|
|
74LVC595ABQ |
QFN |
移位寄存器 |
8 |
74LVC |
表面贴装 |
- |
串行至串行/并行 |
1 |
16 |
1.65 V |
3.6 V |
3.6 x 2.6 x 0.95mm |
3.6mm |
2.6mm |
- |
|
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MX25L3233FM1I-08G |
SOP |
|
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|
表面贴装 |
|
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|
8 |
|
|
5.03 x 4 x 1.55mm |
5.03mm |
4mm |
- |
|
|
1.55mm |
3.6 V |
2.65 V |
-40 °C |
85 °C |
- |
- |
- |
- |
32Mbit |
|
16M x 2 位，32M x 1 位，8M x 4 位 |
NOR |
|
8M, 16M, 32M |
|
|
1 bit, 2 bit, 4 bit |
|
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MX30LF1G08AA-TI |
TSOP |
|
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|
表面贴装 |
|
|
|
48 |
|
|
18.5 x 12.1 x 1.05mm |
12.1mm |
12.1mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
1Gbit |
并行 |
128M x 8 位 |
NAND |
|
128M |
|
25ns |
8Bit |
|
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|
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|
S29GL128P90FFIR20 |
FPBGA |
|
|
|
表面贴装 |
|
|
|
64 |
|
|
13 x 11 x 1mm |
13mm |
11mm |
- |
|
|
1mm |
3.6 V |
3 V |
-40 °C |
85 °C |
- |
- |
- |
- |
128Mbit |
CFI |
128M x 1 位 |
|
|
128M |
|
110ns |
1 |
|
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|
|
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|
CY8C29466-24SXI |
SOIC |
|
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|
表面贴装 |
|
|
|
28 |
3 V |
5.25 V |
18.11 x 7.62 x 2.37mm |
18.11mm |
|
- |
|
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|
-40 °C |
85 °C |
|
|
- |
- |
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微控制器 |
|
CMOS |
|
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|
CY8C21223-24LGXI |
QFN |
|
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|
表面贴装 |
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|
|
16 |
2.4 V |
5.25 V |
3 x 3 x 0.55mm |
3mm |
|
- |
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|
-40 °C |
85 °C |
|
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- |
- |
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微处理器 |
|
CMOS |
|
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CS5463-ISZ |
SSOP |
|
|
|
表面贴装 |
|
|
|
24 |
|
|
8.5 x 5.6 x 1.88mm |
8.5mm |
5.6mm |
- |
8 位 |
|
1.88mm |
5（模拟）V， 5（数字）V |
3.3（数字）V，0（模拟）V |
-40 °C |
85 °C |
- |
- |
- |
- |
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SST49LF008A-33-4C-NHE |
PLCC |
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|
表面贴装 |
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32 |
|
|
11.51 x 14.05 x 2.84mm |
11.51mm |
14.05mm |
- |
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|
2.84mm |
3.6 V |
3 V |
0 °C |
85 °C |
- |
- |
- |
- |
8Mbit |
并行 |
1024K x 8 位 |
分门 |
对称 |
1024K |
|
120ns |
8Bit |
|
|
|
|
|
|
|
|
MX29LV040CTC-70G |
TSOP |
|
|
|
表面贴装 |
|
|
|
32 |
|
|
18.5 x 8.1 x 1.05mm |
18.5mm |
8.1mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
