|
|
CY8C3666LTI-203 |
QFN |
|
|
|
表面贴装 |
|
|
|
68 |
1.71 V |
5.5 V |
8 x 8 x 0.95mm |
8mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
汽车，电容性感应，控制器，嵌入式，闪存，LCD，LED，USB |
CMOS |
|
|
SN74LS164N |
PDIP |
移位寄存器 |
8 |
LS |
通孔 |
- |
串行至并行 |
1 |
14 |
4.75 V |
5.25 V |
19.3 x 6.35 x 4.57mm |
19.3mm |
6.35mm |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SST25VF016B-75-4I-QAF-T |
WSON |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
6 x 5 x 0.75mm |
6mm |
5mm |
- |
0.75mm |
-40 °C |
85 °C |
- |
- |
- |
- |
16Mbit |
SPI |
2M x 8 位 |
分门 |
2.7 V |
3.6 V |
对称 |
2M |
|
6ns |
8Bit |
|
|
|
|
|
SST39VF3201C-70-4I-EKE |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.2 x 1.05mm |
18.5mm |
12.2mm |
- |
1.05mm |
-40 °C |
85 °C |
- |
- |
- |
- |
32MB |
并行 |
2M x 16 位 |
分门 |
2.7 V |
3.6 V |
对称 |
2M |
|
70ns |
16Bit |
|
|
|
|
|
MX30UF4G18AB-TI |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.1 x 1.05mm |
12.1mm |
12.1mm |
- |
1.05mm |
-40 °C |
85 °C |
- |
- |
- |
- |
4Gbit |
并行 |
256M x 16 位，512M x 8 位 |
NAND |
1.7 V |
1.95 V |
|
256M, 512M |
|
25ns |
8 bit, 16 bit |
|
|
|
|
|
CY8C27643-24PVXI |
SSOP |
|
|
|
表面贴装 |
|
|
|
48 |
3 V |
5.25 V |
16 x 7.6 x 2.79mm |
16mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微处理器 |
汽车，Capsense 开发，DElta Sigma ADC，嵌入式，闪存，输入/输出，LED，PSoC 1 混合信号阵列，SRAM，USB |
CMOS |
|
|
EM3596-RT |
QFN |
|
|
|
表面贴装 |
|
|
|
56 |
2.1 V |
3.6 V |
8 x 8 x 0.85mm |
8mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微控制器 |
楼宇自动化和控制，一般 Zigbee 无线传感器网络，家庭自动化和控制，安全和监控，智能能量 |
32 bit ARM Cortex M3 |
|
|
ADE7768ARZ |
SOIC |
|
|
|
表面贴装 |
|
|
|
16 |
|
|
10 x 4 x 1.5mm |
10mm |
4mm |
- |
1.5mm |
-40 °C |
85 °C |
- |
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
KE4CN3H5A |
BGA |
|
|
|
表面贴装 |
|
|
|
153 |
|
|
11.5 x 13 x 1mm |
11.5mm |
13mm |
- |
1mm |
|
|
- |
- |
- |
- |
8 GByte |
EMMC |
|
NAND |
|
|
|
|
|
|
|
|
|
|
|
|
SST39VF6401B-70-4C-EKE |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.2 x 1.05mm |
18.5mm |
12.2mm |
- |
1.05mm |
0 °C |
70 °C |
- |
- |
- |
- |
64Mbit |
并行 |
4M x 16 位 |
分门 |
2.7 V |
3.6 V |
对称 |
4M |
|
70ns |
16Bit |
|
|
|
|
|
MX29GL128FLXFI-90G |
LFBGA |
|
|
|
表面贴装 |
|
|
|
64 |
|
|
13.1 x 11.1 x 0.8mm |
11.1mm |
11.1mm |
- |
0.8mm |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
并行 |
16M x 8 位，8M x 16 位 |
|
2.7 V |
3.6 V |
|
8M, 16M |
4 |
90ns |
8 bit, 16 bit |
|
|
|
|
|
CY8C27143-24PXI |
PDIP |
|
|
|
表面贴装 |
|
|
|
8 |
3 V |
5.25 V |
9.9 x 6.6 x 3.68mm |
9.9mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微处理器 |
汽车，Capsense 开发，DElta Sigma ADC，嵌入式，闪存，输入/输出，LED，PSoC 1 混合信号阵列，SRAM，USB |
CMOS |
|
|
CD4014BEE4 |
PDIP |
移位寄存器 |
8 |
4000 |
通孔 |
- |
串行/并行至并行 |
1 |
16 |
3 V |
18 V |
19.3 x 6.35 x 4.57mm |
19.3mm |
6.35mm |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
MX25R6435FM2IL0 |
SOP |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.38 x 5.33 x 1.91mm |
5.38mm |
5.33mm |
- |
1.91mm |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
串行 |
16 x 4 位，32M x 2 位，64M x 1 位 |
NOR |
1.7 V |
3.6 V |
|
16M, 32M, 64M |
16 |
|
1 bit, 2 bit, 4 bit |
|
|
|
|
|
SST25VF040B-50-4I-SAF |
SOIC |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5 x 4 x 1.5mm |
5mm |
4mm |
- |
1.5mm |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
SPI |
512K x 8 |
分门 |
2.7 V |
3.6 V |
对称 |
512K |
|
8ns |
8Bit |
|
|
|
|
|
W25Q32JVZPIQ/TUBE |
WSON |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
6.1 x 5.1 x 0.75mm |
6.1mm |
5.1mm |
- |
0.75mm |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
4M x 8 |
|
2.7 V |
3.6 V |
|
4M |
|
|
8Bit |
|
|
|
|
|
CY8C24994-24LTXI |
QFN |
|
|
|
表面贴装 |
|
|
|
68 |
3 V |
5.25 V |
8.1 x 8.1 x 0.85mm |
8.1mm |
|
- |
|
-40°C |
85°C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微处理器 |
电容式传感 |
CMOS |
|
|
NCH-RSL10-101Q48-ABG |
QFN |
|
|
|
表面贴装 |
|
|
|
48 |
1.25 V 直流 |
3.3 V 直流 |
6 x 6 x 0.95mm |
6mm |
|
- |
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
|
|
微处理器 |
蓝牙 |
ARM Cortex |
|
|
ADE7763ARSZ |
SSOP |
|
|
|
表面贴装 |
|
|
|
20 |
|
|
7.2 x 5.3 x 1.75mm |
7.2mm |
5.3mm |
- |
1.75mm |
-40 °C |
85 °C |
- |
- |
- |
- |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
TC58NVG1S3ETAI0 |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.4 x 12.4 x 1mm |
18.4mm |
12.4mm |
- |
1mm |
-40 °C |
85 °C |
- |
- |
- |
- |
2 GByte |
并行 |
256M x 8 |
NAND |
-0.6 V |
4.6 V |
对称 |
256M |
|
25ns |
8Bit |
|
|
|
