|
|
4 |
256 |
SPI |
易失 |
2.7 V ~ 5.5 V |
±30% |
500 ppm/°C |
200 |
|
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|
AD8403ARZ100 |
- |
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电位计 |
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|
级联销 |
-40°C ~ 125°C |
24-SOIC（0.295"，7.50mm 宽） |
24-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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1 |
128 |
I²C |
非易失 |
1.8 V ~ 5.5 V，2.3 V ~ 5.5 V |
±8% |
35 ppm/°C |
70 |
|
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|
AD5110BCPZ80-500R7 |
- |
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电位计 |
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- |
-40°C ~ 125°C |
8-UFDFN 裸露焊盘，CSP |
8-LFCSP-UD（2x2） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
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3 V ~ 3.6 V，5V |
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CS4341A-KSZ |
Popguard® |
|
192k |
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-10°C ~ 70°C |
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DAC，音频 |
24 b |
单电源 |
SPI |
表面贴装 |
16-SOIC（0.154"，3.90mm 宽） |
16-SOIC |
- |
符合限制有害物质指令(RoHS)规范要求 |
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串行 |
|
2.2 V ~ 5.25 V |
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AD7873BRQZ |
- |
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-40°C ~ 85°C |
16-SSOP（0.154"，3.90mm 宽） |
16-QSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
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12 b |
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外部，内部 |
- |
表面贴装 |
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TMS320F2808PZA |
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- |
- |
- |
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表面贴装 |
100MHz |
100MIPS |
32Bit |
36 kB |
哈佛 |
128 kB |
闪存 |
固定点 |
LQFP |
100 |
1.8 V 3.3 V |
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32Bit |
14 x 14 x 1.4mm |
-40°C |
85°C |
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14mm |
1.4mm |
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ADSP-BF512BBCZ-4F4 |
Blackfin |
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- |
- |
- |
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表面贴装 |
400MHz |
|
16 bit, 32 bit |
16（指令 SRAM 缓存）kB，32（指令 SRAM/数据 SRAM/数据 SRAM 缓存）kB |
RISC |
4M 位 |
闪存 |
MAC |
BGA |
168 |
1.14 → 1.47 V |
2 |
|
2 |
|
|
16 bit, 32 bit |
2 |
8 |
2 |
|
16 bit, 32 bit |
12.1 x 12.1 x 1.12mm |
-40 °C |
85 °C |
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8 x 32 位 |
8 x 32位 |
32Bit |
8 |
12.1mm |
1.12mm |
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DSPIC33FJ12GP202-I/SP |
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- |
- |
- |
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通孔 |
40MIPS |
|
16Bit |
1 kB |
RISC |
12 kB |
闪存 |
|
SPDIP |
28 |
3 至 3.6 V |
1 |
|
1 |
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16Bit |
2 |
|
1 |
|
16Bit |
1.4 x 0.295 x 0.15in |
-40 °C |
85 °C |
10 x 10/12 位 |
10 bit, 12 bit |
1 |
10 |
|
2（16 位） |
3 x 16 位 |
16Bit |
3 |
35.56mm |
3.81mm |
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DSPIC30F2010-20E/MM |
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- |
- |
- |
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表面贴装 |
20MHz |
|
16Bit |
512 B |
RISC |
12 kB |
闪存 |
|
QFN |
28 |
3 → 5.5 V |
1 |
|
1 |
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16Bit |
2 |
6 |
1 |
|
16Bit |
6 x 6 x 0.95mm |
-40 °C |
125 °C |
1（6 x 10 位） |
10Bit |
1 |
6 |
|
2（6 x 16 位） |
3 x 16 位 |
16Bit |
3 |
6mm |
0.95mm |
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DSPIC33FJ128GP804-I/ML |
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- |
- |
- |
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表面贴装 |
40MHz |
|
16Bit |
16 kB |
RISC |
128 kB |
闪存 |
|
QFN |
44 |
3.3 V |
2 |
1 |
1 |
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2 |
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16Bit |
8 x 8 x 0.88mm |
-40 °C |
85 °C |
13 通道 x 10 位、13 通道 x 12 位 |
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5 |
8mm |
0.88mm |
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AD7811YRZ |
- |
10 |
350k |
3，4 |
个伪差分，单端 |
DSP |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
外部， 内部 |
2.7 V ~ 5.5 V |
2.7 V ~ 5.5 V |
- |
-40°C ~ 105°C |
16-SOIC（0.154"，3.90mm 宽） |
16-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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1 |
