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SOT-23 |
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MAX2671EUT-T |
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- |
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5.5 V |
85 °C |
2.7 V |
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6 |
2.9 x 1.63 x 1.1mm |
2.9mm |
1.63mm |
1.1mm |
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11.9 dB |
2500MHz |
500MHz |
696 mW |
-40 °C |
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MP2636GR-P |
- |
锂离子/聚合物 |
1 |
恒流 - 可编程 |
电流，定时器 |
超温，过压，短路 |
4.2V |
- |
-40°C ~ 125°C （TJ） |
剪切带（CT） |
28-VFQFN 裸露焊盘 |
30-QFN（4x4） |
- |
符合限制有害物质指令(RoHS)规范要求 |
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USB |
控制器 |
USB 2.0 |
3 V ~ 3.6 V |
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USB2517I-JZX |
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并联 |
-40°C ~ 85°C |
|
64-VFQFN 裸露焊盘 |
64-QFN（9x9） |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
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12 周 |
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208-LQFP 裸露焊盘 |
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ADSP-21371BSWZ-2B |
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-40°C ~ 85°C（TA） |
托盘 |
|
208-LQFP-EP（28x28） |
- |
符合限制有害物质指令(RoHS)规范要求 |
SHARC® |
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表面贴装 |
17 周 |
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浮点 |
DAI，DPI |
266MHz |
ROM（512 kB） |
128kB |
1.20V |
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SOIC |
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模拟 |
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MMA3221KEG |
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- |
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表面贴装 |
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- |
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2 |
±20 g, ±50 g |
42 (x) mV/g, 105 (y) mV/g |
110 (xy)µV/√Hz |
|
20 |
12.96 x 7.6 x 3.3mm |
12.96mm |
7.6mm |
3.3mm |
440Hz |
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QFN |
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CC113LRGPT |
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- |
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3.6 V |
85 °C |
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FSK，GFSK，MSK，OOK |
20 |
4.15 x 4.15 x 0.95mm |
4.15mm |
4.15mm |
0.95mm |
|
348MHz |
464MHz |
928MHz |
300MHz |
3 |
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MP20043DGT-B-LF-P |
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-40°C ~ 125°C |
标准卷带 |
8-VFDFN 裸露焊盘 |
8-TQFN（2x2） |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
300mA，300mA |
0.18V @ 300mA |
5.5V |
表面贴装 |
8 周 |
正，固定式 |
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USB |
集线器控制器 |
USB 3.0 |
1.2V，3.3V |
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USB5744T/2G |
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USB |
0°C ~ 70°C |
|
56-VFQFN 裸露焊盘 |
56-SQFN（7x7） |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
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4 周 |
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16-SSOP（0.209"，5.30mm 宽） |
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AD5934YRSZ-REEL7 |
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-40°C ~ 125°C |
剪切带（CT） |
|
16-SSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
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17 周 |
|
12 b |
- |
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SOIC |
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HMC361S8GE |
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- |
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1/2 |
10GHz |
400MHz |
- |
83mA |
5 V |
85 °C |
- |
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8 |
5 x 4 x 1.62mm |
5mm |
4mm |
1.62mm |
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SOT-26 |
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HMC432E |
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- |
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1/2 |
8GHz |
- |
- |
42mA |
3 V |
85 °C |
- |
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6 |
3 x 1.7 x 1.3mm |
3mm |
1.7mm |
1.3mm |
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|
ARM® Cortex®-M3 |
256KB |
64KB |
DDR，PCIe，SERDES |
CAN，以太网，I²C，SPI，UART/USART，USB |
166MHz |
FPGA - 25K 逻辑模块 |
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M2S025T-FGG484I |
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|
-40°C ~ 100°C（TJ） |
|
484-BGA |
484-FPBGA（23x23） |
- |
符合限制有害物质指令(RoHS)规范要求 |
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|
XO（标准） |
LVDS |
±25ppm |
0.071"（1.80mm） |
23mA |
6-SMD，无引线 |
0.276" 长 x 0.197" 宽（7.00mm x 5.00mm） |
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3.3V |
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511BBA155M520AAG |
Si511 |
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-40°C ~ 85°C |
托盘 |
|
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- |
符合限制有害物质指令(RoHS)规范要求 |
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表面贴装 |
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非易失 |
闪存 |
FLASH |
1Mb （128K x 8） |
12µs，3ms |
- |
SPI |
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AT25XE011-XMHN-T |
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|
-40°C ~ 85°C（TC） |
|
8-TSSOP（0.173"，4.40mm 宽） |
8-TSSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
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表面贴装 |
8 周 |
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UCC27424DGNR |
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|
-55°C ~ 150°C（TJ） |
|
|
8-MSOP-PowerPad |
- |
符合限制有害物质指令(RoHS)规范要求 |
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|
表面贴装 |
6 周 |
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低压侧 |
独立式 |
2 |
N 沟道，P 沟道 MOSFET |
4 V ~ 15 V |
1V，2V |
4A，4A |
20ns，15ns |
8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 |
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20-TSSOP（0.173"，4.40mm 宽） |
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1Mb |
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系统内可编程 |
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|
XCF01SVOG20C |
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|
-40°C ~ 85°C |
|
|
20-TSSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
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6 周 |
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80-LQFP |
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|
ARM® Cortex®-M4F |
|
|
DMA，LVD，POR，PWM，WDT |
CSIO，EBI/EMI，I²C，LIN，SD，UART/USART |
160MHz |
|
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|
32-位 |
63 |
288KB（288K x 8） |
闪存 |
- |
32K x 8 |
A/D 16x12b. D/A 2x12b |
内部 |
S6E2HE4E0AGV20000 |
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|
-40°C ~ 125°C（TA） |
托盘 |
|
80-LQFP（12x12） |
|
符合限制有害物质指令(RoHS)规范要求 |
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15 周 |
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SCSI，LVD |
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UCC5640PW24G4 |
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|
0°C ~ 70°C |
|
|
24-TSSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
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|
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|
表面贴装 |
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2.7 V ~ 5.25 V |
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24-TSSOP（0.173"，4.40mm 宽） |
9 |
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SOIC |
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MAX536BCWE |
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- |
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表面贴装 |
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12 位 |
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70 °C |
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16 |
10.5 x 7.6 x 2.35 mm |
10.5 mm |
7.6 mm |
2.35 mm |
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0 °C |
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4 |
串行 （SPI） |
单 |
5 V |
外部 |
R-2R，电阻串 |
3µs |
单极 |
±1.5LSB |
±1LSB |
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简单复位/加电复位 |
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开路漏极或开路集电极 |
低有效 |
最小为 90 ms |
4V |
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BD45401G-TR |
BD45xxx |
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-40°C ~ 105°C（TA） |
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SC-74A，SOT-753 |
5-SSOP |
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表面贴装 |
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