|
|
2 |
256 |
I²C |
易失 |
2.7 V ~ 5.5 V，±2.3 V ~ 2.7 V |
-30%， 50% |
30 ppm/°C |
60 |
|
|
|
|
|
AD5242BRUZ1M |
- |
|
|
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|
|
电位计 |
|
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|
|
|
|
可选地址 |
-40°C ~ 105°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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3.3V，5V |
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|
CS5351-KZZ |
- |
|
192k |
|
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|
-10°C ~ 70°C |
|
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|
ADC，音频 |
24 b |
模拟和数字 |
串行 |
表面贴装 |
24-TSSOP（0.173"，4.40mm 宽） |
24-TSSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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|
AD7997BRUZ-1 |
- |
10 |
188k |
8 |
单端 |
I²C |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.7 V ~ 5.5 V |
2.7 V ~ 5.5 V |
- |
-40°C ~ 85°C |
20-TSSOP（0.173"，4.40mm 宽） |
20-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
25 周 |
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2 |
9µs |
Voltage - Buffered |
无 |
±0.5，±0.05 |
AD5338ARMZ |
- |
10 |
|
|
|
I²C |
|
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|
电阻串 DAC |
外部 |
2.5 V ~ 5.5 V |
2.5 V ~ 5.5 V |
|
-40°C ~ 105°C |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
8-MSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
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dsPIC33FJ64MC202-I/SP |
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- |
- |
- |
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SPDIP |
|
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|
通孔 |
28 |
|
16Bit |
34.67 x 7.24 x 3.3mm |
-40 °C |
85 °C |
34.67mm |
|
40MHz |
|
16Bit |
8 kB |
RISC |
64 kB |
闪存 |
|
3.3 V |
2 |
|
1 |
|
|
|
2 |
6 通道 x 10 位，6 通道 x 12 位 |
|
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|
5 |
3.3mm |
|
|
2 |
256 |
I²C |
易失 |
4.5 V ~ 16.5 V，±5V |
±30% |
30 ppm/°C |
60 |
|
|
|
|
|
AD5282BRUZ200 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
可选地址 |
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
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ADSP-BF532SBSTZ400 |
Blackfin |
|
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- |
- |
- |
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|
LQFP |
|
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|
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|
表面贴装 |
176 |
|
16Bit |
24 x 24 x 1.4mm |
-40 °C |
85 °C |
24mm |
|
400MHz |
400MIPS |
16Bit |
|
改进型哈佛 |
|
ROM，SRAM |
固定点 |
1.2 V，1.8 V，2.5 V，3.3 V |
|
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|
1.4mm |
|
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|
DSPIC30F5013-20I/PT |
DsPIC30F |
|
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- |
- |
- |
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TQFP |
|
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|
表面贴装 |
80 |
|
16Bit |
12 x 12 x 1.05mm |
-40 °C |
85 °C |
12mm |
|
20MIPS |
30MIPS |
16Bit |
4 kB |
RISC |
66 kB |
闪存 |
|
2.5 → 5.5 V |
2 |
2 |
1 |
16Bit |
1 |
8 |
2 |
1（16 x 12 位） |
12Bit |
1 |
16 |
1（8 x 16 位） |
5 x 16 位 |
16Bit |
5 |
1.05mm |
|
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|
DSPIC33EP128GP502-I/SO |
|
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- |
- |
- |
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SOIC |
|
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|
|
表面贴装 |
28 |
|
16Bit |
17.9 x 7.5 x 2.35mm |
-40 °C |
85 °C |
17.9mm |
|
70MHz |
70MIPS |
16Bit |
16 kB |
C |
128 kB |
闪存 |
|
3 → 3.6 V |
2 |
1 |
2 |
|
|
|
2 |
1（6 x 10/12 位） |
10 bit, 12 bit |
1 |
6 |
|
5 x 16/32 位 |
16/32Bit |
5 |
2.4mm |
|
|
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|
SPI |
|
1.6 V ~ 3.6 V |
|
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|
AD7889ACBZ-500R7 |
- |
|
|
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|
|
|
-40°C ~ 85°C |
12-UFBGA，WLCSP |
12-WLCSP（1.51x2.01） |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