0 °C |
70 °C |
- |
- |
- |
- |
4Mbit |
并行 |
512K x 8 位 |
|
|
512K |
4 |
70ns |
8Bit |
|
|
|
|
|
|
|
|
S29GL256P11FFI010 |
FPBGA |
|
|
|
表面贴装 |
|
|
|
64 |
|
|
13 x 11 x 1mm |
13mm |
11mm |
- |
|
|
1mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
256Mbit |
CFI |
256M x 1 位 |
|
|
256M |
|
110ns |
1 |
|
|
|
|
|
|
|
|
CY8C21334B-24PVXI |
SSOP |
|
|
|
表面贴装 |
|
|
|
20 |
2.4 V |
5.25 V |
7.4 x 5.6 x 1.85mm |
7.4mm |
|
- |
|
|
|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
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|
微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LED，PSoC 1 混合信号阵列，USB |
CMOS |
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|
TPG100010 |
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- |
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- |
- |
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|
在线服务编程器 |
16 位 PIC 微控制器，8 位 PIC 微控制器，DSC，dsPIC，串行 EEPROM |
USB |
|
|
ADE7868AACPZ |
LFCSP |
|
|
|
表面贴装 |
|
|
|
40 |
|
|
6.1 x 6.1 x 0.75mm |
6.1mm |
6.1mm |
- |
24 位 |
8ksps |
0.75mm |
3.7 V |
2.8 V |
-40 °C |
85 °C |
- |
- |
- |
- |
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|
AT45DB011D-SSH-B |
SOIC |
|
|
|
表面贴装 |
|
|
|
8 |
|
|
5.05 x 3.99 x 1.5mm |
5.05mm |
3.99mm |
- |
|
|
1.5mm |
3.6 V |
2.7 V |
-40°C |
85°C |
- |
- |
- |
- |
1Mbit |
SPI |
128K x 8 位 |
|
对称 |
128K |
|
6ns |
8Bit |
|
|
|
|
|
|
|
|
JS28F640P33TF70A |
TSOP |
|
|
|
表面贴装 |
|
|
|
56 |
|
|
18.6 x 14.2 x 1.025mm |
18.6mm |
14.2mm |
- |
|
|
1.03mm |
3.6 V |
2.3 V |
-40 °C |
85 °C |
- |
- |
- |
- |
64Mbit |
并行 |
4M x 16 位 |
NOR |
非对称 |
4M |
|
70ns |
16Bit |
|
|
|
|
|
|
|
|
EM357-ZRT |
QFN |
|
|
|
表面贴装 |
|
|
|
48 |
2.1 V |
3.6 V |
7 x 7 x 0.95mm |
7mm |
|
- |
|
|
|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
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|
|
微控制器 |
楼宇自动化和控制，一般 Zigbee 无线传感器网络，家庭自动化和控制，安全和监控，智能能量 |
32 bit ARM Cortex M3 |
|
|
|
|
|
CY8C28433-24PVXI |
SSOP |
|
|
|
表面贴装 |
|
|
|
28 |
3 V |
5.25 V |
10.4 x 5.6 x 1.85mm |
10.4mm |
|
- |
|
|
|
|
|
-40 °C |
85 °C |
|
|
- |
- |
|
|
|
|
|
|
|
|
|
微处理器 |
汽车，电容性感应，控制器，嵌入式，闪存，LED，PSoC 1 混合信号阵列，USB |
CMOS |
|
|
|
|
|
74HCT165PW |
TSSOP |
移位寄存器 |
8 |
74HCT |
表面贴装 |
- |
串行/并行到串行 |
1 |
16 |
4.5 V |
5.5 V |
5.1 x 4.5 x 0.95mm |
5.1mm |
4.5mm |
- |
|
|
|
|
|
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|
|
S29GL256S11TFIV10 |
TSOP |
|
|
|
表面贴装 |
|
|
|
56 |
|
|
18.5 x 14.1 x 1.05mm |
18.5mm |
14.1mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
256Mbit |
并行 |
16M x 16 位 |
NOR |
对称 |
16M |
|
110ns |
16Bit |
|
|
|
|
|
|
|
|
MX29GL256FLT2I-90Q |
TSOP |
|
|
|
表面贴装 |
|
|
|
56 |
|
|
18.5 x 14.1 x 1.05mm |
18.5mm |
14.1mm |
- |
|
|
1.05mm |
3.6 V |
2.7 V |
-40 °C |
85 °C |
- |
- |
- |
- |
256Mbit |
并行 |
16M x 16 位，32M x 8 位 |
|
|
16M, 32M |
4 |
90ns |
8 bit, 16 bit |
|
|
|
|
|
|
