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±50ppm |
18pF |
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SMD |
ABM8-18.432MHZ-B2-T |
表面贴装 |
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4 |
3.2 x 2.5 x 0.8mm |
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表面贴装 |
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ARJM11D7-104-AB-EW2 |
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21.30 x 15.90 x 13.60mm |
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10/100 Base-T |
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ABT-8-75-3-T |
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- |
卷带（TR）,剪切带（CT） |
1GHz ~ 1.5GHz |
75 / 75 欧姆 |
- |
1.4dB |
- |
模块 |
表面贴装型 |
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±50ppm |
12pF |
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陶瓷封装 |
ABM8AIG-24.000MHZ-12-2Z-T3 |
表面贴装 |
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4 |
3.2 x 2.5 x 0.8mm |
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表面贴装 |
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30ppm |
18pF |
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SMD |
ABLS2-10.000MHZ-D4Y-T |
表面贴装 |
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11.4 x 4.7 x 3.3mm |
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表面贴装 |
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±10ppm |
4pF |
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±20ppm |
(DFN - LCC)，4-SMD，无铅 |
ABM8W-40.0000MHZ-4-B1U-T3 |
表面贴装 |
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2.5 x 2.2 x 0.6mm |
2.5mm |
2mm |
0.6mm |
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70°C |
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-20°C |
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表面贴装 |
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ASVMB-ADAPTER-KIT |
插座适配器套件 |
MEMSpeed Pro II™ |
4 |
- |
- |
符合限制有害物质指令(RoHS)规范要求 |
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±50ppm |
18pF |
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SMD |
ABM8-12.288MHZ-B2-T |
表面贴装 |
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4 |
3.2 x 2.5 x 0.8mm |
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表面贴装 |
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30ppm |
18pF |
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SMD |
ABLS2-12.288MHZ-D4Y-T |
表面贴装 |
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11.4 x 4.7 x 3.3mm |
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表面贴装 |
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±20ppm |
18pF |
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±30ppm |
SMD |
ABM7-16.000MHZ-D2Y-T |
表面贴装 |
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6 x 3.5 x 1.4mm |
6mm |
3.5mm |
1.4mm |
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85°C |
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-40°C |
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表面贴装 |
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±30ppm |
10pF |
60Ω |
±30ppm |
SMD |
ABM8G-25.000MHZ-B4Y-T |
表面贴装 |
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4 |
3.2 x 2.5 x 1mm |
3.2mm |
2.5mm |
1mm |
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70°C |
|
-20°C |
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表面贴装 |
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±20ppm |
18pF |
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HC/49US |
ABL-3.6864MHZ-B2 |
通孔 |
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2 |
11.5 x 5.0 x 3.5mm |
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通孔 |
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±50ppm |
12pF |
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陶瓷封装 |
ABM8AIG-10.000MHZ-12-2Z-T3 |
表面贴装 |
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4 |
3.2 x 2.5 x 0.8mm |
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表面贴装 |
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10pF |
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SMD |
ABM3B-14.7456MHZ-10-1-U-T |
表面贴装 |
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4 |
5 x 3.2 x 1.1mm |
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表面贴装 |
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AXS-2520-04-08 |
插口，测试和预烧 |
晶体，振荡器 |
4 |
2.50mm x 2.00mm x 1.00mm |
- |
符合限制有害物质指令(RoHS)规范要求 |
11 周 |
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±30ppm |
16pF |
|
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HC/49US |
ABLS-20.000MHZ-K4T |
通孔 |
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2 |
8.0 x 3.0mm |
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通孔 |
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30ppm |
18pF |
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SMD |
ABLS3-8.000MHZ-D4Y-T |
表面贴装 |
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11.4 x 4.7 x 2.5mm |
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表面贴装 |
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±25ppm |
20pF |
50Ω |
±35ppm |
SMD |
ABLS-12.000MHz-20-B-3-H-T |
表面贴装 |
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2 |
11.4 x 4.7 x 4.1mm |
11.4mm |
4.7mm |
4.1mm |
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70°C |
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-20°C |
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表面贴装 |
|
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18pF |
|
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SMD |
ABMM-14.7456MHZ-B2-T |
表面贴装 |
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4 |
7 x 5 x 1.3mm |
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表面贴装 |
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ASFLMB-50.000MHZ-LC-T |
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- |
- |
- |
50MHz |
±50ppm |
QFN |
4 |
5 x 3.2 x 0.85mm |
5mm |
3.2mm |
0.85mm |
3.3 V |
85 °C |
1.8 V |
-40 °C |
- |
- |
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