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- |
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|
表面贴装 |
TO-252-3，DPak（2 引线 接片），SC-63 |
TO-252，（D-Pak） |
- |
|
|
|
|
|
500mA |
|
25V |
标准卷带 |
BD3931FP-E2 |
|
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|
|
-40°C ~ 125°C |
符合限制有害物质指令(RoHS)规范要求 |
|
正 |
固定 |
55dB（120Hz） |
- |
5V |
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|
20-101-0507 |
MPU 코어 |
Rabbit 3000 |
- |
30MHz |
512KB |
512KB |
2 IDC 针座 2x17 |
1.85" x 2.73"（47mm x 69mm） |
-40°C ~ 70°C |
符合限制有害物质指令(RoHS)规范要求 |
2 周 |
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- |
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|
表面贴装 |
|
8-SOIC |
- |
|
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|
管件 |
23S05-1DCG |
|
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|
|
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|
|
0°C ~ 70°C |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
|
|
|
零延迟缓冲器 |
带旁路 |
LVTTL |
CMOS，LVTTL |
1 |
1：5 |
无/无 |
133MHz |
无/无 |
8-SOIC（0.154"，3.90mm 宽） |
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74LVC |
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表面贴装 |
|
20-SO |
- |
|
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|
|
标准卷带 |
74LVC373AD,118 |
|
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|
|
-40°C ~ 125°C |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
三态 |
|
|
|
|
|
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|
|
|
20-SOIC（0.295"，7.50mm 宽） |
D 型透明锁存器 |
8：8 |
1.5ns |
24mA，24mA |
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模拟 |
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螺丝安装 |
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SCA121T-D07 |
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- |
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- |
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2 |
- |
4 V/g, 70 mV/° |
- |
29 x 41 x 13.5mm |
29mm |
41mm |
13.5mm |
28Hz |
35 V |
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- |
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|
LT5527EUF#PBF |
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QFN |
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|
16 |
4 x 4 x 0.7mm |
4mm |
4mm |
0.7mm |
|
5.25 V 直流 |
|
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|
|
85 °C |
4.5 V 直流 |
|
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|
|
3.2 dB |
3700MHz |
600MHz |
- |
-40 °C |
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|
MX25xxx05/06 |
非易失 |
闪存 |
FLASH - NOR |
2Mb （256K x 8） |
50µs，3ms |
- |
SPI |
2.7 V ~ 3.6 V |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON（6x5） |
- |
|
|
|
|
|
|
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|
|
MX25L2006EZNI-12G |
|
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|
|
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|
|
-40°C ~ 85°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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以太网 |
桥，USB 至 ethernet |
USB |
USB 2.0，10/100/1000 Base-T/TX |
1.2V，2.5V，3.3V |
- |
|
|
|
|
|
|
|
|
|
56-VFQFN 裸露焊盘 |
56-QFN（8x8） |
- |
|
|
|
|
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|
|
|
|
LAN7500I-ABZJ |
|
|
|
|
|
|
|
|
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
4 周 |
|
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- |
|
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|
表面贴装 |
|
144-LQFP（20x20） |
- |
|
|
|
|
|
|
|
|
托盘 |
ADMC401BSTZ |
|
|
|
|
|
|
|
|
-40°C ~ 85°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
|
|
|
|
|
|
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|
|
144-LQFP |
|
|
|
|
定点 |
串行端口 |
26MHz |
ROM（6 kB） |
8kB |
5.00V |
|
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数字 |
|
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|
表面贴装 |
|
|
- |
|
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|
|
ADXL375BCCZ |
|
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|
