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|
AD7476BRTZ-REEL7 |
- |
12 |
600k |
1 |
单端 |
SPI，DSP |
S/H-ADC |
1：1 |
1 |
SAR |
电源 |
2.35 V ~ 5.25 V |
2.35 V ~ 5.25 V |
- |
-40°C ~ 85°C |
SOT-23-6 |
SOT-23-6 |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
18 周 |
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2 |
7µs |
Voltage - Buffered |
无 |
±8，±1（最大） |
AD5663RBRMZ-3REEL7 |
nanoDAC |
16 |
|
|
|
SPI，DSP |
|
|
|
电阻串 DAC |
外部， 内部 |
2.7 V ~ 3.6 V |
2.7 V ~ 3.6 V |
|
-40°C ~ 105°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
剪切带（CT） |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
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1 |
256 |
I²C，SPI |
易失 |
2.7 V ~ 5.5 V |
±30% |
45 ppm/°C |
50 |
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|
AD5161BRMZ50-RL7 |
- |
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电位计 |
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|
级联销，可选地址 |
-40°C ~ 125°C |
10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
10-MSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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2.8 V ~ 3.7 V |
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ADE7854AACPZ-RL |
- |
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|
-40°C ~ 85°C |
40-WFQFN 裸露焊盘，CSP |
40-LFCSP-WQ（6x6） |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
19 周 |
|
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表面贴装 |
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400 千欧 |
0.2% |
2V，2.4V |
0.4V，0.8V |
20mA |
3 相 |
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1 |
256 |
SPI |
易失 |
4.5 V ~ 16.5 V，±5V |
±30% |
35 ppm/°C |
60 |
|
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|
AD5260BRUZ20 |
- |
|
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|
|
电位计 |
|
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|
|
级联销 |
-40°C ~ 85°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
管件 |
- |
符合限制有害物质指令(RoHS)规范要求 |
12 周 |
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|
ADSP-21488KSWZ-4A |
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|
|
0°C ~ 70°C（TA） |
|
100-LQFP-EP（14x14） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
|
SHARC® |
浮点 |
EBI/EMI，DAI，I²C，SPI，SPORT，UART/USART |
400MHz |
外部 |
3Mb |
1.10V |
表面贴装 |
100-LQFP 裸露焊盘 |
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|
8052 |
8-位 |
20MHz |
I²C，SPI，UART/USART |
DMA，PSM，PWM，温度传感器，WDT |
62KB（62K x 8） |
闪存 |
- |
2.25K x 8 |
A/D 8x12b，D/A 2x12b |
内部 |
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|
ADUC841BCPZ62-5 |
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|
|
-40°C ~ 85°C（TA） |
|
56-LFCSP-VQ（8x8） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
MicroConverter |
|
|
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|
|
56-VFQFN 裸露焊盘，CSP |
|
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|
4.75 V ~ 5.25 V |
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1 |
1024 |
SPI |
非易失 |
9 V ~ 33 V，±9 V ~ 16.5 V |
±1% |
35 ppm/°C |
60 |
|
|
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|
|
AD5292BRUZ-20-RL7 |
- |
|
|
|
|
|
电位计 |
|
|
|
|
|
|
级联销 |
-40°C ~ 105°C |
14-TSSOP（0.173"，4.40mm 宽） |
14-TSSOP |
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
7 周 |
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|
ADSP-SC583BBCZ-3A |
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|
|
-40°C ~ 85°C（TA） |
|
349-CSPBGA（19x19） |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
|
SHARC® |
浮点 |
CAN，EBI/EMI，以太网，DAI，I²C，MMC/SD/SDIO，SPI，SPORT，UART/USART，USB OTG |
300MHz |
ROM（512 kB） |
384kB |
1.10V |
表面贴装 |
349-LFBGA，CSPBGA |
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HMC584LP5E |
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- |
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|
表面贴装 |
QFN |
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|
12.5 → 13.9（输出 1）GHz，6.25 → 6.95（输出 2）GHz |
- |
- |
- |
2 → 12V |
温度、电压 |
- |
32 |
- |
- |
5.1 x 5.1 x 1mm |
1mm |
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HMC338LC3B |
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|
|
12-SMT（3x3） |
剪带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
|
- |
|
|
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|
|
通用 |
24GHz ~ 34GHz |
- |
- |
- |
29mA |
HMC338LC3B |
