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I²S |
|
2.7 V ~ 3.6 V |
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TSC2302IRGZRG4 |
- |
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|
-40°C ~ 85°C |
48-VFQFN 裸露焊盘 |
48-VQFN（7x7） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
12 b |
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外部，内部 |
- |
表面贴装 |
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ADAU1452WBCPZ |
SHARC |
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- |
- |
- |
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表面贴装 |
|
LFCSP |
72 |
|
|
|
32Bit |
10.1 x 9.85 x 0.95mm |
-40 °C |
105 °C |
10.1mm |
|
294.912MHz |
294MIPS |
32Bit |
|
DSP |
|
闪存 |
固定点 |
3.3 V |
|
|
1 |
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|
1 |
1（6 x 10 位） |
10Bit |
1 |
6 |
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|
0.95mm |
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1 |
256 |
I²C，SPI |
非易失 |
2.3 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±8% |
35 ppm/°C |
130 |
|
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|
AD5141BCPZ100-RL7 |
- |
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电位计 |
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|
可选地址 |
-40°C ~ 125°C |
16-WFQFN 裸露焊盘，CSP |
16-LFCSP-WQ（3x3） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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2 |
1024 |
SPI |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±8% |
35 ppm/°C |
50 |
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|
ADN2850BCPZ25-RL7 |
- |
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变阻器 |
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级联销 |
-40°C ~ 85°C |
16-WQFN 裸露焊盘，CSP |
16-LFCSP-WQ（5x5） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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AD7993BRUZ-1 |
- |
10 |
188k |
4 |
单端 |
I²C |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.7 V ~ 5.5 V |
2.7 V ~ 5.5 V |
- |
-40°C ~ 125°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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1 |
600µs（标准） |
Current - Unbuffered |
无 |
±0.5（最大），±0.5（最大） |
AD7945BRSZ-REEL |
- |
12 |
|
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|
并联 |
|
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|
R-2R |
外部 |
5V |
5V |
|
-40°C ~ 85°C |
20-SSOP（0.209"，5.30mm 宽） |
20-SSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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1 |
1024 |
SPI |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
-40%， 20% |
600 ppm/°C |
50 |
|
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|
AD5231BRUZ100 |
- |
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电位计 |
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|
级联销 |
-40°C ~ 85°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
17 周 |
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DSPIC33EP128GM706-I/PT |
DsPIC33EP |
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- |
- |
- |
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表面贴装 |
|
TQFP |
64 |
|
|
|
16Bit |
10 x 10 x 1.05mm |
-40 °C |
85 °C |
10mm |
|
70MIPS |
70MIPS |
16Bit |
16 kB |
C 编译器，DSP，MCU，改进型哈佛 |
128 kB |
闪存 |
固定点、浮点 |
3 → 3.6 V |
4 |
2 |
2 |
16Bit |
1 |
12 |
3 |
2（30 X 10/12 位） |
10 bit, 12 bit |
2 |
30 |
1（12 x 16 位） |
4 x 32位，9 x 16位 |
16 bit, 32 bit |
4 (32-bit), 9 (16-bit) |
1.05mm |
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dsPIC33FJ64GP202-I/SO |
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- |
- |
- |
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|
表面贴装 |
|
SOIC W |
28 |
|
|
|
16Bit |
17.9 x 7.5 x 2.05mm |
-40 °C |
85 °C |
17.9mm |
|
40MHz |
|
16Bit |
8 kB |
RISC |
64 kB |
闪存 |
|
3.3 V |
2 |
|
1 |
|
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|
2 |
10 通道 x 10 位，10 通道 x 12 位 |
|
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5 |
2.05mm |
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DSPIC33FJ32GP202-I/SP |
