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ADDI7006BSUZ |
Precision Timing |
CCD 信号处理器 |
数码复印机 |
80-TQFP |
表面贴装 |
80-TQFP |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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10 |
140k |
3，4 |
单端 |
I²C |
MUX-S/H-ADC |
1：1 |
1 |
SAR |
外部 |
2.7 V ~ 5.5 V |
2.7 V ~ 5.5 V |
- |
-40°C ~ 125°C |
AD7995YRJZ-1500RL7 |
- |
|
|
SOT-23-8 |
|
SOT-23-8 |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
15 周 |
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2 |
9µs |
Voltage - Buffered |
无 |
±0.5，±0.05 |
10 |
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SPI，DSP |
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电阻串 DAC |
外部 |
2.5 V ~ 5.5 V |
2.5 V ~ 5.5 V |
|
-40°C ~ 105°C |
AD5312BRMZ-REEL7 |
- |
|
|
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
|
10-MSOP |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
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1 |
256 |
I²C |
易失 |
2.7 V ~ 5.5 V |
±30% |
45 ppm/°C |
50 |
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电位计 |
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可选地址 |
-40°C ~ 125°C |
AD5245BRJZ100-R2 |
- |
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SOT-23-8 |
|
SOT-23-8 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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4.75 V ~ 5.25 V |
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-40°C ~ 85°C |
ADE7757ARNZ |
- |
|
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16-SOIC（0.154"，3.90mm 宽） |
表面贴装 |
16-SOIC |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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5mA |
320 千欧 |
0.1% |
2.4V，4V，4.5V |
0.5V，0.8V |
单相 |
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2 |
256 |
I²C |
非易失 |
2.3 V ~ 5.5 V，±2.25 V ~ 2.75 V |
±8% |
35 ppm/°C |
130 |
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电位计 |
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可选地址 |
-40°C ~ 125°C |
AD5142ABRUZ100 |
- |
|
|
16-TSSOP（0.173"，4.40mm 宽） |
|
16-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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-40°C ~ 105°C（TA） |
ADSP-CM407CSWZ-DF |
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表面贴装 |
176-LQFP-EP（24x24） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
- |
浮点 |
176-LQFP 裸露焊盘 |
|
|
CAN，I²C，SPI，SPORT，UART/USART |
150MHz |
闪存（1 MB） |
128kB |
1.20V |
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ARM7® |
16/32-位 |
44MHz |
EBI/EMI，I²C，SPI，UART/USART |
PLA，PWM，PSM，温度传感器，WDT |
62KB（31K x16） |
闪存 |
- |
2K x 32 |
A/D 10x12b；D/A 2x12b |
内部 |
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-40°C ~ 125°C（TA） |
ADUC7024BCPZ62-RL7 |
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64-LFCSP-VQ（9x9） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
MicroConverter |
|
64-VFQFN 裸露焊盘，CSP |
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2.7 V ~ 3.6 V |
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串行 |
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数字 |
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模拟 |
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0°C ~ 70°C |
AD80066KRSZ |
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表面贴装 |
28-SSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
- |
信号处理器 |
28-SSOP（0.209"，5.30mm 宽） |
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0°C ~ 70°C（TA） |
ADSP-21489KSWZ-5B |
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表面贴装 |
176-LQFP-EP（24x24） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
22 周 |
SHARC® |
浮点 |
176-LQFP 裸露焊盘 |
|
|
EBI/EMI，DAI，I²C，SPI，SPORT，UART/USART |
450MHz |
外部 |
5Mb |
1.10V |
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ADF5001BCPZ |
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- |
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LFCSP WQ |
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- |
- |
- |
- |
- |
16 |
3 x 3 x 0.8mm |
0.8mm |
3mm |
- |
105 °C |
- |
3mm |
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HMC-MDB277 |
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模具 |
散装 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
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雷达 |
70GHz ~ 90GHz |
- |
- |
升/降频器 |
- |
HMC-MDB277 |
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ADG919BRMZ |
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- |
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MSOP |
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2GHz |
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8 |
3 x 3 x 0.85mm |
0.85mm |
3mm |
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3mm |
单单刀双掷 |
1.25dB |
34dB |
- |
1 |
CMOS / LVTTL |
-40 °C |
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AD9115BCPZ |
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表面贴装 |
|
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- |
- |
- |
|
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LFCSP |
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40 |
6.1 x 5.85 x 0.95 mm |
0.95 mm |
6.1 mm |
|
85 °C |
|
5.85 mm |
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-40 °C |
10 位 |
2 |
并联，串联 |
单 |
125Msps |
1.8 → 3.3 V |
|
分段 |
11.5ns |
|
-2 → 2%FSR |
|
±0.07 (Postcalibration) LSB, ±0.19 (Precalibration) LSB |
- |
- |
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5 V ~ 36 V，±3 V ~ 18 V |
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AD536AJHZ |
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TO-100-10 金属罐 |
通孔 |
TO-100-10 |
散装 |
- |
符合限制有害物质指令(RoHS)规范要求 |
9 周 |
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1.2mA |
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AD5381BSTZ-5 |
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表面贴装 |
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- |
- |
- |
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LQFP |
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100 |
14.2 x 14.2 x 1.45 mm |
1.45 mm |
14.2 mm |
|
85 °C |
|
14.2 mm |
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-40 °C |
12 位 |
40 |
串行 （SPI） |
单 |
|
5 V |
外部，内部 |
电阻串 |
8µs |
|
±0.05%FSR |
|
±1LSB |
- |
- |
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AD8842ARZ |
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表面贴装 |
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- |
- |
- |
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SOIC W |
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24 |
15.6 x 7.6 x 2.35 mm |
2.35 mm |
15.6 mm |
|
85 °C |
|
7.6 mm |
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-40 °C |
8 位 |
8 |
串行 （SPI） |
双 |
500ksps |
|
外部 |
R-2R，电阻串 |
5.4µs |
双极 |
2LSB |
±5V |
±1LSB |
- |
- |
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AD534SD |
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14-CDIP |
管件 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
8 周 |
- |
|
14-CDIP（0.300"，7.62mm） |
模拟乘法器/除法器 |
四象限 |
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AD5763CSUZ |
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表面贴装 |
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- |
- |
- |
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TQFP |
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32 |
7 x 7 x 1.05 mm |
1.05 mm |
7 mm |
|
105 °C |
|
7 mm |
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-40 °C |
16 位 |
2 |
串行 (SPI/QSPI) |
双 |
|
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外部 |
R-2R |
10µs |
双极 |
±1LSB |
±5V |
±2LSB |
- |
- |
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AD5693RARMZ |
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表面贴装 |
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MSOP |
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10 |
3.1 x 3.1 x 0.95 mm |
0.95 mm |
3.1 mm |
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105 °C |
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3.1 mm |
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-40 °C |
16 位 |
1 |
串行 （I2C） |
单 |
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2.7 → 5.5 V |
外部 |
电阻串 |
7µs |
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±0.075%FSR |
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±8LSB |
- |
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