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MX25L1606EZNI-12G |
WSON |
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表面贴装 |
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8 |
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6.1 x 5.1 x 0.75mm |
6.1mm |
5.1mm |
- |
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0.75mm |
2 V |
1.65 V |
-40 °C |
85 °C |
- |
- |
- |
- |
16Mbit |
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16M x 1 位，8M x 2 位 |
NOR |
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8M, 16M |
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1 bit, 2 bit |
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SST39VF400A-70-4I-EKE |
TSOP |
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表面贴装 |
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48 |
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18.5 x 12.2 x 1.05mm |
18.5mm |
12.2mm |
- |
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1.05mm |
3.6 V |
2.7 V |
0 °C |
70 °C |
- |
- |
- |
- |
4Mbit |
并行 |
256K x 16 位 |
分门 |
对称 |
256K |
70ns |
16Bit |
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EM3598-RT |
QFN |
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表面贴装 |
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56 |
2.1 V |
3.6 V |
8 x 8 x 0.85mm |
8mm |
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- |
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-40 °C |
85 °C |
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- |
- |
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微控制器 |
楼宇自动化和控制，一般 Zigbee 无线传感器网络，家庭自动化和控制，安全和监控，智能能量 |
32 bit ARM Cortex M3 |
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CY8C23533-24LQXI |
QFN |
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表面贴装 |
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32 |
3 V |
5.25 V |
5 x 5 x 0.53mm |
5mm |
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- |
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-40 °C |
85 °C |
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- |
- |
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微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LCD，LED，USB |
CMOS |
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SN74HC4040NE4 |
PDIP |
计数器 |
12 |
HC |
通孔 |
二进制 |
增序计数器 |
1 |
16 |
2 V |
6 V |
19.3 x 6.35 x 4.57mm |
19.3mm |
6.35mm |
- |
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S29GL128S90TFI020 |
TSOP |
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表面贴装 |
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56 |
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18.5 x 14.1 x 1.05mm |
18.5mm |
14.1mm |
- |
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1.05mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
并行 |
8M x 16 位 |
NOR |
对称 |
8M |
90ns |
16Bit |
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JR28F064M29EWHA |
TSOP |
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表面贴装 |
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48 |
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18.4 x 12 x 1mm |
18.4mm |
12mm |
- |
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1mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
并行 |
4M x 16 位，8M x 8 位 |
NOR |
对称 |
4M, 8M |
70ns |
8/16Bit |
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W25Q16JVSNIQ/TUBE |
SOIC |
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表面贴装 |
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8 |
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5 x 4 x 1.5mm |
5mm |
4mm |
- |
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1.5mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
16Mbit |
串行 |
2M x 8 |
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2M |
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8Bit |
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CY8C27443-24SXI |
SOIC |
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表面贴装 |
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28 |
3 V |
5.25 V |
18.11 x 7.62 x 2.37mm |
18.11mm |
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- |
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-40 °C |
85 °C |
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- |
- |
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微处理器 |
汽车，Capsense 开发，DElta Sigma ADC，嵌入式，闪存，输入/输出，LED，PSoC 1 混合信号阵列，SRAM，USB |
CMOS |
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ADE7753ARSZ |
SSOP |
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表面贴装 |
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20 |
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7.5 x 5.6 x 1.85mm |
7.5mm |
5.6mm |
- |
16 位 |
1.85mm |
7 V |
-0.3 V |
-40 °C |
85 °C |
- |
- |
- |
- |
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SST26WF016B-104I/SN |
SOIC |
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表面贴装 |
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8 |
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4.9 x 3.9 x 1.25mm |
4.9mm |
3.9mm |
- |
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1.25mm |
1.95 V |
1.65 V |
-40 °C |
85 °C |
- |
- |
- |
- |
16Mbit |
SPI |
2M x 8 位 |
分门 |
对称 |
2M |
3ns |
8Bit |
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M45PE40S-VMN6P |
SOIC |
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表面贴装 |
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8 |
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4.9 x 3.9 x 1.75mm |
4.9mm |
3.9mm |
- |
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1.75mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
SPI |
512K x 8 位 |
NOR |
对称 |
512K |
5ns |
8Bit |
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CC2530F256RHAT |
VQFN |
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表面贴装 |
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40 |
2 V |
3.6 V |
6 x 6 x 0.9mm |
6mm |
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- |
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-40 °C |
125 °C |
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- |
- |
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微控制器 |
IEEE 802.15.5, ZigBee |
CMOS |
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BLUENRG-232 |
QFN32 |
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表面贴装 |
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32 |
1.7 V |
3.6 V |
5 x 5 x 0.95mm |
5mm |
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- |
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-40 °C |
105 °C |
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- |
- |
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微控制器 |
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蓝牙 |
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DATAMAN-40PRO |
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- |
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- |
- |
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通用 ISP 编程器 |
EEPROM，EPROM，闪存，MCU/MPU，NV Ram，PLD，串行 EEPROM，静态 RAM |
USB 2.0 |
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HEF4094BT |
SOIC |
移位寄存器 |
8 |
4000 |
表面贴装 |
- |
串行至串行/并行 |
1 |
16 |
3 V |
15 V |
10 x 4 x 1.45mm |
10mm |
4mm |
- |
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MX25L12835FM2I-10G |
SOP |
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表面贴装 |
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8 |
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5.33 x 5.38 x 1.91mm |
5.33mm |
5.38mm |
- |
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1.91mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
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128M x 1 位，32M x 4 位，64M x 2 位 |
NOR |
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32M, 64M, 128M |
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1 bit, 2 bit, 4 bit |
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AT45DB081E-SSHN-B |
SOIC |
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表面贴装 |
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8 |
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5.05 x 3.99 x 1.5mm |
5.05mm |
3.99mm |
- |
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1.5mm |
3.6 V |
1.7 V |
-40 °C |
85 °C |
- |
- |
- |
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8650752Bit |
SPI |
4096 页 x 256 字节 |
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7ns |
4096 |
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SST25PF020B-80-4C-SAE |
SOIC |
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表面贴装 |
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8 |
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5 x 4 x 1.5mm |
5mm |
4mm |
- |
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1.25mm |
3.6 V |
2.3 V |
0 °C |
70 °C |
- |
- |
- |
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2Mbit |
SPI |
4 x 32 kB，4 x 64 kB |
分门 |
对称 |
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12ns |
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CC2511F32RSP |
QFN |
|
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表面贴装 |
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36 |
3 V |
3.6 V |
6 x 6 x 0.82mm |
6mm |
|
- |
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0 °C |
85 °C |
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- |
- |
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微控制器 |
|
CMOS |
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