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MX25L1606EM1I-12G |
SOP |
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表面贴装 |
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8 |
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5.03 x 4 x 1.55mm |
5.03mm |
4mm |
- |
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1.55mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
16Mbit |
|
16M x 1 位，8M x 2 位 |
NOR |
|
8M, 16M |
|
1 bit, 2 bit |
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S25FL128P0XNFI001 |
WSON |
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表面贴装 |
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8 |
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8 x 6 x 0.75mm |
8mm |
6mm |
- |
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0.75mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
SPI |
128M x 1 位 |
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128M |
|
1 |
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CY8C5868AXI-LP035 |
TQFP |
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表面贴装 |
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100 |
1.71 V |
5.5 V |
14 x 14 x 1.4mm |
14mm |
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- |
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-40 °C |
85 °C |
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- |
- |
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微控制器 |
嵌入式 |
CMOS |
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CC1110F16RHHT |
QFN |
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表面贴装 |
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36 |
2 V |
3.6 V |
6.1 x 6.1 x 0.7mm |
6.1mm |
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- |
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-40 °C |
85 °C |
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- |
- |
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微控制器 |
射频收发器、USB 控制器 |
CMOS |
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CD4015BEE4 |
PDIP |
移位寄存器 |
4 |
4000 |
通孔 |
- |
串行至并行 |
2 |
16 |
3 V |
18 V |
19.3 x 6.35 x 4.57mm |
19.3mm |
6.35mm |
- |
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MX66L51235FMI-10G |
SOP |
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表面贴装 |
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16 |
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10.5 x 7.6 x 2.44mm |
10.5mm |
7.6mm |
- |
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2.44mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
512Mbit |
串行 |
128M x 4 位，256M x 2 位，512M x 1 位 |
NOR |
|
128M, 256M, 512M |
|
1 bit, 2 bit, 4 bit |
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A25L020CO-F |
SOP |
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表面贴装 |
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8 |
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5.33 x 5.38 x 1.91mm |
5.33mm |
5.38mm |
- |
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1.91mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
2Mbit |
SPI |
256K x 8 位 |
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256K |
5ns |
8Bit |
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SST39VF3201B-70-4I-EKE |
TSOP |
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表面贴装 |
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48 |
|
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18.4 x 12.2 x 1mm |
18.4mm |
12.2mm |
- |
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|
1mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
并行 |
2M x 16 位 |
分门 |
对称 |
2M |
70ns |
16Bit |
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TDA8029HL/C207,151 |
LQFP |
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表面贴装 |
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32 |
2.7 V |
6 V |
7.1 x 7.1 x 1.45mm |
7.1mm |
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- |
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-40 °C |
90 °C |
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- |
- |
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微控制器 |
卡读卡器 |
TTL |
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ADE7755ARSZ |
SSOP |
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表面贴装 |
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24 |
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8.2 x 5.3 x 1.75mm |
8.2mm |
5.3mm |
- |
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1.75mm |
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-40 °C |
85 °C |
- |
- |
- |
- |
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MX29F040CQI-70G |
PLCC |
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通孔 |
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32 |
|
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14.12 x 11.5 x 2.89mm |
14.12mm |
11.5mm |
- |
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2.89mm |
5.5 V |
4.5 V |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
并行 |
512K x 8 位 |
|
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512K |
70ns |
8Bit |
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N25Q032A11EF640E |
MLP |
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表面贴装 |
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8 |
|
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6 x 5 x 0.85mm |
6mm |
5mm |
- |
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0.85mm |
2 V |
1.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
4M x 8 位 |
NOR |
对称 |
4M |
5ns |
8Bit |
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TPG1LG01 |
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- |
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- |
- |
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在线服务编程器 |
16 位 PIC 微控制器，32 位 Microchip PIC MCU，8 位 PIC 微控制器，闪存设备 |
USB |
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|
MX25L6433FMI-08G |
SOP |
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|
表面贴装 |
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16 |
|
|
10.5 x 7.6 x 2.45mm |
10.5mm |
7.6mm |
- |
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2.45mm |
2 V |
1.65 V |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
|
16 x 4 位，32M x 2 位，64M x 1 位 |
NOR |
|
16M, 32M, 64M |
|
1 bit, 2 bit, 4 bit |
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MX29F400CBMI-70G |
SOP |
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表面贴装 |
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44 |
|
|
28.63 x 12.73 x 2.8mm |
28.63mm |
12.73mm |
- |
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2.8mm |
5.5 V |
4.5 V |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
并行 |
256K x 16 位，512K x 8 位 |
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256K, 512K |
70ns |
8 bit, 16 bit |
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CY8C4125PVI-482 |
SSOP |
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|
表面贴装 |
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|
28 |
1.71 V |
5.5 V |
10.4 x 5.6 x 1.85mm |
10.4mm |
|
- |
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|
|
-40 °C |
85 °C |
|
|
- |
- |
|
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微控制器 |
嵌入式 |
CMOS |
|
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ADE7878AACPZ |
LFCSP |
|
|
|
表面贴装 |
|
|
|
40 |
|
|
6.1 x 6.1 x 0.75mm |
6.1mm |
6.1mm |
- |
24 位 |
8ksps |
0.75mm |
3.7 V |
2.8 V |
-40 °C |
85 °C |
- |
- |
- |
- |
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MX25L6445EMI-10G |
SOP |
|
|
|
表面贴装 |
|
|
|
16 |
|
|
10.5 x 7.6 x 2.44mm |
10.5mm |
7.6mm |
- |
|
|
2.44mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
|
16 x 4 位，32M x 2 位，64M x 1 位 |
NOR |
|
16M, 32M, 64M |
|
1 bit, 2 bit, 4 bit |
|
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S29GL512S10TFI010 |
TSOP |
|
|
|
表面贴装 |
|
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|
56 |
|
|
18.5 x 14.1 x 1.05mm |
18.5mm |
14.1mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
512Mbit |
CFI，并行 |
32M x 16 位 |
NOR |
|
32M |
100ns |
16Bit |
|
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EM3592-RT |
QFN |
|
|
|
表面贴装 |
|
|
|
56 |
2.1 V |
3.6 V |
8 x 8 x 0.85mm |
8mm |
|
- |
|
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|
-40 °C |
85 °C |
|
|
- |
- |
|
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微控制器 |
楼宇自动化和控制，一般 Zigbee 无线传感器网络，家庭自动化和控制，安全和监控，智能能量 |
32 bit ARM Cortex M3 |
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