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MX25L3233FM2I-08G |
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表面贴装 |
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32Mbit |
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SOP |
8 |
16M x 2 位,32M x 1 位,8M x 4 位 |
NOR |
2.65 V |
3.6 V |
8M, 16M, 32M |
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1 bit, 2 bit, 4 bit |
5.33 x 5.38 x 1.91mm |
5.38mm |
-40 °C |
85 °C |
5.33mm |
1.91mm |
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MX25V8035FZUI |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
8Mb (1M x 8) |
100µs,4ms |
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SPI |
2.3 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UFDFN 裸露焊盘 |
8-USON(2x3) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L12845EMI-10G |
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表面贴装 |
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128Mbit |
串行 |
SOP |
16 |
128M x 1 位,32M x 4 位,64M x 2 位 |
NOR |
2.7 V |
3.6 V |
32M, 64M, 128M |
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1 bit, 2 bit, 4 bit |
10.5 x 7.6 x 2.44mm |
7.6mm |
-40 °C |
85 °C |
10.5mm |
2.44mm |
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MX25V2006EZNI-13G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
2Mb (256K x 8) |
50µs,1ms |
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SPI |
2.35 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL256FUXFI-11G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
256Mb (32M x 8) |
110ns |
110ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
64-LBGA,CSPBGA |
64-LFBGA,CSP(11x13) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L1606EM1I-12G |
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表面贴装 |
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16Mbit |
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SOP |
8 |
16M x 1 位,8M x 2 位 |
NOR |
2.7 V |
3.6 V |
8M, 16M |
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1 bit, 2 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX29GL320EHT2I-70G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
56-TFSOP(0.724",18.40mm 宽) |
56-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L4006EZUI-12G TR |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
50µs,3ms |
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SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UFDFN 裸露焊盘 |
8-USON(2x3) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29F040CTI-70G |
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表面贴装 |
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4Mbit |
并行 |
TSOP |
32 |
512K x 8 位 |
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4.5 V |
5.5 V |
512K |
70ns |
8Bit |
18.5 x 8.1 x 1.05mm |
8.1mm |
-40 °C |
85 °C |
18.5mm |
1.05mm |
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MX25U8033EM2I-12G |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
8Mb (1M x 8) |
30µs,3ms |
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SPI |
1.65 V ~ 2 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL320ELT2I-70G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
56-TFSOP(0.724",18.40mm 宽) |
56-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX30LF1G08AA-TI |
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表面贴装 |
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1Gbit |
并行 |
TSOP |
48 |
128M x 8 位 |
NAND |
2.7 V |
3.6 V |
128M |
25ns |
8Bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
12.1mm |
1.05mm |
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MX29LV040CQI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
32-LCC(J 形引线) |
32-PLCC(11.43x14.05) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25V1635FM2I |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
16Mb (2M x 8) |
100µs,4ms |
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SPI |
2.3 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L3235EM2I-10G |
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表面贴装 |
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- |
- |
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32Mbit |
串行 |
SOP |
8 |
16M x 2 位,32M x 1 位,8M x 4 位 |
NOR |
2.7 V |
3.6 V |
8M, 16M, 32M |
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1 bit, 2 bit, 4 bit |
5.38 x 5.33 x 1.91mm |
5.33mm |
-40 °C |
85 °C |
5.38mm |
1.91mm |
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MX25L2006EZUI-12G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
2Mb (256K x 8) |
50µs,3ms |
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SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UFDFN 裸露焊盘 |
8-USON(2x3) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L3206EM2I-12G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
50µs,3ms |
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SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L3233FM1I-08G |
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表面贴装 |
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32Mbit |
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SOP |
8 |
16M x 2 位,32M x 1 位,8M x 4 位 |
NOR |
2.65 V |
3.6 V |
8M, 16M, 32M |
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1 bit, 2 bit, 4 bit |
5.03 x 4 x 1.55mm |
4mm |
-40 °C |
85 °C |
5.03mm |
1.55mm |
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MX25U3235FZNI-10G |
MX25xxx35/36 - MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
30µs,3ms |
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SPI |
1.65 V ~ 2 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L3206EZNI-12G |
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
50µs,3ms |
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SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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