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通孔 |
TO-220-7 成型引线，6 引线 |
TO-220-7C |
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-40°C ~ 150°C（TJ） |
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管件 |
TOPSwitch®-HX |
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隔离 |
是 |
700V |
反激 |
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- |
78% |
66kHz，132kHz |
119 W |
限流，超温，过压 |
- |
TOP256YN |
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表面贴装型 |
20-SOIC（0.295\，7.50mm 宽） |
20-SOIC |
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MC74HCT273ADWG |
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-55°C ~ 125°C（TA） |
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管件 |
74HCT |
非反相 |
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复位 |
D 型 |
1 |
8 |
30 MHz |
25ns @ 5V，50pF |
正边沿 |
4mA，4mA |
4.5V ~ 5.5V |
4 µA |
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DDR SDRAM |
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256MB |
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MT4VDDT3264HY-40BF2 |
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400MT/s |
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200-SODIMM |
- |
符合限制有害物质指令(RoHS)规范要求 |
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- |
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表面贴装 |
SC-74，SOT-457 |
6-TSOP |
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74LVC1G11GV,125 |
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-40°C ~ 125°C |
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- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
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标准卷带 |
74LVC |
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与门 |
1 |
3 |
- |
1.65 V ~ 5.5 V |
4µA |
32mA，32mA |
0.7 V ~ 0.8 V |
1.7 V ~ 2 V |
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表面贴装型 |
8-SOIC（0.154\，3.90mm 宽），7 引线 |
8-SOIC-7A |
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-40°C ~ 125°C（TJ） |
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卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
- |
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隔离 |
无 |
790V |
反激 |
|
9V ~ 24V |
50% |
25kHz |
1.3 W |
过载，超温，过压 |
软启动 |
HFC0500GS-Z |
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表面贴装型 |
20-SOIC（0.295\，7.50mm 宽） |
20-SOIC |
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CD74HCT574QM96G4Q1 |
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-40°C ~ 125°C（TA） |
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卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
Automotive, AEC-Q100, 74HCT |
三态，非反相 |
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标准 |
D 型 |
1 |
8 |
60 MHz |
33ns @ 4.5V，50pF |
正边沿 |
6mA，6mA |
4.5V ~ 5.5V |
8 µA |
10 pF |
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XU216-256-FB236-C20 |
XU |
XCore |
32 位 16 核 |
2000MIPS |
USB |
- |
104 |
- |
ROMless |
- |
256K x 8 |
- |
外部 |
0°C ~ 70°C（TA） |
236-LFBGA |
- |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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表面贴装 |
8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
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SPX3819S-L-5-0 |
- |
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-40°C ~ 125°C |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
500mA |
0.34V @ 500mA |
16V |
管件 |
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正，固定式 |
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表面贴装 |
6-TSSOP，SC-88，SOT-363 |
6-TSSOP |
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74LVC1G11GW,125 |
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-40°C ~ 125°C |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
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标准卷带 |
74LVC |
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与门 |
1 |
3 |
- |
1.65 V ~ 5.5 V |
4µA |
32mA，32mA |
0.7 V ~ 0.8 V |
1.7 V ~ 2 V |
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表面贴装 |
8-XFDFN |
8-XSON，SOT996-2（2x3） |
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74AHC3G04GD,125 |
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-40°C ~ 125°C |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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标准卷带 |
74AHC |
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反相器 |
3 |
3 |
- |
2 V ~ 5.5 V |
10µA |
8mA，8mA |
0.5 V ~ 1.65 V |
1.5 V ~ 3.85 V |
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表面贴装型 |
TO-261-4，TO-261AA |
SOT-223（TO-261） |
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-40°C ~ 125°C（TJ） |
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卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
- |
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隔离 |
是 |
700V |
反激 |
8.2 V |
6.3V ~ 10V |
68% |
65kHz |
19 W |
限流，过载，超温，过压，短路 |
- |
NCP1075STAT3G |
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表面贴装型 |
24-VFQFN 裸露焊盘 |
24-QFN（3x3） |
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SI2141-A10-GMR |
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卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
- |
|
消费视频 |
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调谐器 |
表面贴装型 |
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1.8V，3.3V |
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- |
GPIO |
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非易失 |
闪存 |
FLASH - NAND |
1Gb （1G x 1） |
- |
- |
SPI |
2.7 V ~ 3.6 V |
表面贴装 |
24-TBGA |
24-TBGA（6x8） |
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MT29F1G01ABAFD12-AAT:F TR |
- |
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-40°C ~ 105°C（TA） |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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N78E055APG |
N78 |
8051 |
8-位 |
40MHz |
EBI/EMI，SPI，UART/USART |
欠压检测/复位，LVD，POR，PWM，WDT |
36 |
16KB（16K x 8） |
闪存 |
- |
1.25K x 8 |
- |
内部 |
-40°C ~ 85°C（TA） |
44-LCC（J 形引线） |
- |
符合限制有害物质指令(RoHS)规范要求 |
18 周 |
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表面贴装 |
14-VFQFN 裸露焊盘 |
14-DHVQFN（2.5x3） |
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74VHC32BQ,115 |
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|
-40°C ~ 125°C |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
|
|
|
剪切带（CT） |
74VHC |
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|
或门 |
4 |
2 |
- |
2 V ~ 5.5 V |
2µA |
8mA，8mA |
0.5 V ~ 1.65 V |
1.5 V ~ 3.85 V |
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表面贴装 |
SC-74A，SOT-753 |
5-TSOP |
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|
74HCT1G86GV,125 |
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|
|
-40°C ~ 125°C |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
|
标准卷带 |
74HCT |
|
|
|
XOR（异或） |
1 |
2 |
- |
4.5 V ~ 5.5 V |
20µA |
2mA，2mA |
0.8V |
2V |
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表面贴装型 |
24-VFQFN 裸露焊盘 |
24-QFN（3x3） |
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SI2141-A10-GM |
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托盘 |
- |
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消费视频 |
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调谐器 |
表面贴装型 |
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1.8V，3.3V |
|
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- |
GPIO |
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表面贴装型 |
16-SOIC（0.295\，7.50mm 宽） |
16-SO |
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PCA8574D,518 |
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8 |
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|
-40°C ~ 85°C |
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|
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
- |
推挽式 |
|
是 |
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POR |
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400 kHz |
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2.3V ~ 5.5V |
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I²C |
100µA，25mA |
|
|
易失 |
DRAM |
SDRAM |
256Mb （8M x 32） |
- |
5.4ns |
并联 |
3 V ~ 3.6 V |
表面贴装 |
90-TFBGA |
90-TFBGA（8x13） |
|
|
|
IS42S32800J-7BLI |
- |
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|
|
-40°C ~ 85°C（TA） |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
256KB |
Kintex™-7 FPGA，275K 逻辑单元 |
XC7Z035-2FBG676E |
|
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
800MHz |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
DMA |
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|
0°C ~ 100°C（TJ） |
|
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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