|
|
|
|
|
|
|
|
|
|
2 |
8µs |
Voltage - Buffered |
无 |
±0.15，±0.02 |
AD5302ARMZ |
- |
8 |
|
|
|
SPI，DSP |
|
|
|
电阻串 DAC |
外部 |
2.5 V ~ 5.5 V |
2.5 V ~ 5.5 V |
|
-40°C ~ 105°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V，±2.3 V ~ 2.7 V |
±30% |
700 ppm/°C |
50 |
|
|
|
|
|
AD5204BRZ100 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销，可选地址 |
-40°C ~ 85°C |
24-SOIC（0.295"，7.50mm 宽） |
24-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1 |
64 |
I²C |
OTP |
2.7 V ~ 5.5 V |
±30% |
35 ppm/°C |
60 |
|
|
|
|
|
AD5171BRJZ10-R2 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
可选地址 |
-40°C ~ 125°C |
SOT-23-8 |
SOT-23-8 |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2 |
256 |
I²C |
易失 |
2.7 V ~ 5.5 V，±2.3 V ~ 2.7 V |
-30%， 50% |
30 ppm/°C |
60 |
|
|
|
|
|
AD5242BRU100-REEL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
可选地址 |
-40°C ~ 105°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
剪切带（CT） |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
I²C |
|
2.3 V ~ 3.6 V |
|
|
|
|
|
|
|
|
MTCH6301T-I/PT |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
-40°C ~ 85°C |
44-TQFP |
44-TQFP（10x10） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
|
- |
|
|
|
|
|
|
|
|
- |
19mA |
表面贴装 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AD5593RBRUZ |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
|
- |
|
12 位 |
|
|
|
|
|
|
|
|
|
|
表面贴装 |
1 |
8 |
10kHz |
81dB |
6µs |
TSSOP |
16 |
±1 (DAC) LSB, ±2 (ADC) LSB |
0.3%FSR |
单 |
2.7 → 5.5 V |
4.5mm |
5.1 x 4.5 x 1.05mm |
-40 °C |
105 °C |
5.1mm |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
dsPIC30F3013-30I/ML |
DsPIC30F |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
QFN |
44 |
|
|
|
|
16Bit |
8 x 8 x 0.95mm |
-40 °C |
85 °C |
8mm |
|
30MIPS |
30MIPS |
16Bit |
2.048 kB |
RISC |
1.024 kB、24 kB |
闪存 |
|
3.3, 5 V |
2 |
|
1 |
16Bit |
2 |
|
1 |
10 x 12 位 |
12Bit |
1 |
10 |
|
2（16 位） |
3 x 16 位 |
16Bit |
3 |
0.95mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DSPIC30F6014-30I/PF |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
TQFP |
80 |
|
|
|
|
16Bit |
14 x 14 x 1.05mm |
-40 °C |
85 °C |
14mm |
|
30MHz |
|
16Bit |
8.192 kB |
RISC |
144 kB |
闪存 |
|
2.5 → 5.5 V |
2 |
2 |
1 |
16Bit |
8 |
|
2 |
1（16 x 12 位） |
12Bit |
1 |
16 |
|
8 x 16 位 |
5 x 16 位 |
16Bit |
5 |
1.05mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
dsPIC33EP128GS702-I/MM |
DsPIC33EP |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
QFN-S |
28 |
|
|
|
|
16Bit |
6 x 6 x 0.95mm |
-40 °C |
85 °C |
6mm |
|
60MHz |
70MIPS |
16Bit |
8 kB |
DSP |
128 kB |
闪存 |
MAC |
3 → 3.6 V |
2 |
|
2 |
16Bit |
1 |
8 |
3 |
1（11 x 12 位[模拟]），1（5 x 12 位[S 和 H 电路]） |
12Bit |
2 |
11（模拟），5（S 和 H 电路） |
AEC-Q100 |
1（8 x 16 位） |
1（2 x 32 位），1（5 x 16 位） |
16 bit, 32 bit |
2 |
0.95mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AD7938BSUZ-6REEL7 |
- |
12 |
1.5M |
4，7，8 |
差分，个伪差分，单端 |
并联 |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
