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- |
MT36KSF2G72PZ-1G6P1 |
|
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1600MT/s |
|
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|
|
符合限制有害物质指令(RoHS)规范要求 |
|
- |
DDR3L SDRAM |
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240-RDIMM |
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14-CDIP(0.300",7.62mm) |
14-CDIP |
- |
AD536ASD |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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1.2mA |
5 V ~ 36 V,±3 V ~ 18 V |
通孔 |
管件 |
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20-101-1132 |
MPU 코어 |
Rabbit 4000 |
- |
29.49MHz |
512KB(内部),4MB(外部) |
512KB |
IDC 接头 2x25,2x5 |
1.84" x 2.42"(47mm x 61mm) |
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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- |
AD6633BBCZ |
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CSPBGA |
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- |
- |
- |
- |
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196 |
15.2 x 15.2 x 1.4mm |
15.2mm |
15.2mm |
1.4mm |
|
- |
- |
- |
1.4 W |
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- |
ADXRS649BBGZ |
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CBGA |
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表面贴装 |
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3 |
±20000°/s |
0.12mV/°/s |
模拟 |
- |
0.25°/s |
32 |
7.05 x 7.05 x 3.2mm |
7.05mm |
7.05mm |
3.2mm |
2000Hz |
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- |
AD5791BRUZ |
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- |
- |
|
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TSSOP |
|
|
表面贴装 |
|
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|
125 °C |
|
-40 °C |
|
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|
|
20 |
6.6 x 4.5 x 1.05 mm |
6.6 mm |
4.5 mm |
1.05 mm |
|
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|
20 位 |
1 |
串行 (SPI) |
双 |
|
外部,内部 |
R-2R,电阻串 |
1µs |
双极 |
±21LSB |
±16.5V |
±1LSB |
- |
- |
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14-CERDIP |
- |
AD734SQ/883B |
|
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|
含铅/不符合限制有害物质指令(RoHS)规范要求 |
7 周 |
|
|
* |
|
|
14-CDIP(0.300",7.62mm) |
|
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管件 |
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14-CDIP |
- |
MPY100BG |
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符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
|
MPY |
模拟乘法器/除法器 |
四象限 |
14-CDIP(0.300",7.62mm) |
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管件 |
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- |
256KB |
DMA |
CAN,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG |
Artix™-7 FPGA,65K 逻辑单元 |
400-LFBGA,CSPBGA |
400-CSPBGA(17x17) |
- |
XC7Z014S-1CLG400I |
|
单 ARM® Cortex®-A9 MPCore™,带 CoreSight™ |
|
667MHz |
|
|
|
|
-40°C ~ 100°C(TJ) |
符合限制有害物质指令(RoHS)规范要求 |
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- |
ADIS16227CMLZ |
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ML |
|
|
表面贴装 |
|
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3 |
±70g |
2.384mg/LSB |
数字 |
SPI |
3.3mg/√Hz |
14 |
15.2 x 15.2 x 15.2mm |
15.2mm |
15.2mm |
15.2mm |
- |
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|
20-101-1195 |
MPU 코어 |
Rabbit 3000 |
- |
44.2MHz |
512KB(内部),4MB(外部) |
1MB |
2 IDC 针座 2x17,1 IDC 针座 2x5 |
1.85" x 2.73"(47mm x 69mm) |
-40°C ~ 85°C |
符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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- |
HMC939LP4E |
|
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|
表面安装 |
|
|
|
|
31dB |
33GHz |
8.5dB |
- |
85 °C |
- |
-40 °C |
|
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|
24 |
4.1 x 4.1 x 0.95mm |
4.1mm |
4.1mm |
0.95mm |
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- |
R0E000010KCE00 |
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- |
- |
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|
仿真器 |
RX600 系列 |
I2C |
|
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|
- |
SCR2100-D08 |
|
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|
SOIC |
|
|
表面贴装 |
|
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|
|
1 |
±125°/s |
- |
数字 |
SPI |
- |
24 |
15 x 8.5 x 3.95mm |
15mm |
8.5mm |
3.95mm |
8MHz |
|
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- |
AD5370BSTZ |
|
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- |
- |
|
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|
|
LQFP |
|
|
表面贴装 |
|
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|
|
85 °C |
|
-40 °C |
|
|
|
|
|
|
64 |
10.2 x 10.2 x 1.45 mm |
10.2 mm |
10.2 mm |
1.45 mm |
|
|
|
|
|
16 位 |
40 |
串行 |
单 |
9 → 16.5 V |
外部 |
电阻串 |
30µs |
双极 |
±10mV |
|
±4LSB |
- |
- |
|
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|
- |
256KB |
DMA |
CAN,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG |
Kintex™-7 FPGA,125K 逻辑单元 |
484-BBGA,FCBGA |
484-FCBGA(23x23) |
- |
XC7Z030-2FBG484I |
|
双 ARM® Cortex®-A9 MPCore™,带 CoreSight™ |
|
800MHz |
|
|
|
|
-40°C ~ 100°C(TJ) |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
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|
- |
256KB |
DMA |
CAN,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG |
Kintex™-7 FPGA,125K 逻辑单元 |
676-BBGA,FCBGA |
676-FCBGA(27x27) |
- |
XC7Z030-1FFG676C |
|
双 ARM® Cortex®-A9 MPCore™,带 CoreSight™ |
|
667MHz |
|
|
|
|
0°C ~ 85°C(TJ) |
符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
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|
- |
256KB |
DMA |
CAN,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG |
Kintex™-7 FPGA,125K 逻辑单元 |
484-BBGA,FCBGA |
484-FCBGA(23x23) |
- |
XC7Z030-2FB484I |
|
双 ARM® Cortex®-A9 MPCore™,带 CoreSight™ |
|
800MHz |
|
|
|
|
-40°C ~ 100°C(TJ) |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
6 周 |
|
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|
|
|
|
- |
MT8KTF51264AZ-1G9P1 |
|
|
|
1866MT/s |
|
|
|
|
|
符合限制有害物质指令(RoHS)规范要求 |
|
- |
DDR3L SDRAM |
|
|
|
240-UDIMM |
|
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|
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|
- |
DLPC350ZFF |
|
|
|
|
|
|
|
|
|
- |
- |
|
|
|
|
|
BGA |
|
|
表面贴装 |
|
|
150MHz |
|
|
85 °C |
|
0 °C |
|
|
|
|
|
|
419 |
23.5 x 23.5 x 1.85mm |
23.5mm |
24Bit |
1.85mm |
|
|
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|
|
|
|
24Bit |
32 kB |
RISC |
64 MB |
闪存 |
浮点 |
3.3 V |
1 |
2 |
1 |
1 |
1 |
|
|
|