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|
12 b |
|
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|
外部 |
10nA |
表面贴装 |
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|
DSPIC33FJ64GS610-I/PT |
|
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- |
- |
- |
|
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|
TQFP |
|
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|
|
|
表面贴装 |
100 |
|
16Bit |
12 x 12 x 1.05mm |
-40 °C |
85 °C |
12mm |
|
40MHz |
|
16Bit |
9 kB |
RISC |
64 kB |
闪存 |
|
3 → 3.6 V |
2 |
1 |
2 |
16Bit |
4 |
18 |
2 |
2（24 x 10 位） |
10Bit |
2 |
24 |
4（18 x 16 位） |
2 x 32位，5 x 16位 |
16 bit, 32 bit |
2, 5 |
1.05mm |
|
|
2 |
256 |
SPI |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
-40%， 20% |
600 ppm/°C |
200 |
|
|
|
|
|
AD5232BRUZ10-REEL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销 |
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
|
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|
ADAS1000-2BSTZ-RL |
|
19 |
|
|
|
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|
|
64-LQFP（10x10） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
- |
5 |
- |
1.71 V ~ 1.89 V |
64-LQFP |
|
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|
AD7795BRUZ |
- |
16 |
470 |
6 |
差分 |
SPI，DSP |
MUX-ADC |
- |
1 |
三角积分 |
外部， 内部 |
2.7 V ~ 5.25 V |
2.7 V ~ 5.25 V |
PGA，温度传感器 |
-40°C ~ 105°C |
24-TSSOP（0.173"，4.40mm 宽） |
24-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
|
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|
2 |
256 |
I²C |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±20% |
650 ppm/°C |
200 |
|
|
|
|
|
AD5252BRUZ100-RL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
可选地址 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
|
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|
TMS320VC5501PGF300 |
|
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- |
- |
- |
|
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|
LQFP |
|
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|
|
表面贴装 |
176 |
|
32Bit |
24 x 24 x 1.4mm |
-40 °C |
85 °C |
24mm |
|
300MHz |
600MIPS |
32Bit |
32 kB |
|
32 kB |
DARAM，ROM |
固定点 |
1.26 V, 3.3 V |
|
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|
1.4mm |
|
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|
dsPIC33EV256GM104-I/ML |
|
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- |
- |
- |
|
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|
QFN |
|
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|
|
|
表面贴装 |
44 |
|
16Bit |
8 x 8 x 0.95mm |
-40 °C |
85 °C |
8mm |
|
70MIPS |
70MIPS |
16Bit |
16 kB |
代码高效 |
256 kB |
闪存 |
|
4.5 → 5.5 V |
2 |
1 |
1 |
16Bit |
1 |
6 |
2 |
1（24 x 10/12 位） |
10 bit, 12 bit |
1 |
24 |
1（6 x 16 位） |
2 x 32位，5 x 16位 |
16 bit, 32 bit |
7 |
0.95mm |
|
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|
DSPIC33FJ06GS101-E/SO |
|
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- |
- |
- |
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|
SOIC |
|
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|
|
|
|
表面贴装 |
18 |
|
16Bit |
11.55 x 7.5 x 2.35mm |
-40 °C |
125 °C |
11.55mm |
|
40MHz |
|
16Bit |
256 B |
RISC |
6 kB |
闪存 |
|
3 → 3.6 V |
1 |
|
1 |
16Bit |
1 |
4 |
1 |
1（6 x 10 位） |
10Bit |
1 |
6 |
1（4 x 16 位） |
2 x 16 位 |
16Bit |
2 |
2.35mm |
|
|
|
|
SPI |
|
2.2 V ~ 5.25 V |
|
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|
|
|
|
|
|
ADS7846NG4 |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
无铅/不符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
|
|
|
|
|
12 b |
|
|
|
|
|
|
|
|
外部，内部 |
500µA |
表面贴装 |
|
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MCP2122-E/SN |
|
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- |
|
- |
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|
SOIC |
|
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|
表面贴装 |
8 |
单 |
3.9mm |
4.9 x 3.9 x 1.25mm |
-40 °C |
125 °C |
4.9mm |
- |
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|
