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501HCA27M0000CAG |
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DFN |
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±20ppm |
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- |
- |
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4 |
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2.5 x 3.2 x 0.9mm |
0.9mm |
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2.5mm |
85 °C |
3.2mm |
-40 °C |
27MHz |
3.63 V |
1.71 V |
- |
- |
- |
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表面贴装 |
M1325-2JJ08-24.576MHZ |
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表面贴装 |
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±30ppm |
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5x3.2mm SMD |
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±30ppm |
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4 |
8pF |
5 x 3.2 x 0.8mm |
0.8mm |
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5mm |
85°C |
3.2mm |
-40°C |
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XO（标准） |
NZ2520SB-32.768KHZ-NSA3535C |
待机 （断电） |
2.5V |
±30ppm |
-40°C ~ 85°C |
0.035"（0.90mm） |
260µA |
表面贴装 |
4-SMD，无引线 |
0.098" 长 x 0.079" 宽（2.50mm x 2.00mm） |
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剪切带（CT） |
NZ2520S |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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驻极体电容 |
EA-21939-000 |
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散装 |
EA |
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符合限制有害物质指令(RoHS)规范要求 |
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模拟 |
全向 |
100Hz ~ 4.8kHz |
-59dB ±3dB @ 74dB SPL |
- |
3.5 千欧 |
1.3V |
- |
50µA |
侧面 |
焊盘 |
0.219" 长 x 0.157" 宽（5.56mm x 3.99mm） |
0.089"（2.26mm） |
矩形 |
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CMEMS® |
SI50122-A1-GM |
HCSL，LVCMOS |
2.25 V ~ 3.63 V |
100ppm |
-40°C ~ 85°C |
0.035"（0.90mm） |
23mA |
表面贴装 |
10-VFDFN |
0.098" 长 x 0.079" 宽（2.50mm x 2.00mm） |
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管件 |
SI50122-A1 |
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符合限制有害物质指令(RoHS)规范要求 |
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XO（标准） |
SHA000001 |
HCSL |
3.3V |
±50ppm |
-40°C ~ 85°C |
0.079"（2.00mm） |
40mA |
表面贴装 |
6-SMD，无引线 |
0.276" 长 x 0.197" 宽（7.00mm x 5.00mm） |
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剪切带（CT） |
SaRonix-eCera™ SH |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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CSTLS10M0G53-A0 |
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通孔 |
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±0.5% |
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- |
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±0.2% |
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3 |
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8 x 3 x 5.5 mm |
5.5 mm |
10MHz |
8 mm |
80 °C |
3 mm |
-20 °C |
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XO（标准） |
ECS-3953C-320-TR |
启用/禁用 |
3.3V |
±100ppm |
0°C ~ 70°C |
0.069"（1.75mm） |
8mA |
表面贴装 |
4-SMD，无引线 |
0.276" 长 x 0.197" 宽（7.00mm x 5.00mm） |
- |
标准卷带 |
ECS-3953C |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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通孔 |
ABLS-12.000MHZ-L4Q-T |
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通孔 |
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±30ppm |
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HC/49US |
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2 |
16pF |
8.0 x 3.0mm |
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TCXO |
TXETBLSANF-26.000000 |
- |
2.8 V ~ 3.3 V |
±1ppm |
-40°C ~ 85°C |
0.039"（1.00mm） |
2mA |
表面贴装 |
4-SMD，无引线 |
0.126" 长 x 0.098" 宽（3.20mm x 2.50mm） |
- |
剪切带（CT） |
TX |
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符合限制有害物质指令(RoHS)规范要求 |
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CSTCE8M00G55Z-R0 |
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表面贴装 |
表面安装 |
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±0.5% |
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- |
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±0.2% |
±0.1 %/yr |
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3 |
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3.2 x 1.3 x 0.7 mm |
0.7 mm |
8MHz |
3.2 mm |
80 °C |
1.3 mm |
-20 °C |
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MHz 晶体 |
XZCBELNANF-24.000000 |
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±30ppm |
-40°C ~ 85°C |
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表面贴装 |
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标准卷带 |
XZ |
24MHz |
±10ppm |
10pF |
100 欧姆 |
基谐 |
4-SMD，无引线 |
0.022"（0.55mm） |
- |
- |
符合限制有害物质指令(RoHS)规范要求 |
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0.081" 长 x 0.065" 宽（2.05mm x 1.65mm） |
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通孔 |
QCL24.0000F18B23B |
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通孔 |
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±20ppm |
40Ω |
HC-49/U-S |
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±30ppm |
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2 |
18pF |
11.05 x 4.65 x 3.5mm |
3.5mm |
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11.05mm |
85°C |
4.65mm |
-40°C |
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MHz 晶体 |
MP196A-E |
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±50ppm |
-40°C ~ 85°C |
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通孔 |
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散装 |
MP |
19.6608MHz |
±30ppm |
20pF |
25 欧姆 |
基谐 |
HC49/U |
0.530"（13.46mm） |
- |
- |
符合限制有害物质指令(RoHS)规范要求 |
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0.427" 长 x 0.150" 宽（10.85mm x 3.80mm） |
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XO（标准） |
KC3225K22.5792C10E00 |
CMOS |
1.6 V ~ 3.63 V |
±50ppm |
-10°C ~ 70°C |
0.032"（0.80mm） |
3.5mA |
表面贴装 |
4-SMD，无引线 |
0.126" 长 x 0.098" 宽（3.20mm x 2.50mm） |
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标准卷带 |
KC3225K，Kyocera |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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MEMS（硅） |
TD-7.3728MBD-T |
启用/禁用 |
3.3V |
±25ppm |
-40°C ~ 85°C |
0.031"（0.80mm） |
25mA |
表面贴装 |
4-SMD，无引线 |
0.098" 长 x 0.079" 宽（2.50mm x 2.00mm） |
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标准卷带 |
TD |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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表面贴装 |
E1SEA18-8.000M TR |
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表面贴装 |
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30ppm |
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带装和卷装 |
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18pF |
3.2mm |
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MHz 晶体 |
402F374XXCAR |
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±15ppm |
-20°C ~ 70°C |
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表面贴装 |
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标准卷带 |
402 |
37.4MHz |
±15ppm |
10pF |
60 欧姆 |
基谐 |
4-SMD，无引线 |
0.022"（0.55mm） |
- |
- |
符合限制有害物质指令(RoHS)规范要求 |
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0.079" 长 x 0.063" 宽（2.00mm x 1.60mm） |
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TCETDLSANF-10.0MHz |
削峰正弦波 |
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表面贴装 |
SMT |
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±2ppm |
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- |
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10 MHz |
±2.5ppm |
±1 ppm/年 |
- |
温度 |
55% |
10 |
10pF |
7 x 5 x 2mm |
2mm |
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VCXO |
BR-61.4400MBE-T |
启用/禁用 |
3.3V |
±50ppm |
-40°C ~ 85°C |
0.059"（1.50mm） |
60mA |
表面贴装 |
6-SMD，无引线 |
0.276" 长 x 0.197" 宽（7.00mm x 5.00mm） |
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标准卷带 |
BR |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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