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LVDS |
3.3V |
0.051"(1.30mm) |
70mA |
6-SMD,无引线 |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
KC7050Y125.000L30EZU |
KC7050Y-L30EZU,Kyocera |
SO(SAW) |
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0°C ~ 70°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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CMOS |
2.5V, 3.3V |
0.047"(1.20mm) |
25mA |
4-SMD,无引线 |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032A155.520C20E00 |
KC5032A-C2,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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削峰正弦波 |
2.8V |
0.039"(1.00mm) |
2mA |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KT3225F16369ACW28TA0 |
KT3225F,Kyocera |
TCXO |
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-30°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±500ppb |
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SMT |
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PBRC4.00HR50X000 |
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±0.5% |
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表面贴装 |
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- |
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4MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRC8.00HR50X000 |
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±0.5% |
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表面贴装 |
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- |
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8MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRV6.00MR50Y000 |
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±0.5% |
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表面贴装 |
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- |
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6MHz |
±0.5% |
3 |
4.5 x 2 x 1.2 mm |
1.2 mm |
4.5 mm |
125 °C |
2 mm |
-40 °C |
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SMT |
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PBRC4.19GR50X000 |
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±0.5% |
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表面贴装 |
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- |
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4.19MHz |
±0.5% |
2 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRC10.00HR50X0RZ |
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±0.5% |
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表面贴装 |
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- |
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10MHz |
±0.1% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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CX2520DB12000H0FLJC1 |
CX2520DB,Kyocera |
MHz 晶体 |
12MHz |
±10ppm |
12pF |
150 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
0.022"(0.55mm) |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
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CX3225SB12288H0FLJCC |
CX3225SB,Kyocera |
MHz 晶体 |
12.288MHz |
±10ppm |
12pF |
150 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
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SMT |
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PBRC3.58HR50X000 |
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±0.5% |
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表面贴装 |
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- |
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3.58MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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CX3225GB38400D0HEQCC |
CX3225GB,Kyocera |
MHz 晶体 |
38.4MHz |
±20ppm |
8pF |
50 欧姆 |
基谐 |
-10°C ~ 70°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
标准卷带 |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
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CX3225GB18432D0HEQCC |
CX3225GB,Kyocera |
MHz 晶体 |
18.432MHz |
±20ppm |
8pF |
80 欧姆 |
基谐 |
-10°C ~ 70°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
标准卷带 |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
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SMT |
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PBRV8.00HR50Y000 |
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±0.5% |
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表面贴装 |
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- |
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8MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
125 °C |
3.4 mm |
-40 °C |
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SMT |
|
PBRV6.00HR50Y000 |
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±0.5% |
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表面贴装 |
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- |
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6MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
125 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRC5.00HR50X000 |
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±0.5% |
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表面贴装 |
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- |
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5MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRC8.00GR50X000 |
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±0.5% |
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表面贴装 |
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- |
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8MHz |
±0.5% |
2 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
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PBRV4.91HR50Y000 |
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±0.5% |
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表面贴装 |
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- |
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4.91MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
125 °C |
3.4 mm |
-40 °C |
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SMT |
|
PBRC6.00GR50X000 |
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±0.5% |
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表面贴装 |
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- |
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6MHz |
±0.5% |
2 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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SMT |
|
PBRC12.00HR50X0RZ |
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|
±0.5% |
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表面贴装 |
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- |
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|
12MHz |
±0.1% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |