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AD5252BRU1 |
- |
电位计 |
2 |
256 |
I²C |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
可选地址 |
±30% |
650 ppm/°C |
200 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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- |
8/16-位 |
50MHz |
UART/USART |
- |
- |
ROMless |
- |
- |
3 V ~ 5.5 V |
- |
内部 |
IA188EBPLC84IR2 |
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-40°C ~ 85°C（TA） |
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管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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- |
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84-LCC（J 形引线） |
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AD8403ARUZ10 |
- |
电位计 |
4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V |
级联销 |
±20% |
500 ppm/°C |
200 |
-40°C ~ 125°C |
24-TSSOP（0.173"，4.40mm 宽） |
24-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
14 周 |
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ADSP-SC583CBCZ-3A |
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-40°C ~ 95°C（TA） |
|
349-CSPBGA（19x19） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
SHARC® |
浮点 |
CAN，EBI/EMI，以太网，DAI，I²C，MMC/SD/SDIO，SPI，SPORT，UART/USART，USB OTG |
300MHz |
ROM（512 kB） |
384kB |
1.10V |
表面贴装 |
349-LFBGA，CSPBGA |
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ADXL325BCPZ |
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- |
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- |
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表面贴装 |
LFCSP LQ |
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3 |
±5g |
192mV/g |
模拟 |
250mg/√Hz |
16 |
4.15 x 4.15 x 1.5mm |
4.15mm |
4.15mm |
1.5mm |
1600Hz |
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AD7730LBRZ-REEL |
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24-SOIC |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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- |
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24-SOIC（0.295"，7.50mm 宽） |
24 |
1 |
125mW |
2.7 V ~ 5.25 V |
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HMC860LP3E |
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- |
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表面安装 |
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16 |
3.1 x 3.1 x 0.95mm |
3.1mm |
3.1mm |
0.95mm |
|
- |
- |
- |
- |
5.6 V |
85 °C |
4.8 V |
-40 °C |
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AD736KRZ-RL |
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2.8V，-3.2V ~ ±16.5V |
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8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
11 周 |
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表面贴装 |
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160µA |
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AD7153BRMZ |
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- |
- |
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MSOP |
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10 |
3.1 x 3.1 x 0.95 mm |
3.1mm |
3.1mm |
0.95mm |
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3.6 V |
85 °C |
2.7 V |
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12 位 |
- |
- |
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AD5621AKSZ-500RL7 |
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- |
- |
- |
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表面贴装 |
SC-70 |
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6 |
2 x 1.25 x 0.9 mm |
2 mm |
1.25 mm |
0.9 mm |
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125 °C |
|
-40 °C |
12 位 |
- |
- |
1 |
串行 (SPI/QSPI/Microwire) |
单 |
1.7Msps |
3.3 V、5 V |
供应 |
电阻串 |
10µs |
单极 |
±0.5mV |
|
±6LSB |
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AD7741BR |
- |
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8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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|
表面贴装 |
|
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|
电压至频率 |
6.144Mhz |
±50ppm/°C |
±0.024% |
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AD767KNZ |
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- |
- |
- |
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通孔 |
PDIP |
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24 |
31.19 x 6.61 x 3.3 mm |
31.19 mm |
6.61 mm |
3.3 mm |
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70 °C |
|
0 °C |
12 bit |
- |
- |
1 |
并行 |
双 |
500ksps |
|
外部，内部 |
R-2R，电阻串 |
4µs |
双极，单极 |
|
±12 → ±15V |
±0.5LSB |
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AD7548JNZ |
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- |
- |
- |
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通孔 |
PDIP |
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20 |
26.16 x 6.35 x 3.3 mm |
26.16 mm |
6.35 mm |
3.3 mm |
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85 °C |
|
-40 °C |
12 位 |
- |
- |
1 |
并行 |
单 |
|
5 V, 12 V, 15 V |
外部 |
R-2R，电阻串 |
1.5µs |
|
±6LSB |
|
±1LSB |
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AD9984AKCPZ-140 |
- |
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|
64-VFQFN 裸露焊盘，CSP |
64-LFCSP-VQ（9x9） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
显示器，处理，电视 |
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表面贴装 |
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接口 |
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AD5781ARUZ |
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- |
- |
- |
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表面贴装 |
TSSOP |
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|
20 |
6.6 x 4.5 x 1.05 mm |
6.6 mm |
4.5 mm |
1.05 mm |
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|
125 °C |
|
-40 °C |
18 位 |
- |
- |
1 |
串行 （SPI） |
双 |
|
|
外部，内部 |
R-2R，电阻串 |
1µs |
双极 |
±5.25LSB |
±16.5V |
±4LSB |
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AD5689RARUZ |
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- |
- |
- |
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表面贴装 |
TSSOP |
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16 |
5.1 x 4.5 x 1.05 mm |
5.1 mm |
4.5 mm |
1.05 mm |
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|
105 °C |
|
-40 °C |
12 位 |
- |
- |
2 |
串行 （SPI） |
|
|
2.7 → 5.5 V |
外部，内部 |
电阻串 |
8µs |
|
±0.2%FSR |
|
±8LSB |
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AD5592RBRUZ |
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- |
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- |
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表面贴装 |
TSSOP |
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|
16 |
5.1 x 4.5 x 1.05mm |
5.1mm |
4.5mm |
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|
105 °C |
|
-40 °C |
12 位 |
- |
|
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|
单 |
|
2.7 → 5.5 V |
|
|
6µs |
|
0.3%FSR |
|
±1 (DAC) LSB, ±2 (ADC) LSB |
1 |
8 |
400ksps |
81dB |
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|
LTM2810IY-I#PBF |
µModule® |
|
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|
-40°C ~ 85°C |
36-BGA 模块 |
36-BGA（22x6.25） |
托盘 |
|
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|
表面贴装型 |
|
|
6 |
|
|
I²C |
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磁耦合 |
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400kHz |
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|
是 |
3/3 |
单向 |
7500Vrms |
50kV/µs |
500ns，500ns |
50ns |
350ns，250ns（最大） |
3V ~ 5.5V |
|
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闪存 |
|
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|
ADSP-BF527KBCZ-6 |
Blackfin |
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- |
- |
- |
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表面贴装 |
CSP BGA |
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|
289 |
12 x 12 x 1.2mm |
12mm |
32Bit |
1.2mm |
|
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70 °C |
|
0 °C |
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|
600MHz |
32Bit |
128 MB |
RISC |
132 kB |
ALU，MAC |
3.3 V |
2 |
1 |
1 x OTG |
1 |
8 x 32位 |
32Bit |
8 |
|
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ADUM3402BRWZ-RL |
iCoupler® |
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-40°C ~ 105°C |
16-SOIC（0.295\，7.50mm 宽） |
16-SOIC |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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表面贴装型 |
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4 |
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通用 |
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磁耦合 |
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10Mbps |
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无 |
2/2 |
单向 |
2500Vrms |
25kV/µs |
50ns，50ns |
3ns |
2.5ns，2.5ns |
3V ~ 5.5V |
