|
|
ADXL103CE |
1 |
±1.7g |
1040mV/g |
- |
- |
110µg/Hz rms |
表面贴装 |
CLCC |
8 |
5 x 5 x 1.98mm |
5mm |
5mm |
1.98mm |
- |
- |
|
|
LIS2DHTR |
3 |
±16 g, ±2 g, ±4 g, ±8 g |
4 mg/digit, 8 mg/digit, 16 mg/digit, 48 (Normal Mode) mg/digit |
数字 |
I2C, SPI |
- |
表面贴装 |
LGA |
14 |
2.15 x 2.15 x 1mm |
2.15mm |
2.15mm |
1mm |
- |
- |
|
|
L3GD20TR |
3 |
- |
17.5mdps/digit |
数字 |
I2C, SPI |
0.03dps/√Hz |
表面贴装 |
LGA |
16 |
4.15 x 4.15 x 0.79mm |
4.15mm |
4.15mm |
0.79mm |
- |
- |
|
|
MMA8452QT |
3 |
±2 g, ±4 g, ±8 g |
256 counts/g, 512 counts/g, 1024 counts/g |
数字 |
串行 - I2C |
99µg/√Hz |
表面贴装 |
QFN |
16 |
3 x 3 x 1mm |
3mm |
3mm |
1mm |
400kHz |
- |
|
|
ADIS16445AMLZ |
3 |
±125 °/s, ±250 °/s, ±62 °/s |
0.0025 °/s/LSB, 0.005 °/s/LSB, 0.01 °/s/LSB |
数字 |
SPI |
0.011°/s |
表面贴装 |
ML |
20 |
24.53 x 38.08 x 10.23mm |
24.53mm |
38.08mm |
10.23mm |
25Hz |
- |
|
|
ADXL326BCPZ |
3 |
±16g |
63mV/g |
- |
- |
300µg/Hz rms |
表面贴装 |
LFCSP |
16 |
4 x 4 x 1.43mm |
4mm |
4mm |
1.43mm |
- |
- |
|
|
ADXL203CE |
2 |
±1.7g |
1040mV/g |
- |
- |
110µg/Hz rms |
表面贴装 |
CLCC |
8 |
5 x 5 x 1.98mm |
5mm |
5mm |
1.98mm |
- |
- |
|
|
ADXL345BCCZ |
3 |
±16 g, ±2 g, ±4 g, ±8 g |
282mV/g |
- |
I2C, SPI |
0.75 (xy) 1.1 (z)µg/Hz rms |
表面贴装 |
LGA |
14 |
5 x 3 x 0.98mm |
5mm |
3mm |
0.98mm |
- |
- |
|
|
ADXRS290BCEZ |
2 |
- |
200°/s/LSB |
数字 |
SPI |
0.004°/s |
表面贴装 |
LGA |
18 |
5.9 x 4.6 x 1.3mm |
5.9mm |
4.6mm |
1.3mm |
480Hz |
- |
|
|
MMA8653FCR1 |
3 |
±2 g, ±4 g, ±8 g |
64 LSB/g, 128 LSB/g, 256 LSB/g |
数字 |
串行 - I2C |
182µg/√Hz |
表面贴装 |
DFN |
10 |
2 x 2 x 0.95mm |
2mm |
2mm |
0.95mm |
400kHz |
- |
|
|
LIS3MDLTR |
3 |
±16g |
1711LSB/g |
数字 |
SPI |
- |
表面贴装 |
VFLGA |
12 |
2.15 x 2.15 x 1mm |
2.15mm |
2.15mm |
1mm |
- |
- |
|
|
LSM303DTR |
3 |
±6g |
0.732mg/LSB |
模拟 |
I2C, SPI |
150µg/√Hz |
表面贴装 |
LGA |
16 |
3.15 x 3.15 x 0.79mm |
3.15mm |
3.15mm |
0.79mm |
- |
- |
|
|
LSM6DS3TR |
3 |
±16g |
0.488mg/LSB |
数字 |
串行I2C、串行SPI |
- |
表面贴装 |
LGA |
14 |
2.5 x 3 x 0.86mm |
2.5mm |
3mm |
0.86mm |
400kHz |
- |
|
|
ADXRS453BEYZ |
1 |
±400 (Max)°/s |
80°/s/LSB |
- |
SPI |
0.023°/s |
表面贴装 |
LCCV |
14 |
9.2 x 9.2 x 4.4mm |
9.2mm |
9.2mm |
4.4mm |
77.5Hz |
- |
|
|
LSM303D |
3 |
±12 g, ±16 g, ±2 g, ±4 g, ±6 g, ±8 g |
0.479 mg/LSB, 0.732 mg/LSB |
模拟 |
I2C, SPI |
5 mg rms, 150 μg/√Hz |
表面贴装 |
LGA |
16 |
3.15 x 3.15 x 1mm |
3.15mm |
3.15mm |
1mm |
400kHz |
- |
|
|
LIS3DSH |
3 |
±16 g, ±2 g, ±4 g, ±6 g, ±8 g |
0.06 mg/bit, 0.12 mg/bit, 0.18 mg/bit, 0.24 mg/bit, 0.73 mg/bit |
数字 |
I2C, SPI |
150µg/√Hz |
表面贴装 |
LGA |
16 |
3.15 x 3.15 x 1mm |
3.15mm |
3.15mm |
1mm |
400kHz |
- |
|
|
MPU-9250 |
9 |
±1000 °/s, ±16 g, ±2 g, ±2000 °/s, ±250 °/s, ±4 g, ±500 °/s, ±8 g |
16.4°/s/LSB |
数字 |
I2C, SPI |
300µg/√Hz |
表面贴装 |
QFN |
24 |
3.1 x 3.1 x 1mm |
3.1mm |
3.1mm |
1mm |
29kHz |
- |
|
|
MPU-6050 |
6 |
±1000 °/s, ±16 g, ±2 g, ±2000 °/s, ±250 °/s, ±4 g, ±500 °/s, ±8 g |
16.4 °/s/LSB, 16384 LSB/g |
数字 |
I2C |
400µg/√Hz |
表面贴装 |
QFN |
24 |
4.1 x 4.1 x 0.9mm |
4.1mm |
4.1mm |
0.9mm |
30 (Z-Axis) kHz, 33 (Y-Axis) kHz, 36 (X-Axis) kHz |
- |
|
|
ADIS16448BMLZ |
3 |
±18g |
0.833mg/LSB |
数字 |
SPI |
5.1mg rms |
表面贴装 |
ML |
20 |
38.08 x 24.53 x 11.1mm |
38.08mm |
24.53mm |
11.1mm |
5.5kHz |
- |
|
|
iNEMO-M1 |
9 |
±16 g, ±2 g, ±4 g, ±8 g |
1 mg/LSB, 2 mg/LSB, 4 mg/LSB, 12 mg/LSB |
数字 |
CAN、I2C、SPI、USART |
220µg/√Hz |
表面贴装 |
WLCSP |
64 |
13 x 13 x 1.2mm |
13mm |
13mm |
1.2mm |
72000kHz |
- |
