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R1LP0408DSP-5SI#B0 |
- |
易失 |
SRAM |
SRAM |
4Mb (512K x 8) |
55ns |
55ns |
并联 |
-40°C ~ 85°C(TA) |
表面贴装 |
32-SOIC(0.450",11.40mm 宽) |
32-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
20 周 |
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R5F100FAAFP#V0 |
RL78/G13 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
31 |
16KB(16K x 8) |
闪存 |
- |
2K x 8 |
A/D 10x8/10b |
内部 |
44-LQFP |
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DF2329BVTE25V |
H8® H8S/2300 |
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-20°C ~ 75°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
|
H8S/2000 |
16-位 |
25MHz |
SCI,智能卡 |
DMA,POR,PWM,WDT |
86 |
384KB(384K x 8) |
闪存 |
- |
32K x 8 |
A/D 8x10b;D/A 2x8b |
内部 |
120-TQFP |
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R5F100GADNA#W0 |
RL78/G13 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
34 |
16KB(16K x 8) |
闪存 |
- |
2K x 8 |
A/D 10x8/10b |
内部 |
48-WFQFN 裸露焊盘 |
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ICL7660ACBAZA |
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表面贴装 |
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- |
- |
- |
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SOIC |
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反相,升压 |
8 |
5 x 4 x 1.5mm |
1.5mm |
5mm |
12 V |
70 °C |
-1.5 V |
1.5 V |
4mm |
0 °C |
-12 V |
- |
- |
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CMS82C55AZ96 |
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0°C ~ 70°C |
表面贴装型 |
44-LCC(J 形引线) |
44-PLCC(16.58x16.58) |
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24 |
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- |
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卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
无 |
- |
开路漏极 |
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4.5V ~ 5.5V |
并联 |
2.5mA |
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R5F104ACASP#V0 |
RL78/G14 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
21 |
32KB(32K x 8) |
闪存 |
4K x 8 |
4K x 8 |
A/D 8x8/10b |
内部 |
30-LSSOP(0.240",6.10mm 宽) |
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R5F5210BBDFB#30 |
RX200 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RX |
32-位 |
50MHz |
EBI/EMI,I²C,SCI,SPI |
DMA,LVD,POR,PWM,WDT |
122 |
1MB(1M x 8) |
闪存 |
8K x 8 |
96K x 8 |
A/D 16x12b;D/A 2x10b |
内部 |
144-LQFP |
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R5F10Y44ASP#50 |
RL78/G10 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
20MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
10 |
1KB(1K x 8) |
闪存 |
- |
128 x 8 |
A/D 7x8/10b |
内部 |
16-SSOP(0.173",4.40mm 宽) |
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R5F100CCALA#W0 |
RL78/G13 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
26 |
32KB(32K x 8) |
闪存 |
- |
2K x 8 |
A/D 8x8/10b |
内部 |
36-WFLGA |
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TW8809-NA2-CRT |
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表面贴装型 |
56-VFQFN 裸露焊盘 |
56-QFN(8x8) |
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- |
表面贴装型 |
视频显示器 |
卷带(TR) |
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转换器 |
ITU-R.656,NTSC,PAL,SECAM |
I²C |
1.8V,3.3V |
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R5F562N8ADFP#V0 |
RX600 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RX |
32-位 |
100MHz |
EBI/EMI,I²C,SCI,SPI,USB |
DMA,LVD,POR,PWM,WDT |
72 |
512KB(512K x 8) |
闪存 |
- |
96K x 8 |
A/D 8x10/12b,D/A 1x10b |
内部 |
100-LQFP |
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M30624FGPFP#U9C |
M16C™ M16C/60/62P |
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-20°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
M16C/60 |
16-位 |
24MHz |
I²C,IEBus,UART/USART |
DMA,WDT |
85 |
256KB(256K x 8) |
闪存 |
- |
20K x 8 |
A/D 26x10b;D/A 2x8b |
内部 |
100-BQFP |
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R5F104GCAFB#X0 |
RL78/G14 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
34 |
32KB(32K x 8) |
闪存 |
4K x 8 |
4K x 8 |
A/D 10x8/10b |
内部 |
48-LQFP |
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R5F10277DNA#U0 |
RL78/G12 |
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-40°C ~ 85°C(TA) |
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
24MHz |
CSI,I²C,UART/USART |
DMA,POR,PWM,WDT |
22 |
4KB(4K x 8) |
闪存 |
2K x 8 |
512 x 8 |
A/D 11x8/10b |
内部 |
24-WFQFN 裸露焊盘 |
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TW8846-LA1-CE |
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表面贴装型 |
156-LQFP 裸露焊盘 |
156-LQFP-EP(14x20) |
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- |
表面贴装型 |
视频显示器 |
托盘 |
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NTSC,PAL,SECAM |
I²C |
- |
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R1LV1616RBG-7SR#S0 |
- |
易失 |
SRAM |
SRAM |
16Mb (1M x 16) |
70ns |
70ns |
并联 |
0°C ~ 70°C(TA) |
表面贴装 |
48-TFBGA |
48-FBGA(7.5x8.5) |
- |
符合限制有害物质指令(RoHS)规范要求 |
20 周 |
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R5F21284SDSP#U0 |
R8C/2x/28 |
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|
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-40°C ~ 85°C(TA) |
|
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- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
R8C |
16-位 |
20MHz |
I²C,LIN,SIO,SSU,UART/USART |
LED,POR,电压检测,WDT |
13 |
16KB(16K x 8) |
闪存 |
- |
1K x 8 |
A/D 4x10b |
内部 |
20-LSSOP(0.173",4.40mm 宽) |
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DF2319EVTE25V |
H8® H8S/2300 |
|
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|
|
|
|
-20°C ~ 75°C(TA) |
|
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
H8S/2000 |
16-位 |
25MHz |
SCI,智能卡 |
POR,PWM,WDT |
70 |
512KB(512K x 8) |
闪存 |
- |
8K x 8 |
A/D 8x10b;D/A 2x8b |
内部 |
100-TQFP |
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R5F100AGASP#X0 |
RL78/G13 |
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|
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-40°C ~ 85°C(TA) |
|
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|
- |
符合限制有害物质指令(RoHS)规范要求 |
24 周 |
RL78 |
16-位 |
32MHz |
CSI,I²C,LIN,UART/USART |
DMA,LVD,POR,PWM,WDT |
21 |
128KB(128K x 8) |
闪存 |
- |
12K x 8 |
A/D 8x8/10b |
内部 |
30-LSSOP(0.240",6.10mm 宽) |
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