mm |
1mm |
- |
- |
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