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AD7528JNZ |
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通孔 |
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- |
- |
- |
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PDIP |
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-40°C |
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20 |
26.16 x 6.35 x 3.3 mm |
26.16 mm |
6.35 mm |
3.3 mm |
|
8 位 |
2 |
并行 |
单 |
5.6Msps |
9 V，12 V |
外部 |
R-2R，电阻串 |
0.4µs |
|
±6LSB |
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±1LSB |
85°C |
- |
- |
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24 |
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AD7730LBRUZ-REEL7 |
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24-TSSOP |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
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- |
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24-TSSOP（0.173"，4.40mm 宽） |
1 |
125mW |
2.7 V ~ 5.25 V |
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AD5621BKSZ-500RL7 |
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表面贴装 |
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- |
- |
- |
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SC-70 |
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-40 °C |
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6 |
2.2 x 1.35 x 1 mm |
2.2 mm |
1.35 mm |
1 mm |
|
12 位 |
1 |
串行 （SPI） |
单 |
|
2.7 → 5.5 V |
内部 |
电阻串 |
10µs |
双极 |
±0.5mV |
|
±1LSB |
125 °C |
- |
- |
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AD736KRZ-R7 |
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2.8V，-3.2V ~ ±16.5V |
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8-SOIC（0.154"，3.90mm 宽） |
表面贴装 |
8-SOIC |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
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160µA |
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AD9708ARUZ |
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表面贴装 |
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- |
- |
- |
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TSSOP |
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-40 °C |
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28 |
9.7 x 4.4 x 1.05 mm |
9.7 mm |
4.4 mm |
1.05 mm |
|
8 位 |
1 |
并行 |
单 |
125Msps |
5 V |
外部，内部 |
分段 |
0.035µs |
|
±10%FSR |
|
±0.5LSB |
85 °C |
- |
- |
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4 |
256 |
SPI |
易失 |
±20% |
500 ppm/°C |
200 |
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电位计 |
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级联销 |
AD8403ARZ10 |
- |
|
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2.7 V ~ 5.5 V |
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|
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
|
24-SOIC |
管件 |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
- |
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HMC232LP4E |
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- |
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QFN |
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单单刀双掷 |
3.1dB |
37dB |
6ns |
1 |
12GHz |
-40 °C |
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MESFET |
|
24 |
4.1 x 4.1 x 0.95mm |
4.1mm |
4.1mm |
0.95mm |
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2 |
256 |
SPI |
易失 |
±30% |
35 ppm/°C |
60 |
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电位计 |
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级联销 |
AD5262BRUZ200-RL7 |
- |
|
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4.5 V ~ 16.5 V，±5V |
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|
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
|
16-TSSOP |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
20 周 |
- |
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AD5620CRMZ-1 |
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表面贴装 |
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- |
- |
- |
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MSOP |
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-40 °C |
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8 |
3 x 1.7 x 1.3 mm |
3 mm |
1.7 mm |
1.3 mm |
|
12 bit |
1 |
串行 （SPI） |
单 |
125ksps |
3 → 5 V |
内部 |
电阻串 |
10µs |
双极 |
-0.15%FSR |
|
±1LSB |
105 °C |
- |
- |
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ADSP-BF533SBBCZ400 |
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|
-40°C ~ 85°C（TA） |
|
表面贴装 |
160-CSPBGA（12x12） |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
- |
|
Blackfin® |
定点 |
SPI，SSP，UART |
400MHz |
ROM（1 kB） |
148kB |
1.20V |
160-LFBGA，CSPBGA |
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AD8842ARZ |
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表面贴装 |
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- |
- |
- |
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SOIC W |
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-40 °C |
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|
24 |
15.6 x 7.6 x 2.35 mm |
15.6 mm |
7.6 mm |
2.35 mm |
|
8 位 |
8 |
串行 （SPI） |
双 |
500ksps |
|
外部 |
R-2R，电阻串 |
5.4µs |
双极 |
2LSB |
±5V |
±1LSB |
85 °C |
- |
- |
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ADE7566ASTZF8-RL |
- |
|
|
2.4 V ~ 3.7 V |
|
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|
-40°C ~ 85°C |
64-LQFP |
表面贴装 |
64-LQFP（10x10） |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
|
- |
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|
4mA |
770 千欧 |
0.1% |
1.3V，2V，2.4V |
0.4V，0.8V |
单相 |
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ROMLess |
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ADSP-21061KSZ-160 |
SHARC |
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表面贴装 |
|
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- |
- |
- |
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MQFP |
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40MHz |
0 °C |
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240 |
32 x 32 x 3.5mm |
32mm |
32Bit |
3.5mm |
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85 °C |
|
|
40MIPS |
32Bit |
1 MB |
哈佛 |
浮点 |
5 V |
1 |
1 |
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|
ARM7® |
16/32-位 |
41.78MHz |
EBI/EMI，I²C，SPI，UART/USART |
POR，PWM，WDT |
126KB（63K x 16） |
闪存 |
- |
8K x 32 |
2.7 V ~ 3.6 V |
A/D 10x12b；D/A 2x12b |
内部 |
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ADUC7124BCPZ126 |
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|
-40°C ~ 125°C（TA） |
|
|
64-LFCSP-VQ（9x9） |
托盘 |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
- |
|
MicroConverter |
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64-VFQFN 裸露焊盘，CSP |
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HMC749LC3C |
- |
T-型 |
补充型 |
|
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|
|
-40°C ~ 85°C（TA） |
16-LFQFN 裸露焊盘 |
表面贴装型 |
16-SMT（3x3） |
带 |
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复位 |
1 |
1 |
26 GHz |
- |
正，负 |
- |
3V ~ 3.6V |
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ADIS16003CCCZ |
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表面贴装 |
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- |
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- |
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LGA |
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2 |
±1.7g |
885LSB/g |
- |
110mg/Hz rms |
12 |
7.33 x 7.33 x 3.6mm |
7.33mm |
7.33mm |
3.6mm |
- |
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I²C，SMBus |
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POR |
MAX7318ATG T |
- |
|
推挽式 |
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|
-40°C ~ 125°C |
24-WFQFN 裸露焊盘 |
表面贴装型 |
24-TQFN（4x4） |
卷带（TR） |
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是 |
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400 kHz |
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2V ~ 5.5V |
16 |
31mA，43mA |
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|
ADCMP606BKSZ-REEL7 |
- |
通用 |
CML，补充型，满摆幅 |
2.5 V ~ 5.5 V |
5mV @ 2.5V |
5µA @ 2.5V |
50mA |
26mA |
50dB CMRR，50dB PSRR |
2.1ns |
-40°C ~ 125°C |
6-TSSOP，SC-88，SOT-363 |
表面贴装 |
SC-70-6 |
标准卷带 |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
- |
|
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12 |
5M |
2 |
差分 |
SPI，DSP |
S/H-ADC |
1：1 |
2 |
SAR |
外部， 内部 |
2.25 V ~ 2.75 V |
2.25 V ~ 2.75 V |
同步采样 |
AD7356BRUZ-500RL7 |
- |
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-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
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16-TSSOP |
剪切带（CT） |
符合限制有害物质指令(RoHS)规范要求 |
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2 |
256 |
I²C |
易失 |
-20%， 55% |
35 ppm/°C |
160 |
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电位计 |
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AD5243BRMZ50 |
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2.7 V ~ 5.5 V |
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-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
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10-MSOP |
管件 |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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