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L06038R2CGSTR |
Accu-L® |
薄膜 |
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表面贴装 |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
300mA |
- |
无屏蔽 |
350 毫欧最大 |
23 @ 450MHz |
3.8GHz |
0603(1608 公制) |
8.2nH |
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±0.2nH |
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0603(1608 Metric) |
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9 周 |
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L08051R8CEWTR |
Accu-L® |
薄膜 |
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表面贴装 |
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- |
含铅/不符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
1A |
- |
无屏蔽 |
60 毫欧最大 |
50 @ 450MHz |
10GHz |
0805(2012 公制) |
1.8nH |
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±0.2nH |
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0805(2012 公制) |
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9 周 |
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ML03V12R5BAT2A |
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表面贴装 |
0603 (1608M) |
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- |
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-0.1 → 0.1pF |
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1.6 x 0.838 x 0.635 mm |
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0±30ppm/°C |
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0.64 mm |
1.6 mm |
125°C |
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-55°C |
2.5 pF |
250 V 直流 |
聚合体 |
-55 → 125°C |
0.84 mm |
-0.1pF |
0.1pF |
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CX3225GB24000P0HPQCC |
CX3225GB,Kyocera |
MHz 晶体 |
24MHz |
±20ppm |
18pF |
60 欧姆 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
剪切带(CT) |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
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NOSV477M006R0075 |
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-55°C ~ 125°C |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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OxiCap |
470µF |
±20% |
12% |
V |
低 ESR |
2924(7361 公制) |
2924(7361 公制) |
2924(7361 公制) |
24 周 |
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NOSC686M006R0075 |
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-55°C ~ 125°C |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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OxiCap |
68µF |
±20% |
6% |
C |
低 ESR |
2312(6032 公制) |
2312(6032 公制) |
2312(6032 公制) |
14 周 |
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CMOS |
1.6 V ~ 3.63 V |
0.028"(0.70mm) |
6mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520B48.0000C10E00 |
KC2520B-C1,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CMOS |
1.8V |
0.028"(0.70mm) |
3.5mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520C40.0000C1YE00 |
KC2520C-C1,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±10ppm |
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4-SMD,无引线 |
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CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
30mA |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032A80.0000C10E00 |
KC5032A-C1,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CMOS |
2.25 V ~ 3.63 V |
0.028"(0.70mm) |
3.5mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520B4.09600C2GE00 |
KC2520B-C2,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
6mA |
0.079" 长 x 0.063" 宽(2.00mm x 1.60mm) |
MC2016K48.0000C16ESH |
MC2016K,Kyocera |
XO(标准) |
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-40°C ~ 105°C |
表面贴装 |
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剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
- |
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4-SMD,无引线 |
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ML03V12R1BAT2A |
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表面贴装 |
0603 (1608M) |
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- |
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±0.1pF |
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1.6 x 0.838 x 0.635 mm |
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0±30ppm/°C |
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0.64 mm |
1.6 mm |
125°C |
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-55°C |
2.1 pF |
250 V 直流 |
聚合体 |
-55 → 125°C |
0.84 mm |
-0.1pF |
0.1pF |
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CMOS |
1.6 V ~ 3.63 V |
0.032"(0.80mm) |
3.5mA |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
KC2520K1.84320C10E00 |
KC2520K,Kyocera |
XO(标准) |
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-10°C ~ 70°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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HLQ022R0BTTR |
MLO™ |
多层 |
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表面贴装 |
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- |
符合限制有害物质指令(RoHS)规范要求 |
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- |
无磁性 |
245mA |
- |
无屏蔽 |
180 毫欧最大 |
17 @ 450MHz |
7GHz |
0402(1005 公制) |
2nH |
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±0.1nH |
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0402(1005 公制) |
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12 周 |
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PBRC2.00GR50X000 |
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±0.5% |
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表面贴装 |
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- |
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7.4 x 3.4 x 2 mm |
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SMT |
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2MHz |
±0.5% |
2 |
2 mm |
7.4 mm |
85 °C |
3.4 mm |
-40 °C |
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CX2520DB32000D0WZRC1 |
CX2520DB,Kyocera |
MHz 晶体 |
32MHz |
±25ppm |
8pF |
50 欧姆 |
基谐 |
-25°C ~ 75°C |
表面贴装 |
4-SMD,无引线 |
0.098" 长 x 0.079" 宽(2.50mm x 2.00mm) |
0.022"(0.55mm) |
剪切带(CT) |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
AEC-Q200 |
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CX3225GB14318D0HPQCC |
CX3225GB,Kyocera |
MHz 晶体 |
14.31818MHz |
±20ppm |
8pF |
100 欧姆 |
基谐 |
-40°C ~ 85°C |
表面贴装 |
4-SMD,无引线 |
0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) |
0.035"(0.90mm) |
剪切带(CT) |
- |
含铅/符合限制有害物质指令(RoHS)规范要求 |
±30ppm |
- |
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NOJT106M004RWJ |
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-55°C ~ 105°C |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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OxiCap |
10µF |
±20% |
6% |
T |
- |
1411 (3528 Metric), 1210 |
1210(3528 公制) |
1411 (3528 Metric), 1210 |
14 周 |
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W2F15C1038AT1F |
W2F |
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-55°C ~ 125°C |
表面贴装 |
0805(2012 公制),4 PC 板 |
0.079" 长 x 0.049" 宽(2.01mm x 1.25mm) |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
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AEC-Q200 |
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-20%, 50% |
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12 周 |
50V |
300mA |
600 毫欧 |
- |
X7R |
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CMOS |
1.6 V ~ 3.63 V |
0.047"(1.20mm) |
6mA |
0.197" 长 x 0.126" 宽(5.00mm x 3.20mm) |
KC5032K16.3840C1GE00 |
KC5032K,Kyocera |
XO(标准) |
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-40°C ~ 85°C |
表面贴装 |
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标准卷带 |
- |
符合限制有害物质指令(RoHS)规范要求 |
±50ppm |
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4-SMD,无引线 |
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