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- |
- |
- |
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|
表面贴装 |
|
SOIC |
28 |
|
|
|
16Bit |
17.9 x 7.5 x 2.35mm |
-40 °C |
85 °C |
17.9mm |
|
40MIPS |
|
16Bit |
2 kB |
RISC |
32 kB |
闪存 |
|
3 → 3.6 V |
1 |
|
1 |
16Bit |
2 |
2 |
1 |
6 x 10/12 位 |
10 bit, 12 bit |
1 |
6 |
2（16 位） |
3 x 16 位 |
16Bit |
3 |
2.35mm |
|
|
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|
串行 |
|
2.2 V ~ 5.25 V |
|
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|
AD7873ACPZ |
- |
|
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|
|
-40°C ~ 85°C |
16-VQFN 裸露焊盘，CSP |
16-LFCSP-VQ（4x4） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
12 b |
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外部，内部 |
- |
表面贴装 |
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LTC1392CS8#PBF |
|
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- |
|
- |
|
10 位 |
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|
表面贴装 |
1 |
SOIC |
8 |
±25LSB |
单 |
4.5 → 6 V |
3.98mm |
5 x 3.98 x 1.49mm |
0 °C |
70 °C |
5mm |
- |
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ADSP-BF533SBBZ500 |
Blackfin |
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- |
- |
- |
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|
表面贴装 |
|
BGA |
169 |
|
|
|
16Bit |
19 x 19 x 1.73mm |
-40 °C |
85 °C |
19mm |
|
500MHz |
500MIPS |
16Bit |
|
改进型哈佛 |
|
ROM，SRAM |
固定点 |
1.2 V, 1.8 V, 2.5 V, 3.3 V |
|
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|
|
1.73mm |
|
|
1 |
1024 |
SPI |
易失 |
9 V ~ 33 V，±9 V ~ 16.5 V |
±1% |
35 ppm/°C |
60 |
|
|
|
|
|
AD5293BRUZ-100 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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1 |
64 |
I²C |
非易失 |
2.7 V ~ 5.5 V |
±30% |
200 ppm/°C |
75 |
|
|
|
|
|
AD5258BRMZ50-R7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
可选地址 |
-40°C ~ 85°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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|
3 V ~ 3.47 V，5V |
|
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|
CS4344-DZZ |
Popguard® |
|
192k |
|
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|
|
-40°C ~ 85°C |
|
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|
|
DAC，音频 |
24 b |
单电源 |
SPI |
表面贴装 |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-TSSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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|
AD7705BNZ |
- |
16 |
500 |
2 |
差分 |
SPI，DSP |
MUX-PGA-ADC |
- |
1 |
三角积分 |
外部 |
2.7 V ~ 3.3 V，5V |
2.7 V ~ 3.3 V，5V |
PGA |
-40°C ~ 85°C |
16-DIP（0.300"，7.62mm） |
16-PDIP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
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2 |
128 |
SPI |
非易失 |
2.3 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±8% |
35 ppm/°C |
55 |
|
|
|
|
|
AD5122BCPZ10-RL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销 |
-40°C ~ 125°C |
16-WFQFN 裸露焊盘，CSP |
16-LFCSP-WQ（3x3） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
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|
ADSP-BF512KSWZ-4 |
Blackfin |
|
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|
- |
- |
- |
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|
|
|
表面贴装 |
|
LQFP |
176 |
|
|
|
16Bit |
24.1 x 24.1 x 1.45mm |
0 °C |
70 °C |
24.1mm |
|
400MHz |
400MIPS |
16Bit |
32 kB |
RISC |
116 kB |
OTP |
ALU |
1.8 V |
2 |
|
|
16Bit |
1 |
3 |
2 |
|
|
|
|
1（3 x 16 位） |
8 x 32位 |
32Bit |
8 |
1.45mm |
|
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|
|
ADSP-2188MBSTZ-266 |
ADSP-21xx |
|
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|
- |
- |
- |
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|
|
|
表面贴装 |
|
LQFP |
100 |
|
|
|
16Bit |
14.05 x 14.05 x 1.45mm |
-40 °C |
85 °C |
14.05mm |
|
66MHz |
66MIPS |
16Bit |
256 kB |
DSP |
48 k 字 |
RAM |
浮点 |
2.75 V、3.3 V |
|
|
|
|
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|
|
|
1 x 16 位 |
16Bit |
1 |
1.45mm |
