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- |
数字,本地 |
-40°C ~ 125°C |
- |
13 b |
关断模式,待机模式 |
±2°C(±3°C) |
0°C ~ 70°C(-40°C ~ 125°C) |
SOT-23-6 |
ADT7302ARTZ-REEL7 |
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SPI |
|
-40°C ~ 125°C |
表面贴装型 |
SOT-23-6 |
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卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
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2.7V ~ 5.25V |
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- |
模拟,本地 |
10°C ~ 125°C |
- |
10mV/°C |
关断模式 |
±3°C(±4°C) |
25°C(10°C ~ 125°C) |
TO-226-3,TO-92-3 标准主体(!--TO-226AA) |
TMP35GT9Z |
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模拟电压 |
|
-40°C ~ 150°C |
通孔 |
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散装 |
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- |
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可调带宽 |
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14-VFLGA |
ADXL343BCCZ-RL |
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±2g,4g,8g,16g |
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|
0.05Hz ~ 1.6kHz |
I²C,SPI |
|
-40°C ~ 85°C(TA) |
表面贴装型 |
14-LGA(3x5) |
|
卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
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数字 |
X,Y,Z |
256(±2g)~ 32(±16g) |
- |
2V ~ 3.6V |
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- |
数字,本地/远程 |
-40°C ~ 125°C |
-40°C ~ 125°C |
11 b(本地),8 b(远程) |
单触发,输出开关,可编程极限,待机模式 |
±2.5°C(±3.5°C) |
60°C ~ 100°C(0°C ~ 125°C) |
16-TSSOP(0.173\,4.40mm 宽) |
MAX6698UE34 |
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SMBus |
|
-40°C ~ 125°C |
表面贴装型 |
16-TSSOP |
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管件 |
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3V ~ 5.5V |
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-40°C ~ 120°C |
DSP,I²C,MICROWIRE,QSPI,SMBus,SPI |
±0.5°C |
否 |
板,电缆 |
ADT7411 |
- |
温度 |
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EVAL-ADT7411EBZ |
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- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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- |
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可调带宽 |
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16-LQFN 裸露焊盘,CSP |
ADXL325BCPZ-RL |
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±5g |
|
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1.6kHz(X,Y),550Hz(Z) |
模拟电压 |
|
-40°C ~ 85°C(TA) |
表面贴装型 |
16-LFCSP-LQ(4x4) |
|
卷带(TR) |
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模拟 |
X,Y,Z |
- |
174 |
1.8V ~ 3.6V |
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- |
数字,本地/远程 |
-40°C ~ 125°C |
-40°C ~ 125°C |
11 b(本地),8 b(远程) |
单触发,输出开关,可编程极限,关断模式,待机模式 |
-3.3°C,0.7°C(-5°C,1°C) |
60°C ~ 100°C(0°C ~ 125°C) |
20-TSSOP(0.173\,4.40mm 宽) |
MAX6689UP9A |
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SMBus |
|
-40°C ~ 125°C |
表面贴装型 |
20-TSSOP |
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管件 |
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3V ~ 5.5V |
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ADIS16240ABCZ |
iMEMS |
数字 |
X,Y,Z |
±19g |
51.4 |
- |
1.6kHz(X,Y),550Hz(Z) |
SPI |
可选量程,睡眠模式,温度传感器 |
-40°C ~ 85°C(TA) |
表面贴装 |
112-PBGA(12x12) |
112-BBGA |
托盘 |
- |
符合限制有害物质指令(RoHS)规范要求 |
13 周 |
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±2g,8g |
模拟 |
- |
- |
板 |
ADXL354 |
- |
加速计,3 轴 |
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EVAL-ADXL354CZ |
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- |
符合限制有害物质指令(RoHS)规范要求 |
8 周 |
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- |
数字,本地 |
-55°C ~ 125°C |
- |
11 b |
输出开关,可编程极限,可编程分辨率,关断模式,待机模式 |
±2°C(±3°C) |
-25°C ~ 100°C(-55°C ~ 125°C) |
8-TSSOP,8-MSOP(0.118\,3.00mm 宽) |
DS75LVU T |
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I²C |
|
-55°C ~ 125°C |
表面贴装型 |
8-uMAX/uSOP |
|
卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
