|
|
- |
易失 |
SRAM |
SRAM |
32Mb （4M x 8，2M x 16） |
55ns |
55ns |
并联 |
表面贴装 |
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48-TFSOP（0.724"，18.40mm 宽） |
48-TSOP I |
- |
R1LV3216RSA-5SI#B0 |
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-40°C ~ 85°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
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20-101-0517 |
MPU 코어 |
Rabbit 3000 |
- |
29.4MHz |
512KB |
512KB |
2 IDC 针座 2x17 |
1.85" x 1.65"（47mm x 42mm） |
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
2 周 |
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GaAs MMIC |
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- |
HMC547ALC3 |
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表面安装 |
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- |
3.7dB |
30dB |
6ns |
2 |
16 |
3 x 3 x 0.92mm |
3mm |
3mm |
0.92mm |
28GHz |
-40 °C |
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Spartan®-6 LX |
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324-LFBGA，CSPBGA |
324-CSPBGA（15x15） |
|
XC6SLX45-L1CSG324C |
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|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
218 |
1.14 V ~ 1.26 V |
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Spartan®-6 LX |
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324-LFBGA，CSPBGA |
324-CSPBGA（15x15） |
|
XC6SLX45-N3CSG324I |
|
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|
|
-40°C ~ 100°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
218 |
1.14 V ~ 1.26 V |
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Spartan®-6 LX |
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484-FBGA，CSPBGA |
484-CSPBGA（19x19） |
|
XC6SLX45-N3CSG484C |
|
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|
|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
320 |
1.14 V ~ 1.26 V |
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通孔 |
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14-CDIP（0.300"，7.62mm） |
14-CERDIP |
- |
AD536ASD/883B |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
9 周 |
|
5 V ~ 36 V，±3 V ~ 18 V |
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管件 |
1.2mA |
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- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
Artix™-7 FPGA，23K 逻辑单元 |
400-LFBGA，CSPBGA |
400-CSPBGA（17x17） |
- |
XC7Z007S-2CLG400I |
|
单 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
766MHz |
|
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|
|
-40°C ~ 100°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
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- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
Artix™-7 FPGA，28K 逻辑单元 |
225-LFBGA，CSPBGA |
225-CSPBGA（13x13） |
- |
XC7Z010-1CLG225I |
|
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
|
667MHz |
|
|
|
|
-40°C ~ 100°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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Spartan®-3 |
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|
320-BGA |
320-FBGA（19x19） |
|
XC3S1000-4FGG320I |
|
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|
-40°C ~ 100°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
221 |
1.14 V ~ 1.26 V |
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Spartan®-3 |
|
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|
320-BGA |
320-FBGA（19x19） |
|
XC3S1000-5FG320C |
|
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|
|
|
|
0°C ~ 85°C（TJ） |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
6 周 |
221 |
1.14 V ~ 1.26 V |
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|
Spartan®-3 |
|
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|
|
320-BGA |
320-FBGA（19x19） |
|
XC3S1000-5FGG320C |
|
|
|
|
|
|
|
|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
221 |
1.14 V ~ 1.26 V |
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|
表面贴装 |
|
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|
|
- |
AD7841BSZ |
|
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- |
- |
|
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|
|
MQFP |
|
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|
|
44 |
10 x 10 x 2 mm |
10 mm |
10 mm |
2 mm |
|
-40 °C |
14 位 |
8 |
并行 |
双 |
32ksps |
外部 |
R-2R，电阻串 |
31µs |
双极，单极 |
±8LSB |
±15V |
±2LSB |
85 °C |
- |
- |
|
|
|
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|
|
DDR3L SDRAM |
|
|
8GB |
|
|
|
|
|
|
|
|
|
|
|
- |
MT16KTF1G64HZ-1G9P1 |
|
|
|
1866MT/s |
|
|
|
|
|
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
- |
|
|
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|
|
204-SODIMM |
|
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|
DDR3L SDRAM |
|
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|
|
- |
MT16KTF1G64AZ-1G9P1 |
|
|
|
1866MT/s |
|
|
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|
|
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
- |
|
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|
|
240-UDIMM |
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|
|
20-101-1154 |
MPU 코어 |
Rabbit 4000 |
- |
58.98MHz |
512KB |
1MB |
IDC 接头 2x25，2x5 |
1.41" x 1.88"（36mm x 48mm） |
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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|
Blackfin® |
|
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|
|
表面贴装 |
|
|
|
|
|
|
297-PBGA（27x27） |
- |
ADSP-BF561SBB600 |
|
|
|
|
|
|
|
|
-40°C ~ 85°C（TA） |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
定点 |
SPI，SSP，UART |
600MHz |
外部 |
328kB |
1.35V |
297-BGA |
托盘 |
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通孔 |
|
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|
- |
MAX526CCNG |
|
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|
- |
- |
|
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|
|
PDIP |
|
|
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|
|
|
|
24 |
32.13 x 7.87 x 4.45 mm |
32.13 mm |
7.87 mm |
4.45 mm |
|
0 °C |
12 位 |
4 |
并行 |
双 |
|
外部 |
R-2R，电阻串 |
3µs |
单极 |
±1.5LSB |
-5 V, 15 V |
±0.5LSB |
70 °C |
- |
- |
|
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|
表面贴装 |
|
|
|
|
|
|
|
- |
ADSP-21065LCSZ-240 |
|
|
|
|
|
|
|
|
|
- |
- |
|
|
SHARC |
|
|
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|
|
|
MQFP |
|
|
|
|
|
|
|
208 |
28.2 x 28.2 x 3.6mm |
28.2mm |
32Bit |
3.6mm |
60MHz |
-40 °C |
|
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|
|
100 °C |
|
|
60MIPS |
32Bit |
544 kB |
哈佛 |
ROMLess |
浮点 |
3.13 → 3.6 V |
2 |
|
2 |
|
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|
表面贴装 |
|
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|
- |
ADSP-2181KSTZ-160 |
|
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- |
- |
|
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|
|
TQFP |
|
|
|
|
|
|
|
128 |
20.1 x 14.1 x 1.5mm |
20.1mm |
16Bit |
1.5mm |
20MHz |
0 °C |
|
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|
|
70 °C |
|
|
40MIPS |
16Bit |
80 kB |
DSP |
ROMLess |
固定点 |
4.5 → 5.5 V |
1 x 16 位 |
16Bit |
1 |
