|
|
74HC164D |
SOIC |
移位寄存器 |
8 |
HC |
表面贴装 |
- |
串行至并行 |
1 |
14 |
2 V |
6 V |
8.75 x 4 x 1.45mm |
8.75mm |
4mm |
- |
|
|
|
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|
MX25L25635EMI-12G |
SOP |
|
|
|
表面贴装 |
|
|
|
16 |
|
|
10.5 x 7.6 x 2.44mm |
10.5mm |
7.6mm |
- |
2.44mm |
-40 °C |
85 °C |
- |
- |
- |
- |
256Mbit |
串行 |
128M x 2 位，256M x 1 位，64M x 4 位 |
NOR |
2.7 V |
3.6 V |
|
64M, 128M, 256M |
|
|
1 bit, 2 bit, 4 bit |
|
|
|
|
|
|
|
|
PC28F512G18FE |
EBGA |
|
|
|
表面贴装 |
|
|
|
64 |
|
|
10 x 8 x 1.2mm |
10mm |
8mm |
- |
1.2mm |
-30 °C |
85 °C |
- |
- |
- |
- |
512Mbit |
并行 |
32M x 16 位 |
NOR |
1.7 V |
2 V |
对称 |
32M |
|
96ns |
16Bit |
|
|
|
|
|
|
|
|
SST39VF3201B-70-4I-EKE |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.4 x 12.2 x 1mm |
18.4mm |
12.2mm |
- |
1mm |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
并行 |
2M x 16 位 |
分门 |
2.7 V |
3.6 V |
对称 |
2M |
|
70ns |
16Bit |
|
|
|
|
|
|
|
|
CY8C5267AXI-LP051 |
TQFP |
|
|
|
表面贴装 |
|
|
|
100 |
1.71 V |
5.5 V |
14 x 14 x 1.4mm |
14mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
汽车，电容性感应，控制器，嵌入式，闪存，LCD，LED，USB |
CMOS |
|
|
|
|
|
CY8C20534-12PVXI |
SSOP |
|
|
|
表面贴装 |
|
|
|
28 |
2.4 V |
5.25 V |
10.4 x 5.6 x 1.85mm |
10.4mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LED，PSoC 1 混合信号阵列，USB |
CMOS |
|
|
|
|
|
SN74LV8153PW |
TSSOP |
- |
8 |
74LV |
表面贴装 |
- |
串行至并行 |
1 |
20 |
3 V |
13.2 V |
6.6 x 4.5 x 1.05mm |
6.6mm |
6.6mm |
- |
|
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|
SST26VF064B-104I/SM |
SOIJ |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.26 x 5.25 x 1.98mm |
5.26mm |
5.25mm |
- |
1.98mm |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
SPI |
8M x 8 位 |
分门 |
2.7 V |
3.6 V |
对称 |
8M |
|
3ns |
8Bit |
|
|
|
|
|
|
|
|
MX25L8006EM2I-12G |
SOP |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.03 x 4 x 1.55mm |
5.03mm |
4mm |
- |
1.55mm |
-40 °C |
85 °C |
- |
- |
- |
- |
8Mbit |
|
4M x 2 位，8M x 1 位 |
NOR |
1.65 V |
3.6 V |
|
4M, 8M |
|
|
1 bit, 2 bit |
|
|
|
|
|
|
|
|
SST39VF801C-70-4I-EKE |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.2 x 1.05mm |
18.5mm |
12.2mm |
- |
1.05mm |
-40 °C |
85 °C |
- |
- |
- |
- |
8Mbit |
并行 |
512K x 16 |
分门 |
2.7 V |
3.6 V |
|
512K |
|
70ns |
16Bit |
|
|
|
|
|
|
|
|
CY8C4125LQI-483 |
QFN |
|
|
|
表面贴装 |
|
|
|
40 |
1.71 V |
5.5 V |
6 x 6 x 0.55mm |
6mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
嵌入式 |
CMOS |
|
|
|
|
|
S6 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
|
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|
|
- |
- |
|
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|
|
|
|
|
|
USB 编程器 |
EEPROM，EPROM，闪存，MCU/MPU，NAND 闪存，NV Ram，PLD，串行 EEPROM |
USB 2.0 |
|
|
ADE7754ARZ |
SOIC W |
|
|
|
表面贴装 |
|
|
|
24 |
|
|
15.6 x 7.6 x 2.35mm |
15.6mm |
7.6mm |
- |
2.35mm |
-40 °C |
85 °C |
- |
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
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|
|
SST25VF040B-50-4I-S2AF |
SOIC |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.4 x 5.4 x 1.91mm |
5.4mm |
5.4mm |
- |
1.91mm |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
SPI |
512K x 8 位 |
分门 |
2.7 V |
3.6 V |
|
512K |
|
|
8Bit |
|
|
|
|
|
|
|
|
MX29LV040CTI-70G |
TSOP |
|
|
|
表面贴装 |
|
|
|
32 |
|
|
18.5 x 8.1 x 1.05mm |
18.5mm |
8.1mm |
- |
1.05mm |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
并行 |
512K x 8 位 |
|
2.7 V |
3.6 V |
|
512K |
4 |
70ns |
8Bit |
|
|
|
|
|
|
|
|
CC2540F256RHAT |
VQFN |
|
|
|
表面贴装 |
|
|
|
40 |
2 V |
3.6 V |
6 x 6 x 0.9mm |
6mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
蓝牙 |
CMOS |
|
|
|
|
|
CY8C28445-24PVXI |
SSOP |
|
|
|
表面贴装 |
|
|
|
28 |
3 V |
5.25 V |
10.4 x 5.6 x 1.85mm |
10.4mm |
|
- |
|
-40°C |
85°C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
|
CMOS |
|
|
|
|
|
SN74HC164PW |
TSSOP |
移位寄存器 |
8 |
HC |
表面贴装 |
- |
串行至并行 |
1 |
14 |
2 V |
6 V |
5 x 4.4 x 1.15mm |
5mm |
4.4mm |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
S25FL132K0XMFI041 |
SOIC |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
4.9 x 3.9 x 1.55mm |
4.9mm |
3.9mm |
- |
1.55mm |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
16M x 2 位，32M x 1 位，8M x 4 位 |
NOR |
2.7 V |
3.6 V |
|
8M, 16M, 32M |
|
|
1, 2, 4 |
|
|
|
|
|
|
|
|
SST26VF016B-104V/SN |
SOIC |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
4.9 x 3.9 x 1.25mm |
4.9mm |
3.9mm |
- |
1.25mm |
-40 °C |
105 °C |
- |
- |
- |
- |
16Mbit |
SPI |
2M x 8 位 |
分门 |
2.7 V |
3.6 V |
|
2M |
|
|
8 |
|
|
|
|
|
|