110ns |
Current - Unbuffered |
无 |
±0.5（最大），±1（最大） |
AD5452YRMZ-REEL7 |
- |
12 |
|
|
|
SPI，DSP |
|
|
|
R-2R |
外部 |
2.5 V ~ 5.5 V |
2.5 V ~ 5.5 V |
|
-40°C ~ 125°C |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
8-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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2 |
256 |
SPI |
非易失 |
2.3 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±8% |
35 ppm/°C |
55 |
|
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|
|
AD5142BRUZ10 |
- |
|
|
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|
|
电位计 |
|
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|
|
|
|
级联销 |
-40°C ~ 125°C |
16-TSSOP（0.173"，4.40mm 宽） |
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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2 |
256 |
I²C |
易失 |
2.7 V ~ 5.5 V |
-20%， 55% |
35 ppm/°C |
160 |
|
|
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|
|
AD5248BRMZ50-RL7 |
- |
|
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|
|
变阻器 |
|
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|
|
可选地址 |
-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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4 |
256 |
I²C |
非易失 |
2.7 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±30% |
650 ppm/°C |
200 |
|
|
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|
|
AD5254BRU1 |
- |
|
|
|
|
|
电位计 |
|
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|
|
可选地址 |
-40°C ~ 105°C |
20-TSSOP（0.173"，4.40mm 宽） |
20-TSSOP |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
|
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UART |
|
2.5 V ~ 5 V |
|
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AR1010-I/SS |
mTouch |
|
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|
-40°C ~ 85°C |
20-SSOP（0.209"，5.30mm 宽） |
20-SSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
10 b |
|
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|
- |
17mA |
表面贴装 |
|
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|
I²C，串行 |
|
1.6 V ~ 3.6 V |
|
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|
|
AD7879-1WACPZ-RL |
- |
|
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|
|
|
|
|
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|
|
|
-40°C ~ 85°C |
16-VQFN 裸露焊盘，CSP |
16-LFCSP-VQ（4x4） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
12 b |
|
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|
|
|
外部 |
- |
表面贴装 |
|
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XRT6166CD-F |
|
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- |
- |
- |
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|
表面贴装 |
2.048MHz |
|
8Bit |
|
|
|
|
|
SOIC |
28 |
|
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|
|
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|
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|
|
8Bit |
18.1 x 7.6 x 2.35mm |
0 °C |
70 °C |
|
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|
18.1mm |
2.35mm |
|
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DSPIC33EP64GS504-I/PT |
|
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- |
- |
- |
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|
表面贴装 |
|
70MIPS |
16Bit |
8 kB |
代码高效，MCU，改进型哈佛 |
64 kB |
EEPROM, SRAM |
MAC |
TQFP |
44 |
3 → 3.6 V |
2 |
|
2 |
2 |
1 |
|
5 |
2 |
2 |
1个设备 |
16Bit |
10 x 10 x 1.05mm |
-40 °C |
85 °C |
19 x 12 位、5 x 12 位 |
12Bit |
5, 19 |
|
|
5 x 2 |
5 x 16 位 |
16Bit |
5 |
10mm |
1.05mm |
|
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|
dsPIC33EP128GS804-I/ML |
DsPIC33EP |
|
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|
- |
- |
- |
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|
表面贴装 |
60MHz |
70MIPS |
16Bit |
8 kB |
DSP |
128 kB |
闪存 |
MAC |
QFN |
44 |
3 → 3.6 V |
2 |
2 |
2 |
|
|
16Bit |
1 |
8 |
3 |
|
16Bit |
8 x 8 x 0.95mm |
-40 °C |
85 °C |
1（17 x 12 位[模拟]），1（5 x 12 位[S 和 H 电路]） |
12Bit |
2 |
17（模拟），5（S 和 H 电路） |
AEC-Q100 |
1（8 x 16 位） |
1（2 x 32 位），1（5 x 16 位） |
16 bit, 32 bit |
2 |
8mm |
0.95mm |
|
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|
TMS320C6204ZHK200 |
|
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- |
- |
- |
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|
表面贴装 |
200MHz |
1600MIPS |
16Bit |
64 kB |
DSP |
64 kB |
EPROM |
固定点 |
BGA |
288 |
3.3 V |
|
|
|
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|
|
1 |
|
16Bit |
16.1 x 16.1 x 0.95mm |
0 °C |
90 °C |
|
|
|
|
|
|
2 x 32 位 |
32Bit |
2 |
16.1mm |
0.95mm |