LGA |
|
|
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|
|
I2C，串行-3 线，串行 4 线，串行 SPI |
|
|
|
|
3 |
5mg/√Hz |
22.6LSB/g |
14 |
5 x 3 x 1mm |
5mm |
3mm |
1mm |
- |
|
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|
±200g |
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|
MESFET |
|
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- |
|
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|
|
HMC232LP4E |
|
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|
|
12GHz |
|
QFN |
|
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|
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|
|
|
24 |
4.1 x 4.1 x 0.95mm |
4.1mm |
4.1mm |
0.95mm |
|
|
|
|
|
|
|
|
单单刀双掷 |
3.1dB |
37dB |
6ns |
1 |
|
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|
|
-40 °C |
|
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- |
|
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|
|
表面贴装 |
SOT-23-5 细型，TSOT-23-5 |
TSOT-23-5 |
- |
|
|
|
|
|
150mA |
- |
6.5V |
标准卷带 |
MPQ8903DJ-2.85-LF-P |
|
|
|
|
|
|
|
|
-40°C ~ 125°C |
符合限制有害物质指令(RoHS)规范要求 |
|
|
正，固定式 |
|
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|
USB |
桥，USB 至 ethernet |
USB |
USB 2.0 |
3.3V |
- |
|
|
|
|
|
|
|
|
|
56-VFQFN 裸露焊盘 |
56-QFN（8x8） |
- |
|
|
|
|
|
|
|
|
|
LAN9730I-ABZJ-TR |
|
|
|
|
|
|
|
|
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
|
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|
|
非易失 |
EEPROM |
EEPROM |
64kb（32B 页面尺寸） |
100µs，3ms |
- |
SPI |
|
表面贴装 |
8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
- |
|
|
|
|
|
|
|
|
|
RM25C64C-BSNC-B |
|
|
|
|
|
|
|
|
0°C ~ 70°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
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- |
|
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|
|
HMC363S8GE |
|
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|
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|
|
12GHz |
|
SOIC |
|
|
|
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|
|
|
|
8 |
5 x 4 x 1.62mm |
5mm |
4mm |
1.62mm |
|
5 V |
1/8 |
500MHz |
- |
70mA |
85 °C |
- |
|
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|
|
可编程 |
|
|
|
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|
|
|
|
|
|
|
2.25 V ~ 5.5 V |
表面贴装 |
SOT-23-6 细型，TSOT-23-6 |
TSOT-23-6 |
- |
|
|
|
|
|
|
|
|
|
LTC6994MPS6-1#TRMPBF |
|
|
|
|
|
|
|
|
-55°C ~ 125°C |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
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|
8 |
- |
1µs ~ 33.6s |
1 |
|
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|
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|
|
|
|
|
|
|
|
|
|
|
|
|
400-LFBGA |
400-VFBGA（17x17） |
- |
256KB |
64KB |
DDR，PCIe，SERDES |
CAN，以太网，I²C，SPI，UART/USART，USB |
FPGA - 10K 逻辑模块 |
|
|
|
|
M2S010T-VFG400 |
|
ARM® Cortex®-M3 |
|
166MHz |
|
|
|
|
0°C ~ 85°C（TJ） |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
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|
|
SHARC® |
|
|
|
|
|
|
|
|
表面贴装 |
|
176-LQFP-EP（24x24） |
- |
|
|
|
|
|
|
|
|
托盘 |
ADSP-21489BSWZ-4B |
|
|
|
|
|
|
|
|
-40°C ~ 85°C（TA） |
符合限制有害物质指令(RoHS)规范要求 |
23 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
176-LQFP 裸露焊盘 |
|
|
|
|
浮点 |
EBI/EMI，DAI，I²C，SPI，SPORT，UART/USART |
400MHz |
外部 |
5Mb |
1.10V |
|
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|
|
非易失 |
闪存 |
FLASH |
4Mb （264 字节 x 2048 页） |
8µs，3ms |
- |
SPI |
|
表面贴装 |
8-SOIC（0.154"，3.90mm 宽） |
8-SOIC |
- |
|
|
|
|
|
|
|
|
|
AT45DB041E-SSHNHC-T |
|
|
|
|
|
|
|
|
-40°C ~ 85°C（TC） |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
|
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|
|
表面贴装 |
|
8-MSOP-PowerPad |
- |
|
|
|
|
|
|
|
|
|
LM5111-2MY/NOPB |
|
|
|
|
|
|
|
|
-40°C ~ 125°C （TJ） |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
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|
低压侧 |
独立式 |
2 |
N 沟道 MOSFET |
3.5 V ~ 14 V |
0.8V，2.2V |
3A，5A |
14ns，12ns |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 |
|
|
|
|