|
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1.7V ~ 3.7V |
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TMP05BRTZ-500RL7 |
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CMOS、TTL |
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表面贴装 |
|
SOT-23 |
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±1°C |
数字 PWM |
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|
|
温度 |
5 |
-40 → 150 °C |
-40 °C |
150 °C |
3 V |
5.5 V |
3mm |
1.3mm |
1.7mm |
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- |
数字,本地 |
-40°C ~ 100°C |
- |
- |
单触发 |
±4°C(±5°C) |
-25°C ~ 100°C(-40°C ~ -25°C) |
8-SOIC(0.154",3.90mm 宽) |
TMP03FSZ |
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PWM |
|
-55°C ~ 150°C |
表面贴装 |
|
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管件 |
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Automotive |
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- |
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32-LFQFN 裸露焊盘,CSP |
ADXL312WACPZ-RL |
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|
|
±1.5g,3g,6g,12g |
|
|
3.125Hz ~ 1.6kHz |
I²C,SPI |
|
-40°C ~ 105°C |
表面贴装型 |
32-LFCSP-LQ(5x5) |
|
卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
|
|
|
|
|
数字 |
X |
345(±1.5g)~ 43(±12g) |
- |
2V ~ 3.6V |
|
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- |
模拟,本地 |
-55°C ~ 150°C |
- |
- |
- |
±2.5°C |
25°C |
2-CFlatPack |
AD590KF |
|
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|
|
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模拟电流 |
|
-55°C ~ 125°C |
表面贴装型 |
2-CeramicFlatpack |
|
托盘 |
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4V ~ 30V |
|
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|
- |
- |
- |
- |
板 |
ADF7023,ADF7024,ADP160,ADP5090,ADT75,ADUCRF101,ADXL362 |
- |
加速计,湿度,光学,温度 |
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|
EV-ADRN-WSN-1Z |
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- |
符合限制有害物质指令(RoHS)规范要求 |
|
|
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|
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|
- |
数字,本地 |
-55°C ~ 125°C |
- |
11 b |
输出开关,可编程极限,可编程分辨率,关断模式,待机模式 |
±2°C(±3°C) |
-25°C ~ 100°C(-55°C ~ 125°C) |
8-TSSOP,8-MSOP(0.118\,3.00mm 宽) |
DS75LVU |
|
|
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|
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|
|
I²C |
|
-55°C ~ 125°C |
表面贴装型 |
8-uMAX/uSOP |
|
管件 |
|
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|
|
1.7V ~ 3.7V |
|
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|
TMP05BKSZ-500RL7 |
|
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|
|
CMOS、TTL |
|
|
表面贴装 |
|
SC-70 |
|
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|
|
±1°C |
数字 PWM |
|
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|
|
|
温度 |
5 |
-40 至 150 °c |
-40 °C |
150 °C |
3 V |
5.5 V |
2.2mm |
1mm |
1.35mm |
|
|
|
|
|
|
|
- |
模拟,本地 |
-40°C ~ 125°C |
- |
10mV/°C |
关断模式 |
±3°C(±4°C) |
25°C(-40°C ~ 125°C) |
8-SOIC(0.154",3.90mm 宽) |
TMP36GSZ-REEL7 |
|
|
|
|
|
|
|
模拟电压 |
|
-40°C ~ 150°C |
表面贴装 |
|
|
剪切带(CT) |
|
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|
- |
|
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|
|
- |
|
|
32-FQFN 裸露焊盘,CSP |
ADXL1001BCPZ-RL |
|
|
|
±100g |
|
|
21kHz |
模拟电压 |
|
-40°C ~ 125°C |
表面贴装型 |
32-LFCSP(5x5) |
|
卷带(TR),剪切带(CT),Digi-Reel® 得捷定制卷带 |
|
|
|
|
|
模拟 |
X |
- |
20 |
3.3V ~ 5.25V |
|
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|
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|
|
|
|
|
|
|
|
|
|
- |
数字,本地/远程 |
-40°C ~ 125°C |
-40°C ~ 125°C |
10 b |
单触发,输出开关,可编程极限,待机模式 |
±3.8°C(±4.4°C) |
45°C ~ 85°C(-40°C ~ 125°C) |
10-TFSOP,10-MSOP(0.118\,3.00mm 宽) |
MAX6695YAUB |
|
|
|
|
|
|
|
I²C/SMBus |
|
-40°C ~ 125°C |
表面贴装型 |
10-uMAX/uSOP |
|
管件 |
|
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|
|
|
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|
|
3V ~ 3.6V |
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