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SOIC |
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DS2003CM/NOPB |
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表面贴装 |
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- |
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16 |
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|
19.81 x 6.35 x 3.302 mm |
19.81 mm |
6.35 mm |
|
0.5 A |
7 |
共发射极 |
-40 °C |
3.302 mm |
85 °C |
- |
- |
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|
SN74AUC1G240DCKR |
74AUC |
缓冲器，反向 |
1 |
- |
推挽式 |
9mA，9mA |
0.8 V ~ 2.7 V |
-40°C ~ 85°C（TA） |
表面贴装 |
SC-70-5 |
5-TSSOP，SC-70-5，SOT-353 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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4 |
2 |
- |
4.5 V ~ 5.5 V |
2µA |
4mA，4mA |
0.8V |
2V |
22ns @ 5.5V，50pF |
SN74HCT32DR |
74HCT |
或门 |
|
|
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|
|
-40°C ~ 85°C |
表面贴装 |
14-SOIC |
14-SOIC（0.154"，3.90mm 宽） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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TSSOP |
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DAC7821IPW |
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表面贴装 |
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- |
- |
- |
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20 |
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6.5 x 4.4 x 1.15 mm |
6.5 mm |
4.4 mm |
|
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|
-40 °C |
1.15 mm |
125 °C |
- |
|
12 位 |
1 |
并行 |
单 |
20.4Msps |
3.3 V, 5 V |
外部 |
R-2R，电阻串 |
0.2µs |
|
±10mV |
±1LSB |
- |
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- |
模拟乘法器/除法器 |
四象限 |
TO-100-10 金属罐 |
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4213AM |
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TO-100-10 |
|
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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SOIC |
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TLV5614CD |
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表面贴装 |
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- |
- |
- |
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16 |
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|
9.9 x 3.91 x 1.58 mm |
9.9 mm |
3.91 mm |
|
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|
0 °C |
1.58 mm |
70 °C |
- |
|
12 位 |
4 |
串行 (SPI/QSPI/Microwire) |
单 |
102ksps |
3 V 5 V |
外部 |
电阻串 |
20µs |
单极 |
±0.6%FSR |
±4LSB |
- |
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时钟恢复器 |
视频切换 |
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|
LMH0366SQX/NOPB |
- |
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|
表面贴装 |
24-WQFN（4x4） |
24-WFQFN 裸露焊盘 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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TSSOP |
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DAC8568IBPW |
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表面贴装 |
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- |
- |
- |
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16 |
|
|
5.1 x 4.5 x 1.05 mm |
5.1 mm |
4.5 mm |
|
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|
-40 °C |
1.05 mm |
125 °C |
- |
|
16 位 |
8 |
串行 （SPI） |
单 |
|
|
内部 |
电阻串 |
10µs |
单极 |
±0.2%FSR |
±12LSB |
- |
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差分 |
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1 |
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|
UA733CDG4 |
- |
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|
差分 |
|
|
|
表面贴装 |
14-SOIC |
14-SOIC（0.154"，3.90mm 宽） |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
- |
- |
3.6mA |
- |
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HTSSOP |
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PCM1690DCA |
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表面贴装 |
|
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- |
- |
- |
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|
48 |
|
|
12.6 x 6.2 x 1.05 mm |
12.6 mm |
6.2 mm |
|
|
|
|
-40 °C |
1.05 mm |
85 °C |
- |
|
24 位 |
8 |
串行 (I2C/SPI) |
单 |
192ksps |
3.3 V、5 V |
外部 |
电流段 |
|
双极 |
±6%FSR |
|
- |
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- |
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|
-40°C ~ 125°C（TJ） |
表面贴装型 |
28-HTSSOP |
28-PowerTSSOP (0.173\，4.40mm Width) |
管件 |