外部， 内部 |
2.7 V ~ 5.25 V |
2.7 V ~ 5.25 V |
- |
-40°C ~ 85°C |
32-TQFP |
32-TQFP（7x7） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2 |
7µs |
Voltage - Buffered |
无 |
±8，±1（最大） |
AD5663RBRMZ-3 |
nanoDAC |
16 |
|
|
|
SPI，DSP |
|
|
|
电阻串 DAC |
外部， 内部 |
2.7 V ~ 3.6 V |
2.7 V ~ 3.6 V |
|
-40°C ~ 105°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1 |
1024 |
SPI |
非易失 |
9 V ~ 33 V，±9 V ~ 16.5 V |
±1% |
35 ppm/°C |
60 |
|
|
|
|
|
AD5292BRUZ-50 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1 |
64 |
I²C |
非易失 |
1.8 V ~ 5.5 V，2.3 V ~ 5.5 V |
±8% |
35 ppm/°C |
70 |
|
|
|
|
|
AD5112BCPZ80-RL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
- |
-40°C ~ 125°C |
8-UFDFN 裸露焊盘，CSP |
8-LFCSP-UD（2x2） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
10 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1.71 V ~ 1.89 V |
|
|
|
|
|
|
|
|
CS53L30-CNZ |
- |
|
16k |
|
|
|
|
|
|
|
|
|
|
|
-10°C ~ 70°C |
|
|
|
|
|
|
ADC，音频 |
24 b |
单电源 |
I²S |
表面贴装 |
32-VFQFN 裸露焊盘 |
32-QFN（5x5） |
- |
符合限制有害物质指令(RoHS)规范要求 |
17 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
UART |
|
2.7 V ~ 5.5 V |
|
|
|
|
|
|
|
|
LM8500HVA9 |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
0°C ~ 70°C |
44-LCC（J 形引线） |
44-PLCC（16.51x16.51） |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
|
|
10 b |
|
|
|
|
|
|
|
|
- |
11.5mA |
表面贴装 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DSPIC33EP128GM304-I/PT |
DsPIC33EP |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
TQFP |
44 |
|
|
|
|
16Bit |
10 x 10 x 1.05mm |
-40 °C |
85 °C |
10mm |
|
70MIPS |
70MIPS |
16Bit |
16 kB |
C 编译器，DSP，MCU，改进型哈佛 |
128 kB |
闪存 |
固定点、浮点 |
3 → 3.6 V |
4 |
|
2 |
16Bit |
1 |
12 |
3 |
2（18 X 10/12 位） |
10 bit, 12 bit |
2 |
18 |
|
1（12 x 16 位） |
4 x 32位，9 x 16位 |
16 bit, 32 bit |
4 (32-bit), 9 (16-bit) |
1.05mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ADSP-BF532SBSTZ400 |
Blackfin |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
LQFP |
176 |
|
|
|
|
16Bit |
24 x 24 x 1.4mm |
-40 °C |
85 °C |
24mm |
|
400MHz |
400MIPS |
16Bit |
|
改进型哈佛 |
|
ROM，SRAM |
固定点 |
1.2 V，1.8 V，2.5 V，3.3 V |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1.4mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DSPIC30F5013-20I/PT |
DsPIC30F |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
TQFP |
80 |
|
|
|
|
16Bit |
12 x 12 x 1.05mm |
-40 °C |
85 °C |
12mm |
|
20MIPS |
30MIPS |
16Bit |
4 kB |
RISC |
66 kB |
闪存 |
|
2.5 → 5.5 V |
2 |
2 |
1 |
16Bit |
1 |
8 |
2 |
1（16 x 12 位） |
12Bit |
1 |
16 |
|
1（8 x 16 位） |
5 x 16 位 |
16Bit |
5 |
1.05mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DSPIC33EP128GP502-I/SO |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
表面贴装 |
|
|
|
|
|
SOIC |
28 |
|
|
|
|
16Bit |
17.9 x 7.5 x 2.35mm |
-40 °C |
85 °C |
17.9mm |
|
70MHz |
70MIPS |
16Bit |
16 kB |
C |
128 kB |
闪存 |
|
3 → 3.6 V |
2 |
1 |
2 |
|
|
|
2 |
1（6 x 10/12 位） |
10 bit, 12 bit |
1 |
6 |
|
|
5 x 16/32 位 |
16/32Bit |
5 |
2.4mm |
