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CX3225SB54000D0WPTC1 |
CX3225SB,Kyocera |
MHz 晶体 |
54MHz |
±50ppm |
8pF |
50 欧姆 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±100ppm |
AEC-Q200 |
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CX3225SB48000D0FFFCC |
CX3225SB,Kyocera |
MHz 晶体 |
48MHz |
±10ppm |
8pF |
50 欧姆 |
基谐 |
-20°C ~ 70°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±10ppm |
AEC-Q200 |
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NOJE687M002SWJ |
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-55°C ~ 105°C |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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OxiCap |
680µF |
±20% |
12% |
E |
- |
2917(7343 公制) |
2917(7343 公制) |
2917(7343 公制) |
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24 周 |
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ML03V10R1BAT2A |
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表面贴装 |
0603 (1608M) |
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- |
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±0.1pF |
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1.6 x 0.838 x 0.635 mm |
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0.64 mm |
1.6 mm |
125°C |
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-55°C |
0.1 pF |
250 V 直流 |
0±30ppm/°C |
聚合体 |
-55 → 125°C |
0.84 mm |
-0.1pF |
0.1pF |
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CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
30mA |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032A66.6667C10E00 |
KC5032A-C1,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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L04022R7BHNTR |
Accu-L® 0402 |
薄膜 |
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表面贴装 |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
250mA |
- |
无屏蔽 |
250 毫欧最大 |
15 @ 450MHz |
9.5GHz |
0402(1005 公制) |
2.7nH |
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±0.1nH |
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0402(1005 公制) |
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9 周 |
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L08055R6BEWTR |
Accu-L® |
薄膜 |
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表面贴装 |
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- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
750mA |
- |
无屏蔽 |
100 毫欧最大 |
50 @ 450MHz |
4.6GHz |
0805(2012 公制) |
5.6nH |
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±0.1nH |
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0805(2012 公制) |
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9 周 |
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CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
3.5mA |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K16.0000C1GE00 |
KC3225K,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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削峰正弦波 |
1.8V |
0.032"(0.80mm) |
2mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KT2520F38400ZAW18TEK |
KT2520F,Kyocera |
TCXO |
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-40°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±500ppb |
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6-SMD,无引线 |
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CX2016DB19200H0FLJC2 |
CX2016DB,Kyocera |
MHz 晶体 |
19.2MHz |
±10ppm |
12pF |
150 欧姆 |
基谐 |
-30°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.079" 长 x 0.063" 宽(2.00mm x 1.60mm) |
0.018"(0.45mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±15ppm |
AEC-Q200 |
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NOJB226M010RWB |
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-55°C ~ 105°C |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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OxiCap |
22µF |
±20% |
6% |
B |
- |
1411 (3528 Metric), 1210 |
1210(3528 公制) |
1411 (3528 Metric), 1210 |
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18 周 |
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NOJD107M006RWJ |
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表面贴装 |
7343-31 |
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- |
- |
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±20% |
6% |
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7.3 x 4.3 x 2.9 mm |
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- |
- |
- |
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105°C |
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-55°C |
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400mΩ |
12 μA |
铌 |
13V |
4.4mm |
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CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
6mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520K50.0000C10E00 |
KC2520K,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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L06032R7CGWTR |
Accu-L® |
薄膜 |
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表面贴装 |
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- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
750mA |
- |
无屏蔽 |
80 毫欧最大 |
21 @ 450MHz |
9GHz |
0603(1608 公制) |
2.7nH |
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±0.2nH |
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0603(1608 Metric) |
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9 周 |
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PBRV12.00MR50Y000 |
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±0.5% |
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表面贴装 |
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- |
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4.5 x 2 x 1.2 mm |
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SMT |
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12MHz |
±0.1% |
3 |
1.2 mm |
4.5 mm |
125 °C |
2 mm |
-40 °C |
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CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
18mA |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
KC3225K66.6667C1GE00 |
KC3225K,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CMOS |
1.6 V ~ 3.63 V |
0.028"(0.70mm) |
5mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520B40.0000C1GE00 |
KC2520B-C1,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CMOS |
3.3V |
0.071"(1.80mm) |
10mA |
0.276" 长 x 0.197" 宽(7.00mm x 5.00mm) |
KC7050A16.3840C3GE00 |
KC7050A-C3,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CX3225SB25000D0FFFCC |
CX3225SB,Kyocera |
MHz 晶体 |
25MHz |
±10ppm |
8pF |
50 欧姆 |
基谐 |
-20°C ~ 70°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.024"(0.60mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±10ppm |
AEC-Q200 |
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CX3225GB18432D0HPQCC |
CX3225GB,Kyocera |
MHz 晶体 |
18.432MHz |
±20ppm |
8pF |
80 欧姆 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
剪切带(CT) |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
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