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SA605DK/01,112 |
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SSOP |
20 |
6.6 x 4.5 x 1.4mm |
6.6mm |
4.5mm |
1.4mm |
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- |
15 dB |
500MHz |
0.455MHz |
- |
8 V |
85 °C |
4.5 V |
-40 °C |
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MMA8453QT |
3 |
±2 g, ±4 g, ±8 g |
64 counts/g, 128 counts/g, 256 counts/g |
数字 |
串行 - I2C |
99µg/√Hz |
表面贴装 |
QFN |
16 |
3 x 3 x 1mm |
3mm |
3mm |
1mm |
400kHz |
- |
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表面贴装型 |
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GreenChip™ |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
隔离 |
无 |
- |
反激 |
14.9 V |
9.9V ~ 30V |
- |
25kHz ~ 132.5kHz |
75 W |
超功率，超温，过压 |
- |
-40°C ~ 150°C（TJ） |
8-SOIC（0.154\，3.90mm 宽） |
8-SO |
TEA18363T/1J |
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MMA8653FCR1 |
3 |
±2 g, ±4 g, ±8 g |
64 LSB/g, 128 LSB/g, 256 LSB/g |
数字 |
串行 - I2C |
182µg/√Hz |
表面贴装 |
DFN |
10 |
2 x 2 x 0.95mm |
2mm |
2mm |
0.95mm |
400kHz |
- |
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单单刀双掷 |
2.8dB |
24dB |
20ns |
1 |
1GHz |
SA630D/01,112 |
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BiCMOS |
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SOIC |
8 |
5 x 4 x 1.45mm |
5mm |
4mm |
1.45mm |
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- |
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-40 °C |
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MMA1200KEG |
1 |
±250g |
8.4mV/g |
模拟 |
- |
110 (z)µV/√Hz |
表面贴装 |
SOIC |
16 |
10.45 x 7.6 x 3.3mm |
10.45mm |
7.6mm |
3.3mm |
440Hz |
- |
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TDA8029HL/C207,151 |
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TTL |
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表面贴装 |
LQFP |
32 |
7.1 x 7.1 x 1.45mm |
7.1mm |
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- |
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6 V |
90 °C |
2.7 V |
-40 °C |
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- |
- |
微控制器 |
卡读卡器 |
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SA605D/01,112 |
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SOIC |
20 |
13 x 7.6 x 2.45mm |
13mm |
7.6mm |
2.45mm |
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- |
15 dB |
500MHz |
0.455MHz |
- |
8 V |
85 °C |
4.5 V |
-40 °C |
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MMA7660FCR1 |
3 |
±1.5g |
23.04Counts/g |
模拟，数字 |
串行2线、串行I2C |
- |
表面贴装 |
DFN |
10 |
3 x 3 x 0.95mm |
3mm |
3mm |
0.95mm |
165kHz |
- |
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表面贴装型 |
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GreenChip™ |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
隔离 |
无 |
- |
反激 |
14.9 V |
9.9V ~ 30V |
- |
25kHz ~ 132.5kHz |
75 W |
超功率，超温，过压 |
- |
-40°C ~ 150°C（TJ） |
8-SOIC（0.154\，3.90mm 宽） |
8-SO |
TEA18362LT/1J |
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SA602AD/01,112 |
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SOIC |
8 |
5 x 4 x 1.45mm |
5mm |
4mm |
1.45mm |
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- |
17 dB |
500MHz |
- |
- |
8 V |
85 °C |
4.5 V |
-40 °C |
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MMA2204KEGR2 |
1 |
±100g |
21mV/g |
模拟 |
- |
110 (x)µV/√Hz |
表面贴装 |
SOIC |
16 |
10.45 x 7.6 x 3.3mm |
10.45mm |
7.6mm |
3.3mm |
440Hz |
- |
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表面贴装型 |
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GreenChip™ |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
隔离 |
无 |
- |
反激 |
14.9 V |
0V ~ 120V |
- |
25.5kHz ~ 128kHz |
|
超功率，超温，过压 |
- |
-25°C ~ 125°C（TJ） |
10-SOIC（0.154\，3.90mm 宽） |
10-SO |
TEA19363T/1J |
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单单刀双掷 |
2.8dB |
24dB |
20ns |
1 |
1GHz |
SA630D/01,112 |
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BiCMOS |
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SOIC |
8 |
5 x 4 x 1.45mm |
5mm |
4mm |
1.45mm |
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- |
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-40°C |
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UDA1334BTS/N2,112 |
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表面贴装 |
SSOP |
16 |
5.3 x 4.5 x 1.4 mm |
5.3 mm |
4.5 mm |
1.4 mm |
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- |
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85 °C |
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-40 °C |
内插滤波器 |
100ksps |
2 |
串行 |
单极 |
单 |
2 V |
- |
- |
- |
- |
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SA612AD/01,112 |
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SOIC |
8 |
5 x 4 x 1.45mm |
5mm |
4mm |
1.45mm |
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- |
17 dB |
500MHz |
- |
- |
8 V |
85 °C |
4.5 V |
-40 °C |
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MMA1270KEG |
1 |
±2.5g |
806.3mV/g |
模拟 |
- |
700 (z)µg/√Hz |
表面贴装 |
SOIC |
16 |
10.45 x 7.6 x 3.3mm |
10.45mm |
7.6mm |
3.3mm |
60Hz |
- |
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表面贴装型 |
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- |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
- |
是 |
700V |
反激 |
17 V |
8.5V ~ 35V |
75% |
22.5kHz ~ 50.5kHz |
5 W |
超温，过压，短路 |
- |
-40°C ~ 150°C（TJ） |
8-SOIC（0.154\，3.90mm 宽），7 引线 |
7-SOIC |
TEA1721BT/N1,118 |
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MMA1270KEG |
1 |
±2.5g |
806.3mV/g |
模拟 |
- |
700 (z)µg/√Hz |
表面贴装 |
SOIC |
16 |
10.45 x 7.6 x 3.3mm |
10.45mm |
7.6mm |
3.3mm |
60Hz |
- |
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表面贴装型 |
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PTN3365BSMP |
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表面贴装型 |
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消费视频 |
- |
卷带（TR）,剪切带（CT）,Digi-Reel® 得捷定制卷带 |
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32-VFQFN 裸露焊盘 |
32-HVQFN（5x5） |
|
换挡杆 |
DVI v1.0，HDMI v1.4b |
I²C |
3.0V ~ 3.6V |
