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MTA36ASF4G72PZ-2G3B1 |
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2400MT/s |
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- |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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- |
DDR4 SDRAM |
288-RDIMM |
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CENGPXA270-520-11-504HCR |
PXA270 |
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520MHz |
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0°C ~ 70°C |
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符合限制有害物质指令(RoHS)规范要求 |
12 周 |
MCU 코어 |
- |
32MB |
64MB |
边缘连接器 |
2.37" x 2.67"（60.2mm x 67.8mm） |
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ADIS16364BMLZ |
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- |
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ML |
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3 |
±350 °/s, ±5.25 g |
0.0505 °/s/LSB, 1.01 mg/LSB |
数字 |
SPI |
0.044 °/s, 0.27 mg/√Hz rms |
螺丝安装 |
24 |
23.454 x 22.964 x 23.504mm |
23.45mm |
22.964mm |
23.504mm |
- |
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ADIS16445AMLZ |
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- |
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ML |
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3 |
±125 °/s, ±250 °/s, ±62 °/s |
0.0025 °/s/LSB, 0.005 °/s/LSB, 0.01 °/s/LSB |
数字 |
SPI |
0.011°/s |
表面贴装 |
20 |
24.53 x 38.08 x 10.23mm |
24.53mm |
38.08mm |
10.23mm |
25Hz |
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SOMDM3730-10-2782IFCR |
ARM® Cortex®-A8，DM3730 |
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1GHz |
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0°C ~ 70°C |
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符合限制有害物质指令(RoHS)规范要求 |
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MPU，DSP 코어 |
TMS320C64x（DSP） |
512MB（NAND），8MB（NOR） |
256MB |
板对板（BTB） 插座 - 480 |
1.23" x 3.01"（31.2mm x 76.5mm） |
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ADIS16445BMLZ |
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- |
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ML |
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3 |
±5g |
0.2525mg/LSB |
数字 |
SPI |
2.25mg rms |
表面贴装 |
20 |
38.08 x 24.53 x 11.1mm |
38.08mm |
24.53mm |
11.1mm |
5.5kHz |
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AD630ARZ |
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- |
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SOIC W |
调制/解调器 |
平衡 |
- |
- |
是 |
0.005 A |
- |
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表面贴装 |
20 |
13 x 7.6 x 2.35mm |
13mm |
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2.35mm |
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Leaper-56 |
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- |
- |
- |
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存储器编程 |
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串行 SPI，USB 2.0 |
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ADIS16448BMLZ |
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- |
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ML |
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3 |
±18g |
0.833mg/LSB |
数字 |
SPI |
5.1mg rms |
表面贴装 |
20 |
38.08 x 24.53 x 11.1mm |
38.08mm |
24.53mm |
11.1mm |
5.5kHz |
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S6 |
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- |
- |
- |
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USB 编程器 |
EEPROM，EPROM，闪存，MCU/MPU，NAND 闪存，NV Ram，PLD，串行 EEPROM |
USB 2.0 |
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ADIS16405BMLZ |
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- |
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ML |
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3 |
±18 (Min.) g, ±3.5 g, ±350 °/s |
0.0505 °/s/LSB, 0.51 mgauss/LSB, 3.38 mg/LSB |
数字 |
SPI |
0.05 °/s, 0.066 mgauss/√Hz, 0.5 mg/√Hz rms |
螺丝安装 |
24 |
23.454 x 22.964 x 23.504mm |
23.45mm |
22.964mm |
23.504mm |
- |
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ADIS16407BMLZ |
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- |
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ML |
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3 |
±18 (Min.) g, ±3.5 g, ±350 °/s |
0.0505 °/s/LSB, 0.51 mgauss/LSB, 3.38 mg/LSB |
数字 |
SPI |
0.044 °/s, 0.06 mgauss/√Hz, 0.5 mg/√Hz rms |
螺丝安装 |
24 |
23.454 x 22.964 x 23.504mm |
23.45mm |
22.964mm |
23.504mm |
- |
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ADXL206HDZ |
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- |
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SBDIP |
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2 |
±5g |
328mV/g |
数字 |
- |
110µg/√Hz |
通孔 |
8 |
13.41 x 7.57 x 2.95mm |
13.41mm |
7.57mm |
2.95mm |
- |
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48Pro2C |
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- |
- |
- |
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通用 ISP 编程器 |
EEPROM，eMMC，EPROM，闪存，MCU/MPU，NAND 闪存，NV Ram，PLD，串行 EEPROM，静态 RAM |
USB 2.0 |
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DATAMAN 48UXP |
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- |
- |
- |
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通用编程器 |
EEPROM，EPROM，闪存，MCU/MPU，NAND 闪存，NV RAM，PLD，PROM，串行 EEPROM |
并联，USB 2.0 |
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DATAMAN-40PRO |
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- |
- |
- |
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通用 ISP 编程器 |
EEPROM，EPROM，闪存，MCU/MPU，NV Ram，PLD，串行 EEPROM，静态 RAM |
USB 2.0 |
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XC7Z035-1FBG676C |
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
667MHz |
Kintex™-7 FPGA，275K 逻辑单元 |
0°C ~ 85°C（TJ） |
676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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XC7Z035-1FBG676I |
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
667MHz |
Kintex™-7 FPGA，275K 逻辑单元 |
-40°C ~ 100°C（TJ） |
676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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XC7Z045-1FBG676C |
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
667MHz |
Kintex™-7 FPGA，350K 逻辑单元 |
0°C ~ 85°C（TJ） |
676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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XC7Z035-1FFG676C |
双 ARM® Cortex®-A9 MPCore™，带 CoreSight™ |
- |
256KB |
DMA |
CAN，EBI/EMI，以太网，I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG |
667MHz |
Kintex™-7 FPGA，275K 逻辑单元 |
0°C ~ 85°C（TJ） |
676-BBGA，FCBGA |
676-FCBGA（27x27） |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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