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CDB470XS-DC28 |
Crystal® |
音频，音频处理 |
CS47028 |
2 ADCs，8 DACs |
- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
单端 |
板 |
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EV-K0-HCD |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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78K |
评估平台 |
MCU 8-位 |
78K/0 |
- |
- |
UPD78F8024GK |
固定 |
板，电缆，电源，配件 |
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LTC2410 |
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板 |
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盒 |
2 |
24 |
MICROWIRE™，串行，SPI™ |
- |
- |
DC575A |
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SI4735-D60-EVB |
- |
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板 |
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接收器 |
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散装 |
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153kHz ~ 279kHz，520kHz ~ 1.71MHz，2.3MHz ~ 26.1MHz，64MHz ~ 108MHz |
SI4735 |
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STEVAL-MKI195V1 |
- |
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LSM6DSRX |
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板 |
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散装 |
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加速计，陀螺仪，3 轴 |
- |
- |
- |
- |
无 |
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HA9P5002-5Z |
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表面贴装 |
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SOIC |
双 |
1 |
8 |
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±12 V, ±15 V, ±18 V, ±9 V |
1300V/µs |
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0 °C |
75 °C |
0 dB |
无 |
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- |
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LTC2155-14 |
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板 |
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散装 |
2 |
14 |
并联，串行，SPI |
1.5Vpp |
621mW @ 170MSPS |
DC1564A-C |
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VF-84 |
- |
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板 |
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GNSS（Galileo，GLONASS，GPS，QZSS） |
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散装 |
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- |
GF-8804 |
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MARS1-AR0231AT7-GEVB |
- |
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AR0231AT |
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板 |
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散装 |
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图像传感器 |
2.3 百万像素 |
并联，串行 |
40fps |
- |
- |
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THS3111ID |
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表面贴装 |
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电流反馈 |
SOIC |
双/单 |
1 |
8 |
30 V |
100MHz |
±15V |
900V/µs |
10 MHz |
-40 °C |
85 °C |
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无 |
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- |
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LTC2380-24 |
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板，电缆 |
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盒 |
1 |
24 |
SPI |
±VREF |
28mW @ 2MSPS |
DC2289A-A |
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EV-BT840XE |
- |
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板 |
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收发器; 802.15.4 (线程，ZigBee®)，Bluetooth® 5 |
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盒 |
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2.4GHz |
BT840XE |
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SPC572LADPT100S |
- |
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SPC572Lx |
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评估平台 |
评估平台 |
- |
- |
评估平台 |
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插口 |
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散装 |
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板 |
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OPA2340UA |
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表面贴装 |
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精密 |
SOIC |
单 |
2 |
8 |
3 V 5 V |
5.5MHz |
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6V/µs |
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-40 °C |
85 °C |
124 dB |
轨至轨输入/输出 |
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- |
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LTC1867 |
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板 |
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盒 |
1 |
16 |
MICROWIRE™，串行，SPI™ |
- |
- |
DC806A |
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105786-HMC438MS8G |
- |
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板 |
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预定标器 |
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袋 |
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0Hz ~ 7GHz |
HMC438MS8G |
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NUCLEO-F722ZE |
STM32F7 |
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STM32F722ZE，支持 mbed 的开发 |
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评估平台 |
评估平台 |
ARM® Cortex®-M7 |
- |
评估平台 |
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固定 |
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散装 |
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板 |
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CA3140EZ |
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通孔 |
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PDIP |
双/单 |
1 |
8 |
5 → 28 V |
3.7MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
7V/µs |
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-55 °C |
125 °C |
100 dB |
无 |
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- |
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LTC2143-14 |
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板 |
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散装 |
2 |
14 |
并联 |
1 ~ 2Vpp |
237mW @ 80MSPS |
DC1620A-I |
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PRO-EB-575 |
OnBoard™ |
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板 |
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天线 |
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盒 |
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791MHz ~ 960MHz，1.71GHz ~ 2.17GHz |
PRO-OB-572 |
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