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TLV5618ACP |
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通孔 |
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- |
- |
- |
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PDIP |
8 |
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|
9.81 x 6.35 x 4.57 mm |
4.57 mm |
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|
12 位 |
2 |
串行 (SPI/QSPI/Microwire) |
单 |
3 V 5 V |
外部 |
电阻串 |
10µs |
单极 |
±0.6%FSR |
6.35 mm |
±4LSB |
0 °C |
70 °C |
9.81 mm |
- |
- |
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SN74AC534N |
74AC |
标准 |
D 型 |
三态，反相 |
8 |
10.5ns @ 5V，50pF |
正边沿 |
24mA，24mA |
2 V ~ 6 V |
-40°C ~ 85°C（TA） |
通孔 |
20-DIP（0.300"，7.62mm） |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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视频 |
|
LMH0318RTWT |
- |
|
时钟恢复器 |
|
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|
表面贴装 |
24-WFQFN 裸露焊盘 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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24-WQFN（4x4） |
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PCM1690DCA |
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表面贴装 |
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- |
- |
- |
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HTSSOP |
48 |
|
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12.6 x 6.2 x 1.05 mm |
1.05 mm |
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|
192ksps |
24 位 |
8 |
串行 (I2C/SPI) |
单 |
3.3 V、5 V |
外部 |
电流段 |
|
双极 |
±6%FSR |
6.2 mm |
|
-40 °C |
85 °C |
12.6 mm |
- |
- |
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SN74AUC2G80YZPR |
74AUC |
标准 |
D 型 |
反相 |
1 |
1.8ns @ 2.5V，30pF |
正边沿 |
9mA，9mA |
0.8 V ~ 2.7 V |
-40°C ~ 85°C（TA） |
表面贴装 |
8-XFBGA，DSBGA |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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2：1 多路复用器-放大器 |
|
THS7353PWR |
- |
|
|
满摆幅 |
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|
表面贴装 |
20-TSSOP（0.173"，4.40mm 宽） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
3 |
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20-TSSOP |
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150MHz |
300 V/µs |
85mA |
2.7 V ~ 5.5 V |
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TL7660CD |
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表面贴装 |
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- |
- |
- |
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SOIC |
8 |
|
|
5 x 4 x 1.5mm |
1.5mm |
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|
4mm |
|
-40 °C |
85 °C |
5mm |
- |
- |
电压倍增器 |
3mA |
10 kHz |
10 V |
-10 V |
1.5 V |
-1.5 V |
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- |
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|
-40°C ~ 125°C（TJ） |
表面贴装型 |
8-SOIC（0.154\，3.90mm 宽），7 引线 |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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7-SOIC |
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反激 |
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隔离 |
无 |
- |
21 V |
9V ~ 35V |
- |
680Hz ~ 100kHz |
限流，过压 |
- |
UCC28711DR |
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SN74HC193D |
74HC |
|
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|
4 |
|
正边沿 |
|
|
-40°C ~ 85°C |
表面贴装 |
16-SOIC（0.154"，3.90mm 宽） |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
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|
|
二进制计数器 |
上，下 |
异步 |
同步 |
24MHZ |
2 V ~ 6 V |
16-SOIC |
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SN74LS628NE4 |
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表面贴装 |
|
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- |
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|
|
1.1 → 25 MHz |
- |
- |
- |
0 → 5V |
- |
50% |
SOIC |
14 |
45pF |
方波 |
19.3 x 6.35 x 4.57mm |
4.57mm |
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|
射频收发器、USB 控制器 |
|
CC1110F8RHHT |
|
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|
表面贴装 |
|
|
- |
- |
- |
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|
QFN |
36 |
|
|
6.1 x 6.1 x 0.7mm |
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|
-40 °C |
85 °C |
6.1mm |
|
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|
3.6 V |
|
2 V |
|
微控制器 |
CMOS |
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|
ISO721DR |
- |
|
通用 |
|
|
|
|
|
|
-40°C ~ 125°C |
表面贴装型 |
8-SOIC（0.154\，3.90mm 宽） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
|
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8-SOIC |
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容性耦合 |
|
|
|
3V ~ 5.5V |
|
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|
|
无 |
1 |
1/0 |
单向 |
2500Vrms |
25kV/µs |
100Mbps |
24ns，24ns |
2ns |
1ns，1ns |
|
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|
|
|
|
|
74LVC1G125DBVRG4 |
74LVC |
|
|
推挽式 |
1 |
|
|
|
|
-40°C ~ 125°C（TA） |
表面贴装 |
SC-74A，SOT-753 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
|
|
|
|
缓冲器，非反向 |
|
|
|
|
|
SOT-23-5 |
- |
32mA，32mA |
1.65 V ~ 5.5 V |
|
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|
LM96000CIMTX |
|
硬件监控器 |
|
2 线 SMBus |
|
|
|
|
3 V ~ 3.6 V |
0°C ~ 85°C |
表面贴装 |
|
|
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
|
|
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|
24-TSSOP |
|
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|
|
内部和外部 |
0°C ~ 125°C |
±3°C 本地（最大），±4°C 远程（最大） |
ADC（三角积分），比较器，风扇控制，多路复用器，寄存器组 |
无 |
是 |
24-TSSOP（0.173"，4.40mm 宽） |
|
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LMH2100TM/NOPB |
- |
|
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|
|
表面贴装型 |
6-WFBGA，DSBGA |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
|
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|
6-DSBGA |
|
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±0.5dB |
|
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|
|
50MHz ~ 4GHz |
手机，W-CDMA，CDMA，GSM，UMTS |
-45dBm ~ -5dBm |
2.7V ~ 3.3V |
9.2 mA |
|
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|
|
ISO7342FCDWR |
- |
|
通用 |
|
|
|
|
|
|
-40°C ~ 125°C |
表面贴装型 |
16-SOIC（0.295\，7.50mm 宽） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
|
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16-SOIC |
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|
容性耦合 |
|
|
|
3V ~ 5.5V |
|
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|
|
无 |
4 |
2/2 |
单向 |
3000Vrms |
25kV/µs |
25Mbps |
58ns，58ns |
4.1ns |
2.1ns，1.7ns |
|
|
|
|
|
|
|
|
SN74AHCT1G02DCKR |
74AHCT |
|
|
|
|
7.5ns @ 5V，50pF |
|
8mA，8mA |
4.5 V ~ 5.5 V |
-40°C ~ 85°C |
表面贴装 |
5-TSSOP，SC-70-5，SOT-353 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
1 |
2 |
- |
1µA |
0.8V |
2V |
或非门 |
|
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|
|
SC-70-5 |
|
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|
UCC5618QP |
|
|
SCSI |
|
|
|
|
|
- |
0°C ~ 70°C |
表面贴装 |
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
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|
|
28-PLCC（11.51x11.51） |
|
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28-LCC（J 形引线） |
18 |
|
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ISO7221BD |
- |
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通用 |
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-40°C ~ 125°C |
表面贴装型 |
8-SOIC（0.154\，3.90mm 宽） |
管件 |
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8-SOIC |
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容性耦合 |
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3V ~ 5.5V |
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无 |
2 |
1/1 |
单向 |
2500Vrms |
25kV/µs |
5Mbps |
70ns，70ns |
3ns |
1ns，1ns |
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是 |
PCA9534ARGTR |
- |
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推挽式 |
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-40°C ~ 85°C |
表面贴装型 |
16-VFQFN 裸露焊盘 |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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POR |
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16-VQFN（3x3） |
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2.3V ~ 5.5V |
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8 |
I²C，SMBus |
10mA，25mA |
400 kHz |
