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MX25U6435FZNI-10G |
MX25xxx35/36 - MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
30µs,3ms |
- |
SPI |
1.65 V ~ 2 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-WDFN 裸露焊盘 |
8-WSON(6x5) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX30LF1208AA-TI |
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表面贴装 |
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- |
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512Mbit |
并行 |
TSOP |
48 |
64M x 8 位 |
NAND |
2.7 V |
3.6 V |
64M |
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25ns |
8Bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
12.1mm |
1.05mm |
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MX29F040CQI-70G |
MX29F |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
70ns |
70ns |
并联 |
4.5 V ~ 5.5 V |
-40°C ~ 85°C(TA) |
表面贴装 |
32-LCC(J 形引线) |
32-PLCC(11.43x14.05) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29F200CBTI-70G |
MX29F |
非易失 |
闪存 |
FLASH - NOR |
2Mb (256K x 8) |
70ns |
70ns |
并联 |
4.5 V ~ 5.5 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL640ETTI-70G |
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表面贴装 |
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- |
- |
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64Mbit |
并行 |
TSOP |
48 |
4M x 16 位,8M x 8 位 |
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2.7 V |
3.6 V |
4M, 8M |
4 |
70ns |
8 bit, 16 bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
18.5mm |
1.05mm |
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MX25L12835FMI-10G |
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表面贴装 |
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- |
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128Mbit |
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SOP |
16 |
128M x 1 位,32M x 4 位,64M x 2 位 |
NOR |
2.7 V |
3.6 V |
32M, 64M, 128M |
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1 bit, 2 bit, 4 bit |
10.5 x 7.6 x 2.45mm |
7.6mm |
-40 °C |
85 °C |
10.5mm |
2.45mm |
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MX29LV320ETXEI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-LFBGA,CSPBGA |
48-LFBGA,CSP(6x8) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L12835FM2I-10G |
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表面贴装 |
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128Mbit |
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SOP |
8 |
128M x 1 位,32M x 4 位,64M x 2 位 |
NOR |
2.7 V |
3.6 V |
32M, 64M, 128M |
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1 bit, 2 bit, 4 bit |
5.33 x 5.38 x 1.91mm |
5.38mm |
-40 °C |
85 °C |
5.33mm |
1.91mm |
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MX25R6435FM2IL0 |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
100µs,10ms |
- |
SPI |
1.65 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25R6435FM2IH0 |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
100µs,4ms |
- |
SPI |
1.65 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-SOIC(0.209",5.30mm 宽) |
8-SOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL640EHXFI-70G |
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表面贴装 |
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64Mbit |
并行 |
LFBGA |
64 |
4M x 16 位,8M x 8 位 |
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2.7 V |
3.6 V |
4M, 8M |
4 |
70ns |
8 bit, 16 bit |
11.1 x 13.1 x 0.65mm |
13.1mm |
-40 °C |
85 °C |
11.1mm |
0.65mm |
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MX29GL320EHT2I-70G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
56-TFSOP(0.724",18.40mm 宽) |
56-TSOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL320ELT2I-70G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
56-TFSOP(0.724",18.40mm 宽) |
56-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25L6445EMI-10G |
MX25xxx45 - MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
300µs,5ms |
- |
SPI |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
16-SOIC(0.295",7.50mm 宽) |
16-SOP |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX25R6435FZAIH0 |
MXSMIO™ |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
100µs,4ms |
- |
SPI |
1.65 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-UDFN 裸露焊盘 |
8-USON(4x4) |
- |
符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29GL320EHXFI-70G |
MX29GL |
非易失 |
闪存 |
FLASH - NOR |
32Mb (4M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
64-LBGA,CSPBGA |
64-LFBGA,CSP(11x13) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29F400CTTI-70G |
MX29F |
非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
70ns |
70ns |
并联 |
4.5 V ~ 5.5 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29LV640ETXEI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-LFBGA,CSPBGA |
48-LFBGA,CSP(6x8) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29LV640EBXEI-70G |
MX29LV |
非易失 |
闪存 |
FLASH - NOR |
64Mb (8M x 8) |
70ns |
70ns |
并联 |
2.7 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
48-LFBGA,CSPBGA |
48-LFBGA,CSP(6x8) |
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符合限制有害物质指令(RoHS)规范要求 |
16 周 |
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MX29F800CBTI-70G |
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表面贴装 |
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8Mbit |
并行 |
TSOP |
48 |
1M x 8 位,512K x 16 位 |
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4.5 V |
5.5 V |
1M, 512K |
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70ns |
8 bit, 16 bit |
18.5 x 12.1 x 1.05mm |
12.1mm |
-40 °C |
85 °C |
18.5mm |
1.05mm |
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