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dsPIC33FJ64MC802-I/MM |
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表面贴装 |
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QFN-S |
28 |
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16Bit |
6 x 6 x 0.95mm |
-40 °C |
85 °C |
6mm |
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40MIPS |
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16Bit |
16 kB |
RISC |
64 kB |
闪存 |
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3.3 V |
2 |
1 |
1 |
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16Bit |
6 |
2, 6 |
2 |
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6 x 10/12 位 |
10 bit, 12 bit |
1 |
6 |
2 x 16 位，4（16 位）6 x 16 位 |
5 x 16 位 |
16Bit |
5 |
0.95mm |
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I²C，串行 |
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1.7 V ~ 3.6 V |
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MAX11803ETC |
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-40°C ~ 85°C |
12-WQFN 裸露焊盘 |
12-TQFN（4x4） |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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12 b |
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表面贴装 |
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ADSP-SC589BBCZ-4B |
SHARC |
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表面贴装 |
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BGA |
529 |
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32Bit |
19.1 x 19.1 x 1.11mm |
-40 °C |
125 °C |
19.1mm |
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450MHz |
720MIPS |
32Bit |
640 kB |
RISC |
512 kB |
ROM |
固定点、浮点 |
1.1 V，3.3 V |
3 |
2 |
3 |
1 |
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1 |
3 |
3 |
1 |
1（8 x 12 位） |
12Bit |
1 |
8 |
1（3 通道） |
1（8 通道） |
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1 |
1.11mm |
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DSPIC30F6012A-20E/PT |
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表面贴装 |
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TQFP |
64 |
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16Bit |
10 x 10 x 1.05mm |
-40 °C |
125 °C |
10mm |
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20MHz |
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16Bit |
8.192 kB |
RISC |
144 kB |
闪存 |
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3 → 5.5 V |
2 |
2 |
1 |
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16Bit |
8 |
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2 |
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1（16 x 12 位） |
12Bit |
1 |
16 |
8 x 16 位 |
5 x 16 位 |
16Bit |
5 |
1.05mm |
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ADSP-BF561SKBZ600 |
Blackfin |
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表面贴装 |
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PBGA |
297 |
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16Bit |
27.2 x 27.2 x 1.83mm |
0 °C |
70 °C |
27.2mm |
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600MHz |
600MIPS |
16Bit |
32 kB |
RISC |
328 kB |
闪存 |
ALU |
1.35 V，3.3 V |
1 |
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1 |
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12 x 32位 |
32Bit |
12 |
1.83mm |
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2 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V，±2.2 V ~ 2.7 V |
±30% |
500 ppm/°C |
50 |
AD5207BRUZ10-RL7 |
- |
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电位计 |
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级联销 |
-40°C ~ 125°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
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AD7823YRZ |
- |
8 |
200k |
1 |
个伪差分 |
SPI |
S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.7 V ~ 5.5 V |
2.7 V ~ 5.5 V |
- |
-40°C ~ 125°C |
8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V |
±33% |
700 ppm/°C |
200 |
AD8403AR1 |
- |
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电位计 |
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级联销 |
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
24-SOIC |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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AD7193BCPZ |
- |
24 |
- |
4，8 |
差分，个伪差分 |
SPI，DSP |
MUX-PGA-ADC |
- |
1 |
三角积分 |
外部 |
3 V ~ 5.25 V |
2.7 V ~ 5.25 V |
PGA |
-40°C ~ 105°C |
32-VFQFN 裸露焊盘，CSP |
32-LFCSP-VQ（5x5） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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1 |
256 |
I²C |
非易失 |
2.7 V ~ 5.5 V |
±30% |
500 ppm/°C |
75 |
AD5259BRMZ50 |
- |
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电位计 |
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可选地址 |
-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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SPI |
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2.2 V ~ 5.25 V |
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TSC2046EIPWG4 |
- |
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-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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12 b |
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内部 |
780µA |
表面贴装 |
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ADSP-2191MBSTZ-140 |
ADSP-21xx |
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表面贴装 |
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LQFP |
144 |
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16Bit |
20 x 20 x 1.45mm |
-40 °C |
85 °C |
20mm |
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40MHz |
140MIPS |
16Bit |
160 kB |
DSP |
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ROMLess |
MAC |
2.37 → 2.63 V，2.97 → 3.6 V |
2 |
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2 |
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1 |
1.45mm |
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AD7569BNZ |
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- |
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8 位 |
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通孔 |
1 |
1 |
200kHz |
46dB |
4µs |
PDIP |
24 |
±2LSB |
双，单 |
±5.25V |
6.61mm |
31.9 x 6.61 x 3.3mm |
-40 °C |
85 °C |
31.9mm |
- |
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TMSDC6722BRFPA225 |
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- |
- |
- |
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表面贴装 |
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HTQFP |
144 |
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32 bit, 64 bit |
20.2 x 20.2 x 1.2mm |
-40 °C |
105 °C |
20.2mm |
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350MHz |
2800MIPS |
32 bit, 64 bit |
128 kB |
DSP |
32 kB |
EPROM |
浮点 |
3.3 V |
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1 |
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1 |
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1.2mm |
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TMS320VC5502PGF300 |
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- |
- |
- |
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表面贴装 |
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LQFP |
176 |
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32Bit |
24 x 24 x 1.4mm |
-40 °C |
85 °C |
24mm |
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300MHz |
600MIPS |
32Bit |
64 kB |
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32 kB |
DARAM，ROM |
固定点 |
1.26 V, 3.3 V |
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1.4mm |
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dsPIC33FJ128GP202-I/MM |
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- |
- |
- |
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表面贴装 |
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QFN S |
28 |
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16Bit |
6 x 6 x 0.88mm |
-40 °C |
85 °C |
6mm |
|
40MHz |
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16Bit |
8 kB |
RISC |
128 kB |
闪存 |
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3.3 V |
2 |
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1 |
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2 |
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10 通道 x 10 位，10 通道 x 12 位 |
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5 |
0.88mm |
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1 |
128 |
I²C |
易失 |
2.7 V ~ 5.5 V |
±20% |
45 ppm/°C |
150 |
AD5246BKSZ10-RL7 |
- |
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变阻器 |
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- |
-40°C ~ 125°C |
6-TSSOP，SC-88，SOT-363 |
SC-70-6 |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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1 |
64 |
按钮 |
非易失 |
2.3 V ~ 5.5 V |
±8% |
35 ppm/°C |
70 |
AD5116BCPZ80-RL7 |
- |
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电位计 |
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- |
-40°C ~ 125°C |
8-UFDFN 裸露焊盘，CSP |
8-LFCSP-UD（2x2） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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AD7788BRMZ |
- |
16 |
16.6 |
1 |
差分 |
SPI，DSP |
ADC |
- |
1 |
三角积分 |
外部 |
2.5 V ~ 5.25 V |
2.5 V ~ 5.25 V |
- |
-40°C ~ 85°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
21 周 |
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1.4 V ~ 5.25 V |
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CS4354-CSZ |
- |
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192k |
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-40°C ~ 85°C |
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DAC，音频 |
24 b |
模拟和数字 |
I²S |
表面贴装 |
14-SOIC（0.154"，3.90mm 宽） |
14-SOIC |
- |
符合限制有害物质指令(RoHS)规范要求 |
21 周 |
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