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- |
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MSP-GANG |
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- |
- |
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MSP-GANG 量产编程器 |
MSP430 闪存设备 |
串行 RS-232，UART，USB |
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14-CDIP（0.300"，7.62mm） |
14-CDIP |
- |
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AD537SD/883B |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
10 周 |
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通孔 |
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管件 |
- |
电压至频率 |
100kHz |
±30ppm/°C |
±0.05% |
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SOMAM3703-20-1780AGCR |
MPU 코어 |
ARM® Cortex®-A8，AM3703 |
- |
800MHz |
512MB |
256MB |
板对板（BTB） 插座 - 200 |
0.59" x 1.06"（15mm x 27mm） |
0°C ~ 70°C |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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DMA，POR，WDT |
音频编解码器，存储卡，串行声音，SCI，SIO，SPI，SSI |
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- |
32-位 |
75 |
- |
ROMless |
- |
- |
外部 |
R8A77800BDBGV |
|
SH-4A |
|
400MHz |
|
16K x 8 |
|
|
-40°C ~ 85°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
SuperH® SH7780 |
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449-FBGA |
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20-101-1139 |
MPU 코어 |
Rabbit 4000 |
- |
58.98MHz |
1MB（内部），microSD 插槽（外部） |
1MB |
IDC 接头 2x25，2x5，1xmicroSD 卡 |
1.84" x 2.85"（47mm x 72mm） |
-20°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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- |
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ROMLess |
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ADSP-21061KSZ-160 |
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- |
- |
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表面贴装 |
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MQFP |
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SHARC |
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40MHz |
0 °C |
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240 |
32 x 32 x 3.5mm |
32mm |
32Bit |
3.5mm |
|
40MIPS |
32Bit |
1 MB |
哈佛 |
浮点 |
5 V |
85 °C |
1 |
1 |
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- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
Artix™-7 FPGA，55K 逻辑单元 |
484-LFBGA，CSPBGA |
485-CSBGA（19x19） |
- |
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|
XC7Z012S-1CLG485C |
|
单 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
667MHz |
|
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|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
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- |
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HMC641LC4 |
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QFN |
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单路 SP4T |
3.5dB |
30dB |
88ns |
1 |
20GHz |
-40 °C |
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MESFET |
|
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24 |
4 x 4 x 1.02mm |
4mm |
4mm |
1.02mm |
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TO-40-100 |
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散装 |
DISS-O-PADs® |
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- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
Artix™-7 FPGA，65K 逻辑单元 |
484-LFBGA，CSPBGA |
484-CSPBGA（19x19） |
- |
|
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|
|
XC7Z014S-1CLG484C |
|
单 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
667MHz |
|
|
|
|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
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TO-100-10 |
- |
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AD632SH |
|
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|
含铅/不符合限制有害物质指令(RoHS)规范要求 |
7 周 |
- |
|
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|
模拟乘法器/除法器 |
四象限 |
TO-100-10 金属罐 |
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散装 |
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- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
Kintex™-7 FPGA，125K 逻辑单元 |
676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
|
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|
|
XC7Z030-1FBG676I |
|
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
667MHz |
|
|
|
|
-40°C ~ 100°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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256KB |
64KB |
DDR，PCIe，SERDES |
CAN，以太网，I²C，SPI，UART/USART，USB |
FPGA - 50K 逻辑模块 |
484-BGA |
484-FPBGA（23x23） |
- |
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|
M2S050-FGG484 |
|
ARM® Cortex®-M3 |
|
166MHz |
|
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|
|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
4 周 |
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- |
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ROMLess |
|
|
|
ADSP-21061KSZ-160 |
|
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- |
- |
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表面贴装 |
|
|
MQFP |
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|
SHARC |
|
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|
|
40MHz |
0 °C |
|
|
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|
|
|
240 |
32 x 32 x 3.5mm |
32mm |
32Bit |
3.5mm |
|
40MIPS |
32Bit |
1 MB |
哈佛 |
浮点 |
5 V |
85 °C |
1 |
1 |
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|
- |
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|
FN351-50-33 |
|
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|
|
-25°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
10 周 |
FN 351 |
三相（角接） |
单级 |
- |
250V |
440V |
50A |
DC ~ 60Hz |
逆变器，功率驱动系统 |
CSA，ENEC，UR |
端接块 |
- |
底座安装 |
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16-CDIP 侧面铜焊 |
- |
|
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|
AD539KDZ |
|
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|
|
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
- |
|
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|
|
模拟乘法器/除法器 |
双象限 |
16-CDIP（0.300"，7.62mm） |
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|
管件 |
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- |
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|
ADXRS453BEYZ |
|
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|
表面贴装 |
|
|
LCCV |
|
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|
|
1 |
±400 (Max)°/s |
80°/s/LSB |
- |
SPI |
0.023°/s |
14 |
9.2 x 9.2 x 4.4mm |
9.2mm |
9.2mm |
4.4mm |
77.5Hz |
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|
模具 |
- |
|
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|
|
HMC-MDB277 |
|
|
|
|
|
|
|
|
|
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
|
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|
|
雷达 |
70GHz ~ 90GHz |
- |
- |
升/降频器 |
- |
HMC-MDB277 |
散装 |
|
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18-CDIP |
- |
|
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|
AD538AD |
|
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|
|
含铅/不符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
|
|
|
|
|
|
|
|
|
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|
|
模拟计算装置 |
单象限 |
18-CDIP（0.300"，7.62mm） |
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管件 |
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- |
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|
ADIS16228CMLZ |
|
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|
表面贴装 |
|
|
ML |
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|
3 |
±18g |
0.6104mg/LSB |
数字 |
SPI |
0.25mg/√Hz |
15 |
24.2 x 15.2 x 15.2mm |
24.2mm |
15.2mm |
15.2mm |
5kHz |
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|
