|
|
|
|
|
|
|
CX3225GB27000D0HEQCC |
CX3225GB,Kyocera |
MHz 晶体 |
27MHz |
±20ppm |
8pF |
50 欧姆 |
基谐 |
-10°C ~ 70°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
剪切带(CT) |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
3.5mA |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K16.0000C1GE00 |
KC3225K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
削峰正弦波 |
1.8V |
0.032"(0.80mm) |
2mA |
6-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KT2520F38400ZAW18TEK |
KT2520F,Kyocera |
TCXO |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±500ppb |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
3.5mA |
4-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520K2.04800C10E00 |
KC2520K,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CX2520DB27000H0KLSA1 |
CX2520DB,Kyocera |
MHz 晶体 |
27MHz |
±30ppm |
12pF |
60 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
0.022"(0.55mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
6mA |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K60.0000C1GE00 |
KC3225K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.028"(0.70mm) |
5mA |
4-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520B40.0000C1GE00 |
KC2520B-C1,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
3.3V |
0.071"(1.80mm) |
10mA |
4-SMD,无引线 |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
KC7050A16.3840C3GE00 |
KC7050A-C3,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
表面安装器件 |
|
PBRC3.58HR50X000 |
|
|
|
±0.5% |
|
|
|
|
表面贴装 |
|
|
|
|
- |
|
|
|
3.58MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
|
|
|
|
|
|
|
CX2016DB16000H0FLJC1 |
CX2016DB,Kyocera |
MHz 晶体 |
16MHz |
±10ppm |
12pF |
200 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.079" 长 x 0.063" 宽(2.00mm x 1.60mm) |
0.018"(0.45mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
CMOS |
5V |
0.063"(1.60mm) |
35mA |
4-SMD,无引线 |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
K50-HC0CSE27.0000MR |
K50-HC,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
30mA |
4-SMD,无引线 |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032A100.000C10E00 |
KC5032A-C1,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
5V |
0.063"(1.60mm) |
50mA |
4-SMD,无引线 |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
K50-HC0CSE50.0000MR |
K50-HC,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ST2012SB32768C0HPWBB |
ST2012SB,Kyocera |
kHz 晶体(音叉) |
32.768kHz |
±20ppm |
7pF |
80 千欧 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
2-SMD,无引线 |
0.079" 长 x 0.047" 宽(2.00mm x 1.20mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CX3225SB19200D0FPLCC |
CX3225SB,Kyocera |
MHz 晶体 |
19.2MHz |
±10ppm |
8pF |
80 欧姆 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±20ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
7mA |
4-SMD,无引线 |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032K32.7680C1GE00 |
KC5032K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
6mA |
4-SMD,无引线 |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032K13.5600C1GE00 |
KC5032K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SMT |
|
PBRV4.91HR50Y000 |
|
|
|
±0.5% |
|
|
|
|
表面贴装 |
|
|
|
|
- |
|
|
|
4.91MHz |
±0.5% |
3 |
7.4 x 3.4 x 2 mm |
2 mm |
7.4 mm |
125 °C |
3.4 mm |
-40 °C |
|
|
|
|
|
|
|
CX3225SB24000H0FLJCC |
CX3225SB,Kyocera |
MHz 晶体 |
24MHz |
±10ppm |
12pF |
50 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
CMOS |
5V |
0.063"(1.60mm) |
35mA |
4-SMD,无引线 |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
K50-HC0CSE24.5760MR |
K50-HC,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|