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隔离 |
无 |
- |
全桥 |
14V ~ 100V |
- |
最高 2MHz |
限流，超温，过压 |
频率控制，软启动，同步 |
LM5046MH/NOPB |
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|
TSSOP |
|
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|
SN74LV8153PW |
|
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|
表面贴装 |
|
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|
- |
|
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|
- |
8 |
74LV |
- |
串行至并行 |
1 |
20 |
3 V |
13.2 V |
6.6 x 4.5 x 1.05mm |
6.6mm |
6.6mm |
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HLQFP |
|
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|
TMS32C6713BPYPA200 |
|
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|
表面贴装 |
|
|
|
- |
- |
- |
|
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|
208 |
|
|
28.05 x 28.05 x 1.6mm |
28.05mm |
32Bit |
|
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|
0 °C |
1.6mm |
90 °C |
|
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|
300MHz |
2400MIPS |
32Bit |
64 kB |
DSP |
264 kB |
EPROM |
浮点 |
3.3 V |
1 |
1 |
2 x 32 位 |
32Bit |
2 |
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|
CAN，RS232，RS485，SPI |
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|
|
ISO6761FDWR |
ISO676x |
|
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|
|
|
|
-40°C ~ 125°C |
表面贴装型 |
16-SOIC |
16-SOIC（0.295\，7.50mm 宽） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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|
容性耦合 |
无 |
6 |
5/1 |
单向 |
5000Vrms |
50kV/µs |
50Mbps |
18ns，18ns |
7ns |
4.5ns，4.5ns（最大） |
1.71V ~ 1.89V，2.25V ~ 5.5V |
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|
TPS65262-1RHBR |
|
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|
|
|
|
|
|
表面贴装 |
32-VQFN（5x5） |
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
21 周 |
|
|
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|
32-VFQFN 裸露焊盘 |
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|
TSSOP |
|
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|
SN74CBTD3306CPW |
|
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|
- |
- |
- |
|
|
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|
CBT |
|
|
2 |
8 |
4.5 V |
5.5 V |
3.1 x 4.5 x 1.05mm |
3.1mm |
4.5mm |
|
|
|
|
-40 °C |
1.05mm |
85 °C |
|
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|
1 x 1:1 |
2 |
2 |
20Ω |
1.5mA |
0.15 ns@ 50 pF |
50pF |
2Bit |
1 |
1 |
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通用 |
|
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|
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|
|
|
ISO7840DWWR |
- |
|
|
|
|
|
|
-55°C ~ 125°C |
表面贴装型 |
16-SOIC |
16-SOIC（0.551\，14.00mm 宽） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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|
容性耦合 |
无 |
4 |
4/0 |
单向 |
5700Vrms |
100kV/µs |
100Mbps |
16ns，16ns |
4.1ns |
1.7ns，1.9ns |
2.25V ~ 5.5V |
|
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ISO7241MDW |
- |
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-40°C ~ 125°C |
表面贴装型 |
16-SOIC |
16-SOIC（0.295\，7.50mm 宽） |
管件 |
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容性耦合 |
无 |
4 |
3/1 |
单向 |
2500Vrms |
25kV/µs |
150Mbps |
23ns，23ns |
2ns |
2ns，2ns |
3.15V ~ 5.5V |
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JK 型 |
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设置（预设）和复位 |
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CD74AC109M96 |
74AC |
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补充型 |
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-55°C ~ 125°C（TA） |
表面贴装型 |
16-SOIC |
16-SOIC（0.154\，3.90mm 宽） |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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1.5V ~ 5.5V |
2 |
1 |
100 MHz |
10.3ns @ 5V，50pF |
正边沿 |
24mA，24mA |
4 µA |
10 pF |
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是 |
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POR |
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PCA9554ADW |
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推挽式 |
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-40°C ~ 85°C |
表面贴装型 |
16-SOIC |
16-SOIC（0.295\，7.50mm 宽） |
管件 |
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2.3V ~ 5.5V |
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400 kHz |
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8 |
I²C，SMBus |
10mA，25mA |
