|
S29AL016J70BFI010 |
|
|
|
|
|
|
|
|
|
|
|
|
|
FPBGA |
|
|
- |
- |
16Mbit |
CFI |
48 |
1M x 16 位,2M x 8 位 |
表面贴装 |
2.7 V |
3.6 V |
1M, 2M |
70ns |
8, 16 |
8.15 x 6.15 x 0.76mm |
6.15mm |
-40 °C |
85 °C |
8.15mm |
0.76mm |
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
CYBLE-224116-01 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
15.4 x 9.5 x 1.8mm |
9.5mm |
-40°C |
105 °C |
15.4mm |
1.8mm |
|
|
|
|
|
|
|
|
4.2 |
9.5dBm |
-95dBm |
I2C, SPI, UART |
|
CY8C21345-24SXI |
M8C |
8-位 |
24MHz |
SPI,UART/USART |
LVD,POR,PWM,WDT |
24 |
8KB(8K x 8) |
闪存 |
- |
512 x 8 |
A/D 3x10b |
内部 |
-40°C ~ 85°C(TA) |
28-SOIC(0.295",7.50mm 宽) |
28-SOIC |
管件 |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
MB9BF568MPMC-G-JNE2 |
ARM® Cortex®-M4F |
32-位 |
160MHz |
CAN,CSIO,EBI/EMI,I²C,LIN,SD,UART/USART,USB |
DMA,LVD,POR,PWM,WDT |
63 |
1.03125MB(1.03125M x 8) |
闪存 |
- |
128K x 8 |
A/D 16x12b,D/A 2x12b |
内部 |
-40°C ~ 125°C(TA) |
80-LQFP |
80-LQFP(12x12) |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C24423A-24PVXA |
|
|
|
|
|
|
|
|
|
|
|
|
|
SSOP |
|
|
- |
- |
|
|
28 |
|
表面贴装 |
|
|
|
|
|
10.4 x 5.6 x 1.85mm |
|
-40°C |
85°C |
10.4mm |
|
|
- |
|
微处理器 |
|
CMOS |
5.25 V |
3 V |
|
|
|
|
|
CY8C3666LTI-201 |
8051 |
8-位 |
67MHz |
EBI/EMI,I²C,LIN,SPI,UART/USART |
电容感应,DMA,LCD,POR,PWM,WDT |
38 |
64KB(64K x 8) |
闪存 |
2K x 8 |
8K x 8 |
A/D 1x12b,D/A 2x8b |
内部 |
-40°C ~ 85°C(TA) |
68-VFQFN 裸露焊盘 |
68-QFN(8x8) |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
18 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C20234-12LKXIT |
M8C |
8-位 |
12MHz |
I²C,SPI |
LVD,POR,WDT |
13 |
8KB(8K x 8) |
闪存 |
- |
512 x 8 |
- |
内部 |
-40°C ~ 85°C(TA) |
16-UFQFN |
16-QFN(3x3) |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C28645-24LTXI |
|
|
|
|
|
|
|
|
|
|
|
|
|
QFN |
|
|
- |
- |
|
|
48 |
|
表面贴装 |
|
|
|
|
|
7 x 7 x 1mm |
|
-40 °C |
85 °C |
7mm |
|
|
- |
|
微处理器 |
汽车,电容性感应,控制器,嵌入式,闪存,LED,PSoC 1 混合信号阵列,USB |
CMOS |
5.25 V |
3 V |
|
|
|
|
|
CY8C4125AZI-473 |
ARM® Cortex®-M0 |
32-位 |
24MHz |
I²C,IrDA,LIN,Microwire,智能卡,SPI,SSP,UART/USART |
欠压检测/复位,LVD,POR,PWM,WDT |
36 |
32KB(32K x 8) |
闪存 |
- |
4K x 8 |
A/D 8x12b |
内部 |
-40°C ~ 85°C(TA) |
48-LQFP |
48-TQFP(7x7) |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
28 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C28403-24PVXI |
M8C |
8-位 |
24MHz |
SPI,UART/USART |
LVD,POR,PWM,WDT |
24 |
16KB(16K x 8) |
闪存 |
- |
1K x 8 |
A/D 4x14b;D/A 4x9b |
内部 |
-40°C ~ 85°C(TA) |
28-SSOP(0.209",5.30mm 宽) |
28-SSOP |
管件 |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C5268AXI-LP047 |
|
|
|
|
|
|
|
|
|
|
|
|
|
TQFP |
|
|
- |
- |
|
|
100 |
|
表面贴装 |
|
|
|
|
|
14 x 14 x 1.4mm |
|
-40 °C |
85 °C |
14mm |
|
|
- |
|
微控制器 |
汽车,电容性感应,控制器,嵌入式,闪存,LCD,LED,USB |
CMOS |
5.5 V |
1.71 V |
|
|
|
|
|
CY8C24794-24LTXI |
M8C |
8-位 |
24MHz |
I²C,SPI,UART/USART,USB |
POR,PWM,WDT |
50 |
16KB(16K x 8) |
闪存 |
- |
1K x 8 |
A/D 2x14b;D/A 2x9b |
内部 |
-40°C ~ 85°C(TA) |
56-VFQFN 裸露焊盘 |
56-QFN(8x8) |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C4013SXI-411T |
ARM® Cortex®-M0 |
32-位 |
16MHz |
I²C |
欠压检测/复位,POR,PWM,WDT |
12 |
8KB(8K x 8) |
闪存 |
- |
2K x 8 |
D/A 1x7b,1x8b |
内部 |
-40°C ~ 85°C(TA) |
16-SOIC(0.154",3.90mm 宽) |
16-SOIC |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CY8C29566-24AXI |
|
|
|
|
|
|
|
|
|
|
|
|
|
TQFP |
|
|
- |
- |
|
|
44 |
|
表面贴装 |
|
|
|
|
|
10 x 10 x 1.4mm |
|
-40 °C |
85 °C |
10mm |
|
|
- |
|
微控制器 |
|
CMOS |
5.25 V |
3 V |
|
|
|
|