|
|
|
|
|
|
NOJT156M004RWJ |
|
|
|
|
|
|
|
-55°C ~ 105°C |
|
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
OxiCap |
15µF |
±20% |
6% |
T |
- |
1411 (3528 Metric), 1210 |
1210(3528 公制) |
1411 (3528 Metric), 1210 |
14 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
3.5mA |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K20.0000C1GE00 |
KC3225K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
30mA |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032A64.0000C10E00 |
KC5032A-C1,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
HL026R8BTTR |
MLO™ |
多层 |
|
|
|
|
|
|
表面贴装 |
|
|
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
- |
|
|
|
无磁性 |
274mA |
- |
无屏蔽 |
470 毫欧最大 |
30 @ 450MHz |
4.45GHz |
0402(1005 公制) |
6.8nH |
|
|
±0.1nH |
|
|
|
|
0402(1005 公制) |
|
12 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
3.3V |
0.071"(1.80mm) |
35mA |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
KC7050A64.0000C3GE00 |
KC7050A-C3,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PBRC8.00GR50X000 |
|
|
|
±0.5% |
|
|
|
|
表面贴装 |
|
|
|
|
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
7.4 x 3.4 x 2 mm |
|
SMT |
|
8MHz |
±0.5% |
2 |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
HL021R1BTTR |
MLO™ |
多层 |
|
|
|
|
|
|
表面贴装 |
|
|
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
- |
|
|
|
无磁性 |
345mA |
- |
无屏蔽 |
99 毫欧最大 |
24 @ 450MHz |
17.45GHz |
0402(1005 公制) |
1.1nH |
|
|
±0.1nH |
|
|
|
|
0402(1005 公制) |
|
12 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
W2A45A180KAT2A |
W2A |
|
|
|
|
|
|
|
表面贴装 |
0508 (1220M) |
|
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
±10% |
|
|
|
|
|
|
- |
|
|
|
|
|
125°C |
|
-55°C |
18 pF |
50 V DC |
C0G |
|
|
|
|
4 |
- |
|
|
|
|
|
|
CX3225SB20000H0PSTC2 |
CX3225SB,Kyocera |
MHz 晶体 |
20MHz |
±50ppm |
12pF |
50 欧姆 |
基谐 |
-40°C ~ 125°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±100ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
NOJV687M004RWJ |
|
|
|
|
|
|
|
-55°C ~ 105°C |
|
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
OxiCap |
680µF |
±20% |
14% |
V |
- |
2924(7361 公制) |
2924(7361 公制) |
2924(7361 公制) |
24 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
NOSD157M006R0100 |
|
|
|
|
|
|
|
-55°C ~ 125°C |
|
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
OxiCap |
150µF |
±20% |
6% |
D |
低 ESR |
2917(7343 公制) |
2917(7343 公制) |
2917(7343 公制) |
14 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
5mA |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
KC7050K25.0000C1GE00 |
KC7050K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
5mA |
0.079" 长 x 0.063" 宽(2.00mm x 1.60mm) |
MC2016K25.0000C16ESH |
MC2016K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 105°C |
表面贴装 |
|
|
|
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
L04023R9BHLTR |
Accu-L® 0402 |
薄膜 |
|
|
|
|
|
|
表面贴装 |
|
|
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
- |
|
|
|
无磁性 |
250mA |
- |
无屏蔽 |
450 毫欧最大 |
13 @ 450MHz |
8GHz |
0402(1005 公制) |
3.9nH |
|
|
±0.1nH |
|
|
|
|
0402(1005 公制) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
5mA |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K32.7680C10E00 |
KC3225K,Kyocera |
XO(标准) |
|
|
|
|
|
-10°C ~ 70°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ML03V12R5BAT2A |
|
|
|
|
|
|
|
|
表面贴装 |
0603 (1608M) |
|
|
|
- |
|
|
|
|
|
0±30ppm/°C |
|
|
|
|
|
|
|
|
|
|
|
-0.1 → 0.1pF |
|
|
|
1.6 x 0.838 x 0.635 mm |
|
|
|
|
|
|
0.64 mm |
1.6 mm |
125°C |
|
-55°C |
2.5 pF |
250 V 直流 |
聚合体 |
-55 → 125 °C |
0.84 mm |
-0.1pF |
0.1pF |
|
|
|
|
|
|
|
|
CX3225SB27000D0FLJCC |
CX3225SB,Kyocera |
MHz 晶体 |
27MHz |
±10ppm |
8pF |
50 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
NOSA106K006R2000 |
|
|
|
|
|
|
|
-55°C ~ 125°C |
|
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
OxiCap |
10µF |
±10% |
6% |
A |
低 ESR |
1206(3216 公制) |
1206(3216 公制) |
1206(3216 公制) |
15 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
W2A41A220KAT2A |
IPC |
|
|
|
|
|
|
|
表面贴装 |
0508(1220 公制) |
0.083" 长 x 0.051" 宽(2.10mm x 1.30mm) |
|
|
- |
符合限制有害物质指令(RoHS)规范要求 |
|
- |
陶瓷 |
隔离 |
C0G,NP0 |
|
|
|
|
|
|
|
|
|
|
|
±10% |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
5mA |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032K28.6364C1GE00 |
KC5032K,Kyocera |
XO(标准) |
|
|
|
|
|
-40°C ~ 85°C |
表面贴装 |
|
|
|
标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4-SMD,无引线 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|