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|
MX66L51235FMI-10G |
SOP |
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|
表面贴装 |
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16 |
|
|
10.5 x 7.6 x 2.44mm |
10.5mm |
7.6mm |
- |
|
|
2.44mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
512Mbit |
串行 |
128M x 4 位，256M x 2 位，512M x 1 位 |
NOR |
|
128M, 256M, 512M |
|
1 bit, 2 bit, 4 bit |
|
|
|
|
|
|
|
|
A25L020CO-F |
SOP |
|
|
|
表面贴装 |
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8 |
|
|
5.33 x 5.38 x 1.91mm |
5.33mm |
5.38mm |
- |
|
|
1.91mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
2Mbit |
SPI |
256K x 8 位 |
|
|
256K |
5ns |
8Bit |
|
|
|
|
|
|
|
|
SST25VF010A-33-4I-SAE |
SOIC |
|
|
|
表面贴装 |
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|
8 |
|
|
4 x 5 x 1.5mm |
4mm |
5mm |
- |
|
|
1.5mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
1Mbit |
SPI |
128K x 8 位 |
分门 |
对称 |
128K |
12ns |
8Bit |
|
|
|
|
|
|
|
|
CY8C29466-24SXI |
SOIC |
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|
表面贴装 |
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|
28 |
3 V |
5.25 V |
18.11 x 7.62 x 2.37mm |
18.11mm |
|
- |
|
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|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
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微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LCD，LED，USB |
CMOS |
|
|
|
|
|
BLUENRG-132 |
QFN |
|
|
|
表面贴装 |
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|
32 |
1.7 V |
3.6 V |
5 x 5 x 0.95mm |
5mm |
|
- |
|
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|
|
-40 °C |
105 °C |
|
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- |
- |
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Bluetooth |
|
ARM Cortex |
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ADE7755ARSZ |
SSOP |
|
|
|
表面贴装 |
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|
|
24 |
|
|
8.2 x 5.3 x 1.75mm |
8.2mm |
5.3mm |
- |
|
|
1.75mm |
|
|
-40 °C |
85 °C |
- |
- |
- |
- |
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MX29F040CQI-70G |
PLCC |
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|
|
通孔 |
|
|
|
32 |
|
|
14.12 x 11.5 x 2.89mm |
14.12mm |
11.5mm |
- |
|
|
2.89mm |
5.5 V |
4.5 V |
-40 °C |
85 °C |
- |
- |
- |
- |
4Mbit |
并行 |
512K x 8 位 |
|
|
512K |
70ns |
8Bit |
|
|
|
|
|
|
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|
N25Q032A11EF640E |
MLP |
|
|
|
表面贴装 |
|
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|
8 |
|
|
6 x 5 x 0.85mm |
6mm |
5mm |
- |
|
|
0.85mm |
2 V |
1.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
4M x 8 位 |
NOR |
对称 |
4M |
5ns |
8Bit |
|
|
|
|
|
|
|
|
SST26VF032B-104I/SM |
SOIJ |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.26 x 5.25 x 1.98mm |
5.26mm |
5.25mm |
- |
|
|
1.98mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
4M x 8 位 |
分门 |
对称 |
4M |
3ns |
8Bit |
|
|
|
|
|
|
|
|
CY8C24794-24LTXI |
QFN |
|
|
|
表面贴装 |
|
|
|
56 |
3 V |
5.25 V |
8 x 8 x 0.95mm |
8mm |
|
- |
|
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|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LCD，LED，USB |
CMOS |
|
|
|
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|
TPG1LG01 |
|
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- |
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- |
- |
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|
在线服务编程器 |
16 位 PIC 微控制器，32 位 Microchip PIC MCU，8 位 PIC 微控制器，闪存设备 |
USB |
|
|
ADE7878AACPZ |
LFCSP |
|
|
|
表面贴装 |
|
|
|
40 |
|
|
6.1 x 6.1 x 0.75mm |
6.1mm |
6.1mm |
- |
24 位 |
8ksps |
0.75mm |
3.7 V |
2.8 V |
-40 °C |
85 °C |
- |
- |
- |
- |
|
|
|
|
|
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|
MX25L6445EMI-10G |
SOP |
|
|
|
表面贴装 |
|
|
|
16 |
|
|
10.5 x 7.6 x 2.44mm |
10.5mm |
7.6mm |
- |
|
|
2.44mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
|
16 x 4 位，32M x 2 位，64M x 1 位 |
NOR |
|
16M, 32M, 64M |
|
1 bit, 2 bit, 4 bit |
|
|
|
|
|
|
|
|
SST26VF032BA-104I/SM |
SOIJ |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.26 x 5.25 x 1.98mm |
5.26mm |
5.25mm |
- |
|
|
1.98mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
SPI |
4M x 8 位 |
分门 |
对称 |
4M |
3ns |
8Bit |
|
|
|
|
|
|
|
|
CC2541F256RHAT |
VQFN |
|
|
|
表面贴装 |
|
|
|
40 |
2 V |
3.6 V |
6.15 x 6.15 x 0.95mm |
6.15mm |
|
- |
|
|
|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
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微控制器 |
蓝牙、消费电子产品、人机接口设备 |
IEEE 802.15.4 |
|
|
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|
|
nRF52810-QCAA-T |
QFN |
|
|
|
表面贴装 |
|
|
|
48 |
1.7 V |
3.6 V |
6 x 6 x 0.85mm |
6mm |
|
- |
|
|
|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
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|
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微处理器 |
|
蓝牙智能, 32 位 ARM Cortex M4 |
|
|
|
|
|
SN74HC164NE4 |
PDIP |
移位寄存器 |
8 |
HC |
通孔 |
- |
串行至并行 |
1 |
14 |
2 V |
6 V |
19.3 x 6.35 x 4.57mm |
19.3mm |
6.35mm |
- |
|
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LE25U20AMB-AH |
SOP-K |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
4.9 x 3.9 x 1.5mm |
4.9mm |
3.9mm |
- |
|
|
1.5mm |
3.6 V |
2.3 V |
-40 °C |
85 °C |
- |
- |
- |
- |
2Mbit |
SPI |
256K x 8 位 |
|
对称 |
256K |
|
8Bit |
|
|
|
|
|
|
|
|
PC28F128P33BF60A |
EBGA |
|
|
|
表面贴装 |
|
|
|
64 |
|
|
10.1 x 8.1 x 1.2mm |
10.1mm |
8.1mm |
- |
|
|
1.2mm |
3.6 V |
2.3 V |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
并行 |
8M x 16 位 |
NOR |
非对称 |
8M |
60ns |
16Bit |
|
|
|
|
|
|
|
|
SST38VF6401-90-5C-EKE |
TSOP |
|
|
|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.2 x 1.05mm |
18.5mm |
12.2mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
0 °C |
70 °C |
- |
- |
- |
- |
64Mbit |
并行 |
4M x 16 位 |
分门 |
对称 |
4M |
90ns |
16Bit |
|
|
|
|
|
|