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ADL5380-30A-EVALZ |
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- |
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- |
- |
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|
解调器 |
正交 |
7.4dB |
15.5dB |
- |
0.245 A |
- |
- |
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24 |
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- |
- |
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AD5391BSTZ-5 |
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- |
- |
- |
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|
表面贴装 |
LQFP |
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10 mm |
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|
52 |
|
|
10 x 10 x 1.4 mm |
1.4 mm |
12 位 |
16 |
串行 (I2C/SPI/QSPI/Microwire) |
单 |
167ksps |
5 V |
外部，内部 |
电阻串 |
8µs |
单极 |
±0.06%FSR |
|
10 mm |
±1LSB |
-40 °C |
85 °C |
- |
- |
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AD650SD |
- |
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|
|
14-CDIP（0.300"，7.62mm） |
14-CDIP |
管件 |
- |
无铅/不符合限制有害物质指令(RoHS)规范要求 |
8 周 |
|
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通孔 |
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|
电压到频率和频率到电压 |
1MHz |
±150ppm/°C |
±0.1% |
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AD5544ARSZ |
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- |
- |
- |
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表面贴装 |
SSOP |
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10.2 mm |
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28 |
|
|
10.2 x 5.3 x 1.75 mm |
1.75 mm |
16 位 |
4 |
串行 （SPI） |
单 |
500ksps |
5 V |
外部 |
R-2R，电阻串 |
0.9µs |
单极 |
±3mV |
|
5.3 mm |
±2LSB |
-40 °C |
85 °C |
- |
- |
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|
AD5668BRUZ-2 |
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- |
- |
- |
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表面贴装 |
TSSOP |
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5.1 mm |
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16 |
|
|
5.1 x 4.5 x 1.05 mm |
1.05 mm |
16 位 |
8 |
串行 （SPI） |
单 |
95ksps |
2.7 → 5.5 V |
内部 |
电阻串 |
7µs |
|
-1%FSR |
|
4.5 mm |
±16LSB |
-40 °C |
105 °C |
- |
- |
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AD534SH |
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|
|
TO-100-10 |
散装 |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
7 周 |
模拟乘法器/除法器 |
四象限 |
- |
|
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|
TO-100-10 金属罐 |
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AD5360BSTZ |
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- |
- |
- |
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|
表面贴装 |
LQFP |
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10.2 mm |
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52 |
|
|
10.2 x 10.2 x 1.6 mm |
1.6 mm |
16 位 |
16 |
串行 |
双，单 |
540ksps |
2.5 → 5.5 V |
外部 |
电阻串 |
20µs |
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±20mV |
±16.5V |
10.2 mm |
±4LSB |
-40 °C |
85 °C |
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- |
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AD9136BCPZ |
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表面贴装 |
LFCSP |
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12.1 mm |
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88 |
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12.1 x 11.85 x 0.855 mm |
0.855 mm |
16 位 |
2 |
串行（3 线 4 线 SPI） |
单 |
2Gsps |
1.2 V，3.3 V |
外部 |
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20ns |
|
5.5%FSR |
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11.85 mm |
±2LSB |
-40 °C |
85 °C |
- |
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AD654JRZ |
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表面贴装 |
SOIC |
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5mm |
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8 |
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5 x 4 x 1.5mm |
1.5mm |
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双，单 |
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5 V，9 V，12 V，15 V，18 V，24 V，28 V |
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±12 V, ±15 V, ±9 V |
4mm |
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-40 °C |
85 °C |
- |
- |
VFC |
非同步 |
500kHz |
±0.4%FSR |
