|
|
LM3900N |
|
|
|
|
|
PDIP |
|
|
|
Norton |
通孔 |
双/单 |
4 |
14 |
5 → 28 V |
2.5MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
20V/µs |
|
0 °C |
70 °C |
69 dB |
|
|
|
无 |
|
|
|
LM224N |
|
|
|
|
|
PDIP |
|
|
|
精密 |
通孔 |
双/单 |
4 |
14 |
5 → 28 V |
1.2MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
0.5V/µs |
|
-25 °C |
85 °C |
100 dB |
|
|
|
无 |
|
|
|
MCP6004T-I/SL |
|
|
|
|
|
SOIC |
|
|
|
通用 |
表面贴装 |
单 |
4 |
14 |
1.8 → 6 V |
1MHz |
|
0.6V/µs |
1 kHz |
-40 °C |
85 °C |
112 dB |
|
|
|
轨至轨输入/输出 |
|
|
|
LM324N |
|
|
|
|
|
PDIP |
|
|
|
精密 |
通孔 |
双/单 |
4 |
14 |
5 → 28 V |
1.2MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
0.5V/µs |
|
0 °C |
70 °C |
100 dB |
|
|
|
无 |
|
|
|
TL081CDT |
|
|
|
|
|
SOIC |
|
|
|
|
表面贴装 |
双 |
1 |
8 |
|
4MHz |
|
16V/µs |
|
0 °C |
70 °C |
106 dB |
|
|
|
无 |
|
|
|
MCP6004-I/SL |
|
|
|
|
|
SOIC |
|
|
|
通用 |
表面贴装 |
单 |
4 |
14 |
3 V 5 V |
1MHz |
|
0.6V/µs |
|
-40 °C |
85 °C |
112 dB |
|
|
|
轨至轨输入/输出 |
|
|
|
LM2904AYDT |
|
|
|
|
|
SOIC |
|
|
|
低功耗 |
表面贴装 |
单 |
2 |
8 |
3 → 30 V |
1.1MHz |
|
0.6V/µs |
100 kHz |
-40 °C |
125 °C |
100 dB |
|
|
AEC-Q100 |
无 |
|
|
|
MCP6002-I/SN |
|
|
|
|
|
SOIC |
|
|
|
通用 |
表面贴装 |
单 |
2 |
8 |
3 V、5 V |
1MHz |
|
0.6V/µs |
|
-40°C |
85 °C |
112 dB |
|
|
|
轨至轨输入/输出 |
|
|
|
NJM4556AV-TE1 |
|
|
|
|
|
SSOP |
|
|
|
|
表面贴装 |
双 |
2 |
8 |
|
8MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
3V/µs |
|
-20 °C |
75 °C |
100 dB |
|
|
|
无 |
|
|
|
LM224N |
|
|
|
|
|
PDIP |
|
|
|
精密 |
通孔 |
双/单 |
4 |
14 |
5 → 28 V |
1.2MHz |
±12 V, ±15 V, ±3 V, ±5 V, ±9 V |
0.5V/µs |
|
-25 °C |
85°C |
100 dB |
|
|
|
无 |
|
|
|
MCP6002-I/SN |
|
|
|
|
|
SOIC |
|
|
|
通用 |
表面贴装 |
单 |
2 |
8 |
3 V 5 V |
1MHz |
|
0.6V/µs |
|
-40°C |
85°C |
112 dB |
|
|
|
轨至轨输入/输出 |
|
|
|
LM833DT |
|
|
|
|
|
SOIC |
|
|
|
|
表面贴装 |
双 |
2 |
8 |
|
15MHz |
±12 V, ±3 V, ±5 V, ±9 V |
7V/µs |
|
-40 °C |
105 °C |
100 dB |
|
|
|
无 |
|
|
|
LMV321LILT |
|
|
|
|
|
SOT-23 |
|
|
|
低功耗 |
表面贴装 |
单 |
1 |
5 |
2.7 V 5 V |
1.3MHz |
|
0.6V/µs |
10 kHz |
-40 °C |
125 °C |
100 dB |
7mV |
5.5 V |
|
轨到轨输出 |
70 mA |
|
|
MCP6L04T-E/ST |
|
|
|
|
|
TSSOP |
|
|
|
通用 |
表面贴装 |
单 |
4 |
14 |
1.8 → 6 V |
1MHz |
|
0.6V/µs |
|
-40 °C |
125 °C |
105 dB |
|
|
|
轨至轨输入/输出 |
|
|
|
MCP6042-I/SN |
|
|
|
|
|
SOIC |
|
|
|
通用 |
表面贴装 |
单 |
2 |
8 |
|
14kHz |
|
3V/ms |
1 kHz |
-40 °C |
85 °C |
115 dB |
±3mV |
6 V |
|
轨至轨输入/输出 |
20（短路）mA |
|
|
LMV358ID |
|
|
|
|
|
SOIC |
|
|
|
|
表面贴装 |
单 |
2 |
8 |
3 V 5 V |
1MHz |
|
1V/µs |
|
-40°C |
85°C |
100 dB |
|
|
|
轨到轨输出 |
|
|
|
NCS20072DR2G |
|
|
|
|
|
SOIC |
|
|
|
高速 |
表面贴装 |
双/单 |
2 |
8 |
2.7 → 36 V |
3.2MHz |
±1.35 → ±18V |
2.8V/µs |
|
-40 °C |
125 °C |
120 dB |
±4mV |
±18（双）V，36（单）V |
|
轨到轨输出 |
70 mA |
|
|
LMV324IDR |
|
|
|
|
|
SOIC |
|
|
|
|
表面贴装 |
单 |
4 |
14 |
3 V, 5 V |
1MHz |
|
1V/µs |
|
-40 °C |
85 °C |
100 dB |
|
|
|
轨到轨输出 |
|
|
|
|
RFX8050 |
- |
802.11a/n/ac |
- |
16-QFN（2.5x2.5） |
16-XFQFN 裸露焊盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
RFX8055 |
- |
802.11a/n/ac |
- |
16-QFN（2.3x2.3） |
16-XFQFN 裸露焊盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
