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OPA277UA |
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SOIC |
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精密 |
表面贴装 |
双 |
1 |
8 |
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1MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
0.8V/µs |
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-40°C |
85°C |
140 dB |
无 |
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SKY65364-21 |
- |
ISM |
- |
28-MCM(6x6) |
28-VQFN 裸露焊盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
17 周 |
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OPA132UA |
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SOIC |
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精密 |
表面贴装 |
双 |
1 |
8 |
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8MHz |
±15V |
20V/µs |
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-40 °C |
85 °C |
120 dB |
无 |
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CA3140EZ |
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PDIP |
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通孔 |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
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-55 °C |
125 °C |
100 dB |
无 |
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OP1177ARZ |
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SOIC |
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表面贴装 |
双 |
1 |
8 |
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1.3MHz |
±12 V, ±3 V, ±5 V, ±9 V |
0.7V/µs |
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-40°C |
125 °C |
126 dB |
无 |
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OPA690ID |
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SOIC |
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表面贴装 |
双/单 |
1 |
8 |
9 V |
250MHz |
±3 V, ±5 V |
1000V/µs |
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-40 °C |
85 °C |
63 dB |
无 |
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SKY65352-11 |
- |
802.15.4/ZigBee |
SPDT |
20-MCM(6x6) |
20-LQFN 裸露焊盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
21 周 |
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OPA227PA |
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PDIP |
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低噪声,精密 |
通孔 |
双 |
1 |
8 |
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8MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
2.3V/µs |
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-40 °C |
85 °C |
160 dB |
无 |
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OPA277PA |
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PDIP |
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精密 |
通孔 |
双 |
1 |
8 |
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1MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
0.8V/µs |
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-40°C |
85°C |
140 dB |
无 |
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ROB-09454 |
- |
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袋 |
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板 |
近程,红外线 |
- |
数字 |
- |
5V |
- |
QRE1113 |
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ROB-09453 |
- |
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散装 |
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板 |
近程,红外线 |
- |
模拟 |
- |
5V |
- |
QRE1113 |
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OPA1611AID |
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SOIC |
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精密 |
表面贴装 |
双 |
1 |
8 |
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80MHz |
±2.25 → ±18V |
27V/µs |
100 Hz |
-55 °C |
125 °C |
130 dB |
无 |
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TLC2652CP |
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PDIP |
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精密 |
通孔 |
双/单 |
1 |
8 |
5 → 15 V |
1.9MHz |
±3 V, ±5 V |
2.8V/µs |
|
0 °C |
70 °C |
150 dB |
无 |
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OPA333AIDCKT |
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SC-70 |
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表面贴装 |
双/单 |
1 |
5 |
3 V 5 V |
350kHz |
|
0.16V/µs |
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-40°C |
125 °C |
130 dB |
无 |
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AD8061ARZ |
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SOIC |
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低噪声 |
表面贴装 |
单 |
1 |
8 |
5 V |
320MHz |
|
650V/µs |
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-40 °C |
85 °C |
70 dB |
轨到轨输出 |
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LM7171AIM/NOPB |
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SOIC |
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表面贴装 |
双/单 |
1 |
8 |
5.5 → 36 V |
200MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
4100V/µs |
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-40 °C |
85 °C |
78 dB |
无 |
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OPA2340UA |
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SOIC |
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精密 |
表面贴装 |
单 |
2 |
8 |
3 V 5 V |
5.5MHz |
|
6V/µs |
|
-40°C |
85°C |
124 dB |
轨至轨输入/输出 |
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DEV-14109 |
* |
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- |
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MOD-WIFI-ESP8266-DEV |
- |
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盒 |
收发器; 802.11 b/g/n(Wi-Fi,WiFi,WLAN) |
2.4GHz |
ESP8266 |
板 |
|
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OPA2350UA |
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SOIC |
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精密 |
表面贴装 |
单 |
2 |
8 |
3 V 5 V |
38MHz |
|
22V/µs |
|
-40 °C |
85 °C |
122 dB |
轨至轨输入/输出 |