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AD9760ARUZ |
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表面贴装 |
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- |
- |
- |
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TSSOP |
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28 |
9.7 x 4.4 x 1.05 mm |
1.05 mm |
9.7 mm |
|
85 °C |
|
4.4 mm |
10 位 |
1 |
并行 |
单 |
125Msps |
5 V |
外部，内部 |
|
0.035µs |
单极 |
10%FSR |
|
±1LSB |
-40 °C |
- |
- |
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AD9708ARUZ |
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表面贴装 |
|
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- |
- |
- |
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TSSOP |
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28 |
9.7 x 4.4 x 1.05 mm |
1.05 mm |
9.7 mm |
|
85 °C |
|
4.4 mm |
8 位 |
1 |
并行 |
单 |
125Msps |
5 V |
外部，内部 |
分段 |
0.035µs |
|
±10%FSR |
|
±0.5LSB |
-40 °C |
- |
- |
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数码相机，手机，便携式视频 |
ADV7180WBST48Z |
- |
视频解码器 |
|
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48-LQFP |
表面贴装 |
48-LQFP（7x7） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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AD7224KPZ |
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表面贴装 |
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- |
- |
- |
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PLCC |
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20 |
9.04 x 9.04 x 3.68 mm |
3.68 mm |
9.04 mm |
|
85 °C |
|
9.04 mm |
8 位 |
1 |
并行 |
双，单 |
143ksps |
15 V |
外部 |
R-2R，电阻串 |
20µs |
单极 |
±1.5LSB |
-5 V, 12 V, 15 V |
±1LSB |
-40 °C |
- |
- |
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AD7391ARZ |
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表面贴装 |
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- |
- |
- |
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SOIC |
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8 |
5 x 4 x 1.5 mm |
1.5 mm |
5 mm |
|
125 °C |
|
4 mm |
10 位 |
1 |
串行 (SPI/QSPI) |
单 |
17ksps |
3 V, 5 V |
外部 |
R-2R，电阻串 |
70µs |
单极 |
±32mV |
|
±2LSB |
-40 °C |
- |
- |
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AD1955ARSZ |
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表面贴装 |
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- |
- |
- |
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SSOP |
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28 |
10.2 x 5.3 x 1.75 mm |
1.75 mm |
10.2 mm |
|
85 °C |
|
5.3 mm |
24 位 |
2 |
串行 （SPI） |
单 |
192ksps |
5 V |
内部 |
Delta Sigma |
|
双极 |
±6%FSR |
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-40 °C |
- |
- |
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I²C，2 线串口 |
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MAX7300AAI |
- |
|
推挽式 |
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|
- |
-40°C ~ 125°C |
28-SSOP（0.209\，5.30mm 宽） |
表面贴装型 |
28-SSOP |
管件 |
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是 |
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400 kHz |
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2.5V ~ 5.5V |
20 |
4.5mA，10mA |
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ROMLess |
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ADSP-21061KSZ-160 |
SHARC |
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表面贴装 |
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- |
- |
- |
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MQFP |
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40MHz |
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240 |
32 x 32 x 3.5mm |
3.5mm |
32mm |
|
85 °C |
|
32Bit |
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0 °C |
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40MIPS |
32Bit |
1 MB |
哈佛 |
浮点 |
5 V |
1 |
1 |
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HMC749LC3C |
- |
T-型 |
补充型 |
|
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|
-40°C ~ 85°C（TA） |
16-LFQFN 裸露焊盘 |
表面贴装型 |
16-SMT（3x3） |
带 |
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复位 |
1 |
1 |
26 GHz |
- |
正，负 |
- |
3V ~ 3.6V |
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SSM2517CBZ-RL |
- |
D 类 |
1-通道（单声道） |
2.4W x 1 @ 4 欧姆 |
2.5 V ~ 5.5 V |
消除爆音，数字输入，短路和热保护，关机 |
-40°C ~ 85°C（TA） |
9-WFBGA，WLCSP |
表面贴装 |
9-WLCSP（1.46x1.46） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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HDMI |
ADV7480BBCZ |
- |
接收器 |
|
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|
|
100-LFBGA，CSPBGA |
表面贴装 |
100-CSBGA（9x9） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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±5V |
3mV @ 5V |
3µA @ 5V |
- |
6mA，1mA |
60dB CMRR，60dB PSRR |
30ns |
|
CMP401GSZ-REEL |
- |
通用 |
CMOS，TTL |
|
|
|
-40°C ~ 125°C |
16-SOIC（0.154"，3.90mm 宽） |
表面贴装 |
16-SOIC |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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20 |
470 |
3 |
差分 |
SPI，DSP |
MUX-ADC |
- |
1 |
三角积分 |
外部， 内部 |
2.7 V ~ 5.25 V |
2.7 V ~ 5.25 V |
|
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|
|
AD7785BRUZ |
- |
|
|
|
|
- |
-40°C ~ 105°C |
16-TSSOP（0.173"，4.40mm 宽） |
|
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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1 |
128 |
上/下（U/D，CS） |
易失 |
±30% |
800 ppm/°C |
40 |
|
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|
|
电位计 |
|
|
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|
|
2.7 V ~ 5.5 V |
|
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|
AD5220BRMZ100-R7 |
- |
|
|
|
|
- |
-40°C ~ 85°C |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
|
8-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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4 |
256 |
I²C，SPI |
易失 |
±30% |
30 ppm/°C |
60 |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
4.5 V ~ 16.5 V，±4.5 V ~ 7.5 V |
|
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|
|
AD5263BRUZ50 |
- |
|
|
|
|
级联销，可选地址 |
-40°C ~ 125°C |
24-TSSOP（0.173"，4.40mm 宽） |
|
24-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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|
2.95 V ~ 13 V |
|
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|
ADM1294-1AACPZ |
- |
|
|
|
|
|
-40°C ~ 105°C |
16-WQFN 裸露焊盘 |
表面贴装 |
16-LFCSP-WQ（4x4） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
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|
- |
- |
1.1V |
0.4V，0.8V，1.5V |
3.6mA |
单相 |
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1 |
33 |
SPI |
易失 |
±30% |
500 ppm/°C |
50 |
|
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|
电位计 |
|
|
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|
|
|
2.7 V ~ 5.5 V，±2.3 V ~ 2.7 V |
|
|
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|
|
AD5201BRMZ50-REEL7 |
- |
|
|
|
|
- |
-40°C ~ 85°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
|
10-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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|
ARM7® |
16/32-位 |
44MHz |
EBI/EMI，I²C，SPI，UART/USART |
PLA，PWM，PSM，温度传感器，WDT |
62KB（31K x16） |
闪存 |
- |
2K x 32 |
A/D 7x12b，D/A 4x12b |
内部 |
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|
ADUC7029BBCZ62I |
|
|
|
|
2.7 V ~ 3.6 V |
|
-40°C ~ 125°C（TA） |
|
|
49-CSPBGA（5x5） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
MicroConverter |
|
|
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|
|
|
49-TFBGA，CSPBGA |
|
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ADSP-21261SKBCZ150 |
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0°C ~ 70°C（TA） |
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表面贴装 |
136-CSPBGA（12x12） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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SHARC® |
浮点 |
DAI，SPI |
150MHz |
ROM（384 kB） |
128kB |
1.20V |
136-LFBGA，CSPBGA |
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HMC394LP4E |
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QFN |
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1/2 |
2.2GHz |
100MHz |
- |
194mA |
24 |
4.1 x 4.1 x 0.95mm |
0.95mm |
4.1mm |
5 V |
85 °C |
- |
4.1mm |
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